公开(公告)号：US20240305184A1

公开(公告)日：2024-09-12

申请号：US18613197

申请日：2024-03-22

Applicant: SCHNEIDER ELECTRIC IT CORPORATION

Inventor： Indra Prakash ,  Roger Franchino ,  Damir Klikic

IPC: H02M1/08 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32

CPC classification number: H02M1/08 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/32 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: According to one aspect, embodiments of the invention provide an electrical-converter system comprising a printed circuit board including at least a first layer and a second layer, a switching node disposed on the second layer, a first transistor, a second transistor, a third transistor, and a fourth transistor disposed on the first layer, a first conduction path from a source of the first transistor, through the switching node, to a drain of the fourth transistor, the first conduction path having a first length, and a second conduction path from the source of the first transistor, through the switching node, to a drain of the second transistor, the second conduction path having a second length, wherein the first length of the first conduction path is greater than the second length of the second conduction path.

公开(公告)号：US20240290763A1

公开(公告)日：2024-08-29

申请号：US18659676

申请日：2024-05-09

Applicant: Google LLC

Inventor： Houle Gan ,  Richard Stuart Roy ,  Yujeong Shim ,  William F. Edwards, JR. ,  Chenhao Nan

IPC: H01L25/16 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01L25/162 ,  H05K1/11 ,  H05K1/183 ,  H01L24/16 ,  H01L2224/16225 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10704 ,  H05K2201/10719

Abstract: A pluggable processor module includes a microprocessor package, a voltage regulator including a capacitor board, and contact pads that each include a first side in contact with the microprocessor package and a second side in contact with the capacitor board.

公开(公告)号：US12046576B2

公开(公告)日：2024-07-23

申请号：US17435752

申请日：2020-02-27

Applicant: DANFOSS SILICON POWER GMBH

Inventor： Martin Becker ,  Dirk Dittmann

IPC: H01L23/00 ,  H01L25/07 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01L24/95 ,  H01L24/75 ,  H01L24/83 ,  H05K3/32 ,  H01L24/29 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/75265 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2224/83222 ,  H01L2224/8384 ,  H01L2224/95001 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2203/0182 ,  H05K2203/0191 ,  H05K2203/1131 ,  H05K2203/1509 ,  H05K2203/1536

Abstract: A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

公开(公告)号：US12046531B2

公开(公告)日：2024-07-23

申请号：US17285295

申请日：2019-10-08

Applicant: Vitesco Technologies GmbH

Inventor： Detlev Bagung ,  Christina Quest-Matt ,  Thomas Riepl ,  Daniela Wolf

IPC: H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H05K3/34 ,  H01L23/495 ,  H05K1/18

CPC classification number: H01L23/3735 ,  H01L23/49838 ,  H05K3/341 ,  H01L23/49562 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10378

Abstract: A semiconductor component having at least one semiconductor component having a first electrical connector and at least one further electrical connector, a printed circuit board, and a prefabricated metal block group. The metal block group has a first metal block arranged between the semiconductor component and the printed circuit board, connected to a first electrical connector of the semiconductor component by a solder joint and connected to at least one conductor track of the printed circuit board by a further solder joint. The metal block group includes at least one further metal block interposed between the further electrical connection and the printed circuit board by a solder joint. The metal blocks of the prefabricated metal block group are arranged laterally next to one another and have their lateral outer surfaces partially or completely encased by an electrically insulating casing common to them.

公开(公告)号：US20240244750A1

公开(公告)日：2024-07-18

申请号：US18429848

申请日：2024-02-01

Applicant: ROHM CO., LTD.

Inventor： Masashi HAYASHIGUCHI

IPC: H05K1/14 ,  H01L23/00 ,  H01L23/40 ,  H01L23/498 ,  H01L25/11 ,  H01R12/71 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L25/115 ,  H05K1/18 ,  H01L23/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/40137 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48225 ,  H01R12/718 ,  H05K2201/10166 ,  H05K2201/10871

Abstract: A semiconductor module includes: a plurality of semiconductor devices that each include a signal terminal extending in a first direction, and that is electrically connected to a semiconductor element; a heat sink; a plurality of first wiring boards that are electrically connected to the plurality of signal terminals of the respective semiconductor devices; and a second wiring board electrically connected to the plurality of first wiring boards. The signal terminal of one of the plurality of semiconductor devices is press-fitted into one of the plurality of first wiring boards in the first direction. The semiconductor module further includes a plurality of communication wirings electrically connecting the plurality of first wiring boards and the second wiring board. The plurality of communication wirings are displaceable in a direction perpendicular to the first direction.

公开(公告)号：US20240223139A1

公开(公告)日：2024-07-04

申请号：US18391754

申请日：2023-12-21

Applicant: RADROCK (SHENZHEN) TECHNOLOGY CO., LTD

Inventor： Chuanqiu Lei ,  Yunlong Jiang ,  Kaiyao Yu ,  Yongjian Lei ,  Yuan Cao ,  Jianxing Ni

IPC: H03F3/24 ,  H05K1/02

CPC classification number: H03F3/245 ,  H05K1/0243 ,  H03F2200/09 ,  H05K2201/10166

Abstract: Disclosed is an RF module. The substrate includes a first layout area and a second layout area. The first RF chip is located in the first layout area, including a first power amplifier and a second power amplifier. The first switch chip is arranged in the first layout area and connected to the output ends of the first and second power amplifier. The second RF chip is arranged in second layout area, including a third power amplifier. The second switch chip is arranged in the second layout area and connected to the output end of the third power amplifier. The RF module shortens the transmission distance of RF signals between the first RF chip and first switch chip and between the second RF chip and second switch chip by arranging components in two areas separately, thus reducing the insertion loss and interference and improving the output quality of RF signals.

公开(公告)号：US12010799B2

公开(公告)日：2024-06-11

申请号：US16449761

申请日：2019-06-24

Applicant: Black & Decker Inc.

Inventor： Joshua M. Lewis ,  Michael D. Grove

IPC: H02K7/14 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K11/30 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/181 ,  B25B21/02 ,  B25F5/02 ,  H01H9/54 ,  H01H13/14 ,  H01H13/52 ,  H01H21/24 ,  H02K7/145 ,  H02K11/33 ,  H02K23/18 ,  H02M7/48 ,  H02P6/14 ,  H02P6/16 ,  H05K1/0206 ,  H05K1/112 ,  H05K1/115 ,  H05K7/2039 ,  H01H2013/525 ,  H01H2231/048 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10545

Abstract: An electronic module is provided including a circuit board defining a longitudinal axis and having a first surface and a second surface. A module housing is provided having a bottom surface and side walls extending from the bottom surface to form an open face through which the circuit board is received. Power switches configured as an inverter circuit to drive an electric motor are mounted on the second surface of the circuit board facing the bottom surface of the module housing, and a series of heat sinks are discretely mounted on the first surface of the circuit board facing the open face opposite the power switches. Potting material is disposed in the distance between the circuit board and the bottom surface of the module housing to cover the power switches. Thermal vias are disposed through the circuit board between corresponding ones of the heat sinks and the power switches.

公开(公告)号：US20240164069A1

公开(公告)日：2024-05-16

申请号：US18086062

申请日：2022-12-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yue-Zhen HUANG ,  Meng-Chi HUANG ,  Tune-Hune KAO ,  Min-Chieh CHOU ,  Jie-Chi CHEN

IPC: H05K7/20 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10166

Abstract: A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.

公开(公告)号：US11927431B1

公开(公告)日：2024-03-12

申请号：US16602843

申请日：2019-12-10

Applicant: Northrop Grumman Systems Corporation

Inventor： James D. Lucas ,  Eric M. McDonough

IPC: F42B3/12 ,  F42C11/04 ,  F42D1/05 ,  H01L23/498 ,  H05K1/18

CPC classification number: F42B3/124 ,  F42C11/04 ,  F42D1/05 ,  H01L23/49811 ,  H05K1/181 ,  F42B3/121 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: A capacitive discharge unit (CDU) for detonating an explosive in response to a control signal comprises a set of CDU components, including an exploding foil initiator (EFI), a trigger circuit, a firing capacitor, and an insulated-gate bipolar transistor (IGBT) firing switch. In various embodiments the components are arranged on a board for mechanically and electrically supporting the components in an ordered arrangement along a CDU axis where the CDU having an axial length defined by the ordered arrangement of two or more of the EFI, the firing capacitor, and the IBGT firing switch, wherein the trigger circuit is offset from the CDU axis such that the trigger circuit does not contribute to the axial length.

公开(公告)号：US11923125B2

公开(公告)日：2024-03-05

申请号：US17297395

申请日：2019-10-11

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Keiji Tashiro

IPC: H05K1/02 ,  H01F27/24 ,  H01F27/28 ,  H02M3/335 ,  H02M7/48 ,  H02M7/797 ,  H05K1/14 ,  H05K1/16 ,  H05K1/18 ,  B60L50/60 ,  H01R12/52 ,  H01R12/58

CPC classification number: H01F27/2804 ,  H02M3/33573 ,  H02M3/33576 ,  H05K1/144 ,  H05K1/165 ,  B60L50/60 ,  B60L2210/10 ,  H01F27/24 ,  H01F2027/2809 ,  H01R12/52 ,  H01R12/58 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166

Abstract: A power conversion device includes a multilayer board including conductive layers that form a primary-side coil and a secondary-side coil of a transformer; and a circuit board electrically connected to the multilayer board, having a first conversion circuit formed therein or thereon. The multilayer board includes a transformer region in which the transformer is formed; a core member disposed in the transformer region and around the primary-side coil and secondary-side coil are wound; a circuit formed region which is adjacent to the transformer region and a second conversion circuit is formed, the second conversion circuit being electrically connected to the primary-side coil or the secondary-side coil; and a terminal portion which is electrically connected to the secondary-side coil or the primary-side coil. The first conversion circuit is electrically connected to the transformer via the terminal portion. One of the coils has a smaller number of turns than the other coil.