公开(公告)号：US09491854B2

公开(公告)日：2016-11-08

申请号：US13865730

申请日：2013-04-18

Applicant: RAYTHEON COMPANY

Inventor： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC: H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, an interconnect assembly includes a first flat flexible layer having a signal conductor and a ground conductor forming a first microstripline or microstrip transmission line, a second folded flexible layer having a signal conductor and a ground conductor forming a second microstripline or microstrip transmission line, the bottom surface of the second folded flexible layer having ridge portions, a non-conductive adhesive layer disposed between the top surface of the first flat flexible layer and the ridge portions of the second folded flexible layer, a signal through-hole extending through the non-conductive adhesive layer and the first flat flexible layer, and two ground through-holes extending through the non-conductive adhesive layer and the second folded flexible layer, wherein the two ground through-holes are disposed on opposite sides of the signal through-hole.

Abstract translation: 提供多层微波波纹印刷电路板。 在一个实施例中，互连组件包括具有信号导体和形成第一微带或微带传输线的接地导体的第一扁平柔性层，具有信号导体的第二折叠柔性层和形成第二微带或微带传输的接地导体 具有脊部的第二折叠柔性层的底面，设置在第一平面柔性层的顶面与第二折叠柔性层的隆起部之间的非导电性粘合剂层，延伸穿过的信号通孔 非导电粘合剂层和第一平坦柔性层，以及延伸穿过非导电粘合剂层和第二折叠柔性层的两个接地通孔，其中两个接地通孔设置在信号通过的相对侧上 -孔。

公开(公告)号：US20160157360A1

公开(公告)日：2016-06-02

申请号：US14906850

申请日：2014-07-24

Applicant: LG CHEM, LTD.

Inventor： Ducksu OH ,  Sung Soo PARK ,  Minsoo KANG

IPC: H05K3/36 ,  H05K3/46

CPC classification number: H05K3/363 ,  H01L51/0097 ,  H01L51/5246 ,  H05K1/115 ,  H05K1/14 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/09563 ,  H05K2201/10128 ,  Y10T29/49128

Abstract: A method for manufacturing a structure of a flexible printed circuit board that is installed on a substrate in a display device is provided.

Abstract translation: 提供了一种制造安装在显示装置中的基板上的柔性印刷电路板的结构的方法。

公开(公告)号：US20160099738A1

公开(公告)日：2016-04-07

申请号：US14505348

申请日：2014-10-02

Applicant: Sony Corporation

Inventor： Kenichiro KODAMA

IPC: H04B1/3827

CPC classification number: H04B1/385 ,  G04G17/04 ,  G04R20/26 ,  G04R60/00 ,  G06F1/163 ,  G06F1/1698 ,  H01M2/1022 ,  H01M10/48 ,  H01Q1/243 ,  H01Q1/273 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q5/321 ,  H01Q21/28 ,  H04W88/06 ,  H05K1/147 ,  H05K2201/058

Abstract: A wireless communication apparatus, includes: a second circuit board; a wireless communication processing circuit accommodated in the second circuit board; a first signal line that connects a first ground potential portion of the first circuit board with a first antenna feed point of the wireless communication processing circuit, wherein the first signal line and the first ground potential portion are configured to operate as a first antenna; a second signal line that connects the first circuit board with the second circuit board and is configured to convey a baseband signal; and a circuit element that is connected to the second signal line and is configured to block RF signals that are sent and received by the wireless communication processing circuit.

Abstract translation: 一种无线通信装置，包括：第二电路板; 容纳在第二电路板中的无线通信处理电路; 第一信号线，其将所述第一电路板的第一接地电位部分与所述无线通信处理电路的第一天线馈电点连接，其中，所述第一信号线和所述第一接地电位部分被配置为用作第一天线; 第二信号线，其将所述第一电路板与所述第二电路板连接并且被配置为传送基带信号; 以及电路元件，其连接到所述第二信号线，并且被配置为阻止由所述无线通信处理电路发送和接收的RF信号。

公开(公告)号：US20160088724A1

公开(公告)日：2016-03-24

申请号：US14958006

申请日：2015-12-03

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： CHIH-HENG CHUO ,  GWUN-JIN LIN ,  KUO-FU SU

IPC: H05K1/02 ,  H01P3/02 ,  H05K1/11

CPC classification number: H05K1/0224 ,  H01P3/02 ,  H01P3/026 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K2201/058

Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.

Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。

公开(公告)号：US09226390B2

公开(公告)日：2015-12-29

申请号：US13822648

申请日：2011-09-14

Applicant: Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

Inventor： Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

IPC: H05K3/36 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0266 ,  H01L2224/2518 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/115 ,  H05K1/14 ,  H05K1/18 ,  H05K1/182 ,  H05K1/189 ,  H05K3/36 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0355 ,  H05K2201/058 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166 ,  Y10T29/49126

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract translation: 对于用于制造由多个电路板区域组成的电路板的方法，其中各电路板区域包括至少一层由绝缘基底材料制成的层和位于基底材料上的导电图案，下面是 提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分地与第一电路板区域重叠 第一电路板，附加电路板区域相对于对准标记定向，以及多个第一电路板区域和至少一个附加电路板区域的导电图案的连接。 因此，当电路板区域耦合时，可以实现改进的配准和取向。

公开(公告)号：US20150189765A1

公开(公告)日：2015-07-02

申请号：US14506251

申请日：2014-10-03

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: H05K3/36 ,  B23K37/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。

公开(公告)号：US20150156879A1

公开(公告)日：2015-06-04

申请号：US14539035

申请日：2014-11-12

Applicant: ZODIAC AERO ELECfRIC

Inventor： Vianney Pouget ,  Antonio Simao

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/148 ,  H05K1/028 ,  H05K1/11 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/047 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: This electronic circuit, includes a set of electronic boards intended to support components and linked together by joining elements. The joining elements include curved flexible printed circuits linking two opposing ends of two electronic boards running side by side, the said curved flexible printed circuits being foldable for erecting the electronic circuit into a volume so that the electronic circuit comprises electronic boards placed opposite one another.

Abstract translation: 该电子电路包括一组旨在支撑部件并通过连接元件连接在一起的电子板。 连接元件包括连接并排运行的两个电子板的两个相对端的弯曲柔性印刷电路，所述弯曲的柔性印刷电路可折叠，用于将电子电路竖立成体积，使得电子电路包括彼此相对放置的电子板。

公开(公告)号：US08998450B2

公开(公告)日：2015-04-07

申请号：US13384541

申请日：2010-06-16

Applicant: Thomas Preuschl

Inventor： Thomas Preuschl

IPC: F21S4/00 ,  F21V21/14 ,  H05K1/03 ,  H05K3/20 ,  H05K1/18 ,  F21Y111/00 ,  F21S8/08 ,  F21W131/103 ,  F21Y101/02 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/189 ,  F21S8/08 ,  F21W2131/103 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y10T29/49128 ,  Y10T156/10 ,  Y10T156/1002

Abstract: A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

Abstract translation: 一种光模块（1; 14），包括用于安装至少一个半导体源（5）的载体（8,10），特别是发光二极管，其中：所述载体（8,10）具有柔性印刷电路板 （10）中，柔性印刷电路板（10）面对至少一个基板（8）接合，并且载体（8,10）可以沿着至少一个预定弯曲线（3; 3a）弯曲 -3e），所述基板（8）可以沿着所述至少一条弯曲线（3,3a-3e）弯曲，所述基板（8）沿着所述弯曲线（3; 3a-3e）具有至少一个切口（9） 3a-3e）和柔性印刷电路板（10）具有至少一个穿过至少一个切口（9）的条带（11; 15）。

公开(公告)号：US20140328030A1

公开(公告)日：2014-11-06

申请号：US14260610

申请日：2014-04-24

Applicant: ROLLS-ROYCE PLC

Inventor： Paul BROUGHTON

IPC: H01B7/00 ,  H05K3/36

CPC classification number: H01B7/0045 ,  F02C7/32 ,  F05D2220/76 ,  F05D2260/30 ,  H01R12/52 ,  H01R12/613 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/058 ,  Y02T50/672 ,  Y10T29/49126

Abstract: An electrical connection between two electrical harnesses is provided. The electrical harnesses include flexible printed circuits with embedded conductive tracks, each of which terminates in a receiving hole in a respective terminating region The terminating regions are connected together using conductive pins. The connection formation is then encapsulated by an encapsulating body formed of an insulating. The encapsulating body seals and protects the electrical connection, which is thus reliable and robust.

Abstract translation: 提供两个电气线束之间的电气连接。 电气线束包括具有嵌入的导电轨道的柔性印刷电路，每个终端区域在相应终止区域中的接收孔中。终端区域使用导电引脚连接在一起。 连接形成然后由绝缘体形成的封装体封装。 封装体密封和保护电气连接，因此可靠和牢固。

公开(公告)号：US08650744B2

公开(公告)日：2014-02-18

申请号：US12707412

申请日：2010-02-17

Applicant: Michael N. Rosenblatt ,  Amir Salehi

Inventor： Michael N. Rosenblatt ,  Amir Salehi

IPC: B23P19/00 ,  H05K13/04

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/10393 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract translation: 提出了一种用于组装刚性柔性印刷电路板（PCB）的工艺。 在操作过程中，该过程接收要耦合在一起的刚性柔性PCB，其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后，该过程将PCB放置在载体上，该载体被配置为：对准PCB，使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠，并且向重叠的结合区域施加压力。 然后，该过程通过回流炉发送载体，该回流炉在PCB上重新焊接焊料，使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜，使得重叠的柔性PCB变得机械和电耦合在一起。