公开(公告)号：US11653444B2

公开(公告)日：2023-05-16

申请号：US17439326

申请日：2020-03-19

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Naoko Okimoto ,  Mitsutaka Nagae ,  Kenichi Ogawa ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0283 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0162

Abstract: A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.

公开(公告)号：US20180303418A1

公开(公告)日：2018-10-25

申请号：US15861257

申请日：2018-01-03

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. ROGERS ,  Ming YING ,  Andrew BONIFAS ,  Nanshu LU

IPC: A61B5/00 ,  A61B5/01 ,  A61B42/10 ,  H05K3/30 ,  H05K1/18 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  A61N1/04

CPC classification number: A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0209 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US20180277970A1

公开(公告)日：2018-09-27

申请号：US15923490

申请日：2018-03-16

Applicant: Verily Life Sciences LLC

Inventor： Kedar Shah

IPC: H01R12/52 ,  H01R13/24 ,  H01R13/52 ,  H01R43/20 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00 ,  H05K3/40 ,  H05K3/36 ,  A61B5/00 ,  A61B5/04 ,  A61B17/34 ,  A61N1/05

CPC classification number: H01R12/52 ,  A61B5/0031 ,  A61B5/04001 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/6846 ,  A61B5/686 ,  A61B17/3468 ,  A61B2560/063 ,  A61B2562/0209 ,  A61B2562/16 ,  A61B2562/227 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/3752 ,  A61N1/3754 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R13/521 ,  H01R13/5219 ,  H01R43/205 ,  H01R2201/12 ,  H05K1/02 ,  H05K1/112 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4038 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/0095 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/09163 ,  H05K2201/09409 ,  H05K2201/10265 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An implantable connector for connecting an electronics package and a neural interface is described. The connection between the electronics package and the neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

公开(公告)号：US20180263136A1

公开(公告)日：2018-09-13

申请号：US15456490

申请日：2017-03-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Rohit Koppal ,  Chandra Subba

IPC: H05K7/14 ,  H05K5/00

CPC classification number: H05K1/181 ,  F16B5/0241 ,  F16B5/025 ,  F16B5/065 ,  F16B33/006 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0314 ,  H05K2201/10189

Abstract: Devices having flexible or rotatable connectors between two components of an electronic device are described herein. The device may include a support structure and a plurality of connectors affixed to a surface of the support structure. The connectors are configured to connect the support structure with a component of an electronic device. Additionally, when the surface of the support structure is non-planar, each connector is configured to bend or rotate to maintain the connected component within a same plane.

公开(公告)号：US10052066B2

公开(公告)日：2018-08-21

申请号：US15375514

申请日：2016-12-12

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. Rogers ,  Ming Ying ,  Andrew Bonifas ,  Nanshu Lu

IPC: H05K1/00 ,  A61B5/00 ,  A61B42/10 ,  A61N1/04 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  A61B5/01

CPC classification number: A61B5/6806 ,  A41D19/015 ,  A61B5/01 ,  A61B5/1125 ,  A61B5/483 ,  A61B5/4875 ,  A61B5/6826 ,  A61B5/6843 ,  A61B5/7455 ,  A61B34/35 ,  A61B34/76 ,  A61B42/10 ,  A61B2034/741 ,  A61B2505/05 ,  A61B2562/0233 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/029 ,  A61B2562/046 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/227 ,  A61N1/0456 ,  A61N1/0476 ,  H01L23/5388 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/303 ,  H05K7/02 ,  H05K2201/0133 ,  H05K2201/055 ,  H05K2201/10098 ,  H05K2201/10151 ,  Y10T29/49124 ,  H01L2924/00

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

公开(公告)号：US20180192520A1

公开(公告)日：2018-07-05

申请号：US15394501

申请日：2016-12-29

Applicant: INTEL CORPORATION

Inventor： Chwee Lin CHOONG ,  Kheng Tat MAR

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K1/14 ,  H01L23/498 ,  H01L23/31 ,  H05K3/28 ,  H01L21/56 ,  H05K3/32 ,  H01L21/48

CPC classification number: H05K1/189 ,  H01L21/4846 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/4985 ,  H05K1/0283 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A microelectronic device system and a method of forming a microelectronic device are described. The microelectronic device includes a flex printed circuit board (PCB) having two or more electrical sub-systems that are electrically coupled by a plurality of conductive traces, where the flex PCB may be a buckled flex PCB. The microelectronic device includes a plurality of anchoring sites formed on a backside surface of the flex PCB. The microelectronic device encapsulates an elastomer over the flex PCB, the electrical sub-systems, and the conductive traces. The microelectronic device may stretch in a unidirectional and bidirectional axis. The microelectronic device may have electronic components attached to the electrical sub-systems. The microelectronic device may have stretchable segments where each of the stretchable segments is formed between a pair of anchoring sites. The microelectronic device may have three-dimensional (3D) conductive traces, where the 3D conductive traces are 3D meandering traces.

公开(公告)号：US20180186133A1

公开(公告)日：2018-07-05

申请号：US15448597

申请日：2017-03-03

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Hsiu-Chu Wu ,  Meng-Cheng Tsai ,  Chung-Hsiao Lai

IPC: B32B27/28 ,  C09J183/00 ,  H05K1/03

CPC classification number: B32B27/28 ,  C09J183/04 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0162 ,  C08L67/00 ,  C08K5/5435

Abstract: An adhesive composition is provided. The adhesive composition includes an organic silicon polymer, a silicon coupling agent, carboxylic polyester, and a solvent. Based on the total weight of the adhesive composition, the content of the organic silicon polymer is 10 wt % to 60 wt %, the content of the silicon coupling agent is 10 wt % to 60 wt %, and the content of the carboxylic polyester is 10 wt % to 60 wt %.

公开(公告)号：US20180179424A1

公开(公告)日：2018-06-28

申请号：US15656652

申请日：2017-07-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jyh-Long JENG ,  Jeng-Yu TSAI ,  Hsi-Yi CHIN ,  Wei-Ta YANG

IPC: C09J171/12 ,  C09J153/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  B32B7/12 ,  B32B15/08

CPC classification number: C09J171/12 ,  B32B7/12 ,  B32B15/08 ,  B32B2457/08 ,  C08F283/06 ,  C08F287/00 ,  C08F290/062 ,  C08G59/5073 ,  C09J151/085 ,  C09J153/00 ,  C09J153/005 ,  H05K1/028 ,  H05K1/032 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  C08L53/02 ,  C08L63/00 ,  C08F220/40

Abstract: An adhesive composition and a composite substrate employing the same are provided. The adhesive composition includes a compound having a structure represented by Formula (I) (Z—Y3X  Formula (I) , wherein X is R can be hydrogen, or C1-6 alkyl group; each Y can be independently a moiety polymerized by at least two different phenol-based compounds; and each Z can be independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group; a thermoplastic elastomer; an epoxy resin; and a bismaleimide.

公开(公告)号：US09894761B2

公开(公告)日：2018-02-13

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Hoshi ,  Takeshi Kitamura ,  Keiko Kashihara ,  Hiroharu Inoue

IPC: H05K1/03 ,  H05K1/02 ,  C08J5/24 ,  C08G59/62 ,  C08L63/00

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

公开(公告)号：US09841548B2

公开(公告)日：2017-12-12

申请号：US15068372

申请日：2016-03-11

Applicant: Apple Inc.

Inventor： Hoon Sik Kim ,  Yung-Yu Hsu ,  Paul S. Drzaic ,  Luisa Petti

IPC: H05K1/00 ,  H01L51/00 ,  H01L33/00 ,  F21V8/00 ,  G06F1/16

CPC classification number: G02B6/0041 ,  G02B6/00 ,  G02B6/0021 ,  G02B6/0036 ,  G02B6/006 ,  G02B6/0065 ,  G02B6/0068 ,  G02B6/0073 ,  G06F1/1643 ,  G06F1/1652 ,  G06F2203/04102 ,  G06F2203/04106 ,  G06F2203/04109 ,  H01L23/5387 ,  H01L51/0097 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/0283 ,  H05K1/0287 ,  H05K1/141 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10378

Abstract: An electronic device may have control circuitry coupled to input-output devices such as a display. A flexible input-output device may be formed from an elastomeric substrate layer. The substrate layer may have signal paths to which components are mounted. Openings may be formed in the elastomeric substrate layer between the signal paths to create a stretchable mesh-shaped substrate. The electrical components may each include an interposer having solder pads soldered to the elastomeric substrate. Electrical devices such as micro-light-emitting diodes may be soldered to the interposers. The electrical components may also include electrical devices such as sensors and actuators. A stretchable lighting unit may have a stretchable light guide illuminated by a stretchable light source.