公开(公告)号：US20240334603A1

公开(公告)日：2024-10-03

申请号：US18672676

申请日：2024-05-23

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren XIONG ,  Fan LI ,  Qiang TANG ,  Fei SHANG ,  Haijun QIU ,  Yuanyuan CHAI ,  Huiqiang SONG

IPC: H05K1/11 ,  G06F3/041 ,  G06F3/044 ,  H01R12/61 ,  H05K1/18 ,  H05K3/36 ,  H10K59/131 ,  H10K59/179

CPC classification number: H05K1/118 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  H01R12/61 ,  H05K3/363 ,  G06F3/04164 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09481 ,  H05K2201/10128 ,  H10K59/131 ,  H10K59/179

Abstract: A display device is provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

公开(公告)号：US11974388B2

公开(公告)日：2024-04-30

申请号：US17310657

申请日：2020-02-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Byeong Kyun Choi ,  Min Young Hwang ,  Hyun Gu Im

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0237 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/036 ,  H05K2201/09481

Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.

公开(公告)号：US11963289B2

公开(公告)日：2024-04-16

申请号：US17724376

申请日：2022-04-19

Applicant: DELL PRODUCTS L.P.

Inventor： Sandor Farkas ,  Mark Smith ,  Bhyrav Mutnury

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0218 ,  H05K1/0203 ,  H05K1/115 ,  H05K2201/09481

Abstract: A printed circuit board (PCB) includes an array of signal pads on a first surface of the PCB, a power contact pad on the first surface, and a ground contact pad on a second surface of the PCB. Each signal pad of the array of signal pads is associated with a signal contact of a central processing unit (CPU). The power contact pad provides power for the CPU apart from the array of signal pads. The ground contact pad provides a ground for the CPU apart from the array of signal pads.

公开(公告)号：US20240074050A1

公开(公告)日：2024-02-29

申请号：US18203294

申请日：2023-05-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jun Ki Min ,  Seong Ho Choi

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/111 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/09036 ,  H05K2201/09481

Abstract: A printed circuit board according to an embodiment includes: an insulation layer including a recess portion; and a connection pad disposed on the recess portion of the insulation layer and protruded from the recess portion, wherein the connection pad may include a protrusion and a concave portion that is lower than the protrusion, and a surface height of the protrusion of the connection pad may be substantially the same as or less than a surface height of the insulation layer.

公开(公告)号：US11864316B2

公开(公告)日：2024-01-02

申请号：US17630630

申请日：2021-07-16

Applicant: Fujikura Ltd.

Inventor： Naoki Oyaizu ,  Yusuke Fujita ,  Toshiaki Inoue ,  Shinya Kashima

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H05K2201/0305 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/09563

Abstract: A wiring substrate includes a first insulating layer, a first conductor layer, and a plurality of filled vias. The first insulating layer has a first surface and a second surface positioned on a side opposite to the first surface. The first conductor layer is formed on the first surface of the first insulating layer. The plurality of filled vias are formed inside the first insulating layer. The plurality of filled vias each have a structure in which a via hole penetrating the first insulating layer is filled with a metal. The first conductor layer includes a pad. The pad overlaps the plurality of filled vias in a plan view from a thickness direction of the first insulating layer and is connected to the plurality of filled vias.

公开(公告)号：US11647581B2

公开(公告)日：2023-05-09

申请号：US16903694

申请日：2020-06-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuki Takemori

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/28 ,  B32B3/26 ,  B32B15/04 ,  B32B3/30 ,  B32B9/00 ,  B32B9/04 ,  H05K1/02 ,  H05K3/34 ,  H05K3/46 ,  H05K3/24

CPC classification number: H05K1/0306 ,  B32B3/263 ,  B32B3/266 ,  B32B3/30 ,  B32B9/005 ,  B32B9/043 ,  B32B15/04 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/285 ,  H05K3/34 ,  H05K3/4644 ,  H05K3/244 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/099 ,  H05K2201/0969 ,  H05K2201/09145 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/1131 ,  Y10T428/12201 ,  Y10T428/12361 ,  Y10T428/24273 ,  Y10T428/24331

Abstract: A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

公开(公告)号：US20180110122A1

公开(公告)日：2018-04-19

申请号：US15671819

申请日：2017-08-08

Applicant: Samsung Display Co., Ltd.

Inventor： Young Hoon LEE

IPC: H05K1/14 ,  H01L27/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/14 ,  H01L27/124 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/113 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09709

Abstract: A display device includes: a substrate including a display area positioned on a first surface and displaying an image and a peripheral area positioned around the display area; a first pad portion disposed on a second surface of the substrate as a surface opposite to the first surface of the substrate; a plurality of through-holes disposed on the peripheral area and penetrating the substrate; a plurality of connection wires disposed on the peripheral area and connecting the display area and the first pad portion through the plurality of through-holes; and a printed circuit board including a second pad portion coupled with the first pad portion.

公开(公告)号：US09913382B2

公开(公告)日：2018-03-06

申请号：US14694756

申请日：2015-04-23

Applicant: Viasystems Technologies Corp., L.L.C.

Inventor： Rajwant Sidhu ,  Ruben Zepeda

IPC: H05K3/00 ,  H05K3/42 ,  H05K1/11 ,  H05K3/06

CPC classification number: H05K3/0094 ,  H05K1/113 ,  H05K3/064 ,  H05K3/422 ,  H05K3/423 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/095

Abstract: The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.

公开(公告)号：US09913364B2

公开(公告)日：2018-03-06

申请号：US15461618

申请日：2017-03-17

Applicant: JAHWA electronics Co., Ltd.

Inventor： Chun Choi ,  Soon Koo Shim ,  Young Bin Chong ,  Nam Jin Choi ,  Won Gook Lee ,  Min Goo Lee ,  Kyung Hoon Jo

IPC: H01L23/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0216 ,  B06B1/0207 ,  B06B1/045 ,  H02K11/02 ,  H02K33/16 ,  H02K2211/03 ,  H05K1/09 ,  H05K1/112 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09481 ,  H05K2201/09672

Abstract: A printed circuit board includes a pad to receive an electric signal from a controller, a plurality of signal lines connected to the pad to transmit the electric signal received at the pad, and a signal transmission unit connected to the signal lines to transmit the electric signal to a coil. The plurality of signal lines are configured to face each other in at least a partial region and/or disposed in a zigzag form in at least a partial region. If the printed circuit board and a vibration actuator including the printed circuit board are used, it is possible to change a high frequency interference region according to a pattern by changing a pattern of the printed circuit board, and to improve receiving efficiency of an antenna by reducing high frequency noise.

公开(公告)号：US20180063970A1

公开(公告)日：2018-03-01

申请号：US15676332

申请日：2017-08-14

Applicant: Samsung Display Co., Ltd.

Inventor： Seung-Hwa HA ,  Jeong Do YANG ,  Jung Yun JO ,  Jeong Ho HWANG

IPC: H05K5/00 ,  G01R31/28 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K5/0017 ,  G01R31/2818 ,  G02F1/1309 ,  G02F1/13452 ,  G02F1/13458 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K1/181 ,  H05K3/361 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10954

Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.