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    BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT
    2.
    发明申请
    BUILD-UP PRINTED WIRING BOARD SUBSTRATE HAVING A CORE LAYER THAT IS PART OF A CIRCUIT 审中-公开
    具有作为电路部分的芯层的建筑印刷布线基板

    公开(公告)号：WO2008008552A3

    公开(公告)日：2009-01-08

    申请号：PCT/US2007016210

    申请日：2007-07-16

    Applicant: STABLCOR INC ,  VASOYA KALU K

    Inventor： VASOYA KALU K

    IPC: H01R12/04 ,  H05K1/11 ,  H05K3/36

    CPC classification number: H05K3/4608 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/0366 ,  H05K1/11 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/0959 ,  H01L2224/0401

    Abstract: Integrated circuits and processes for manufacturing integrated circuits are described that use printed wiring board substrates (200) having a core layer (10) that is part of the circuit of the printed wiring board. In a number of embodiments, the core layer is constructed from a carbon composite. In several embodiments, techniques are described for increasing the integrity of core layers in designs calling for high density clearance hole (25) drilling. One embodiment of the invention includes a core layer that includes electrically conductive material and at least one build-up wiring portion formed on an outer surface of the core layer. In addition, the build-up portion comprises at least one micro wiring layer (36) including a circuit that is electrically connected to the electrically conductive material in the core layer via a plated through hole (45).

    Abstract translation: 描述了用于制造集成电路的集成电路和工艺，其使用具有作为印刷线路板的电路的一部分的芯层（10）的印刷线路板基板（200）。 在多个实施例中，芯层由碳复合材料构成。 在几个实施例中，描述了在要求高密度间隙孔（25）钻孔的设计中增加芯层的完整性的技术。 本发明的一个实施例包括芯层，其包括导电材料和形成在芯层的外表面上的至少一个堆积布线部分。 此外，积聚部分包括至少一个微布线层（36），其包括电路，该电路通过电镀通孔（45）电连接到芯层中的导电材料。

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