公开(公告)号：US20070039171A1

公开(公告)日：2007-02-22

申请号：US11537754

申请日：2006-10-02

Applicant: Joel Goergen

Inventor： Joel Goergen

IPC: H01R43/00

CPC classification number: H05K3/4688 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/382 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0209 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09354 ,  H05K2201/09381 ,  H05K2201/09454 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09718 ,  H05K2201/09781 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: Method and apparatus are disclosed for flow control over Point-to-Point Protocol (PPP) data links. A method of negotiating such flow control between two PPP peers is disclosed, along with methods for operating flow control across a PPP link. In one embodiment, flow control frames carry an IEEE802.3x MAC control frame payload—the PPP implementation repackages such frames as MAC control frames and passes them to a MAC, which performs flow control. In another embodiment, flow control frames allow flow control commands to be applied differently to different service classes such that PPP flow can be controlled on a per-class basis.

Abstract translation: 公开了用于在点对点协议（PPP）数据链路上的流控制的方法和装置。 公开了一种在两个PPP对等体之间协商这种流量控制的方法，以及用于在PPP链路上操作流量控制的方法。 在一个实施例中，流控制帧携带IEEE802.3x MAC控制帧有效载荷 - PPP实现将诸如MAC控制帧的帧重新封装，并将其传递给执行流控制的MAC。 在另一个实施例中，流控制帧允许流控制命令被不同地应用于不同的服务类，使得PPP流可以基于每个级别进行控制。

公开(公告)号：US20060294489A1

公开(公告)日：2006-12-28

申请号：US11472975

申请日：2006-06-21

Applicant: Chan-Fei Tai ,  Ya-Ling Huang

Inventor： Chan-Fei Tai ,  Ya-Ling Huang

IPC: G06F17/50

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A pad layout of a printed circuit board includes a first and a second pad symmetrically arranged on the PCB for cooperatively receiving either a first surface mounted component (SMC) or a second surface mounted component (SMC). Each of the SMCs includes a first footprint and a second footprint. The first pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the first footprint of the first SMC and a shape of the first footprint of the second SMC. The second pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the second footprint of the first SMC and a shape of the second footprint of the second SMC.

Abstract translation: 印刷电路板的焊盘布局包括对称地布置在PCB上的第一和第二焊盘，用于协作地接收第一表面安装部件（SMC）或第二表面安装部件（SMC）。 每个SMC包括第一足迹和第二足迹。 第一垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第一印迹的形状和第二SMC的第一印迹的形状。 第二垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第二印迹的形状和第二SMC的第二印迹的形状。

公开(公告)号：US20060284316A1

公开(公告)日：2006-12-21

申请号：US11471079

申请日：2006-06-20

Applicant: Ji Kim

Inventor： Ji Kim

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0367 ,  H05K2201/09381 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2924/00

Abstract: A chip size package comprises a substrate to one surface of which a chip is mounted, a solder ball land formed on the other surface of the substrate and having a projecting center part, a solder mask formed on the other surface of the substrate and having an opening for exposing the solder ball land and a portion of the other surface of the substrate, and a solder ball fused to the solder ball land. As the chip size package has a combined SMD type and NSMD type solder ball land structure, the adhesion force between a solder ball land and a solder ball is reliably increased, and the advantages of SMD type and NSMD type solder ball lands is obtained.

Abstract translation: 一种芯片尺寸封装包括一个衬底，一个表面上安装一个芯片，一个焊球焊盘，形成在该衬底的另一个表面上，并具有一个突出的中心部分，一个形成在衬底的另一个表面上的焊料掩模， 用于露出焊球接地和基板的另一表面的一部分的开口，以及与焊球接合部熔合的焊球。 由于芯片尺寸封装具有组合的SMD型和NSMD型焊球接地结构，所以可靠地提高焊球焊盘与焊球之间的粘附力，并获得SMD型和NSMD型焊球的优点。

公开(公告)号：US20060250451A1

公开(公告)日：2006-11-09

申请号：US11481523

申请日：2006-07-06

Applicant: Shigeru Suzuki ,  Yasuhiro Kato ,  Tomoyuki Kubo ,  Koji Imai

Inventor： Shigeru Suzuki ,  Yasuhiro Kato ,  Tomoyuki Kubo ,  Koji Imai

IPC: B41J2/05

CPC classification number: H05K3/363 ,  B41J2/14209 ,  B41J2002/14491 ,  H05K1/116 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2203/0455 ,  Y10T29/49126

Abstract: A recording apparatus that has a recording head and a flexible printed circuit board. The recording head, which performs recording on a recording medium, has a plurality of recording elements. One end of the flexible printed circuit board has plurality of feeder wires that connect to one of the terminal lands of each of the recording elements. A first common voltage wire connects the other terminal lands of each of the recording elements to a common potential. A drive circuit is attached to the flexible printed circuit board to drive the recording head via the feeder wires. The other end of the flexible printed circuit board is connected to another circuit board used by the recording apparatus.

公开(公告)号：US07115819B1

公开(公告)日：2006-10-03

申请号：US09377286

申请日：1999-08-18

Applicant: Brad D. Rumsey

Inventor： Brad D. Rumsey

IPC: H01R12/04 ,  H05K1/11 ,  H05K7/10 ,  H05K7/12

CPC classification number: H01L23/49811 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2203/043 ,  Y02P70/611

Abstract: A solder mask defined bond pad or a non-solder mask defined bond pad may be configured to center the solder over the bond pad using either surface attractive forces or capillary action. In some embodiments, a stub trace may be provided, for example, in opposition to the real trace to provide a capillary counter-attractive force on the solder. In other embodiments, the surface attractive action of the edge of the solder mask may be utilized to center the solder. In still other embodiments, the natural attractive force of a trace on solder may be utilized to appropriately position solder where desired, for example, to line up with other solder deposits.

Abstract translation: 焊接掩模限定的接合焊盘或非焊接掩模限定的接合焊盘可以被配置为使用表面吸引力或毛细管作用将焊料定位在接合焊盘上。 在一些实施例中，可以提供短截线迹，例如与实际迹线相对，以在焊料上提供毛细管反吸引力。 在其他实施例中，可以利用焊料掩模的边缘的表面吸引作用来使焊料居中。 在另外的其它实施例中，焊料上的痕迹的自然吸引力可用于在需要时适当地定位焊料，例如与其它焊料沉积物匹配。

公开(公告)号：US07098408B1

公开(公告)日：2006-08-29

申请号：US10685042

申请日：2003-10-14

Applicant: Sergio Camerlo ,  Lekhanh N. Dang

Inventor： Sergio Camerlo ,  Lekhanh N. Dang

IPC: H05K1/16

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A circuit board assembly includes a printed circuit board (PCB). The PCB has a pad layout which includes a set of pads arranged in a two-dimensional array having at least two pads in a first direction and at least two pads in a second direction that is substantially perpendicular to the first direction. Each pad has (i) a central portion and (ii) multiple lobe portions integrated with the central portion and extending from the central portion of that pad. The circuit board assembly further includes a circuit board component mounted to the pad layout via a set of solder joints. The above-described pad layout (or land pattern) is well-suited for soldering to a variety of AAP devices (e.g., either a CCGA device or a BGA device).

Abstract translation: 电路板组件包括印刷电路板（PCB）。 PCB具有焊盘布局，其包括布置成二维阵列的一组焊盘，其具有在第一方向上的至少两个焊盘和在基本上垂直于第一方向的第二方向上的至少两个焊盘。 每个垫具有（i）中心部分和（ii）与中心部分成一体且从该垫的中心部分延伸的多个叶片部分。 电路板组件还包括经由一组焊点安装到焊盘布局的电路板部件。 上述焊盘布局（或焊盘图案）非常适合于焊接到各种AAP设备（例如，CCGA设备或BGA设备）。

公开(公告)号：US07045902B2

公开(公告)日：2006-05-16

申请号：US10964760

申请日：2004-10-15

Applicant: Sheng-Tsung Liu

Inventor： Sheng-Tsung Liu

IPC: H01L23/48 ,  H01L29/40 ,  H01L23/52 ,  H05K1/14 ,  H05K7/02 ,  H01R12/04

CPC classification number: B23K3/06 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a second terminal of the SMD. The first and the second contact pads have a plurality of expanded portion or diminished portions to form bead receptacles at the facing corners thereof. When solder paste is reflowed to electrically connect the SMD, solder beads formed from the solder paste can be fixed on the bead receptacles. Therefore, there is no free solder bead on the substrate causing short circuit for semiconductor packages.

Abstract translation: 电路化基板具有用于安装表面贴装器件（SMD）的接触焊盘。 第一和第二接触垫位于与衬底的第一端子和第二端子对应的衬底的表面上。 第一和第二接触垫具有多个膨胀部分或减小的部分，以在其相对的角部处形成胎圈容器。 当焊膏回流以电连接SMD时，由焊膏形成的焊球可以固定在焊珠容器上。 因此，在衬底上没有可用的焊料珠引起半导体封装的短路。

公开(公告)号：US07038327B2

公开(公告)日：2006-05-02

申请号：US10787801

申请日：2004-02-26

Applicant: Sheng-Hsiung Ho ,  Chuan-Mao Wei ,  Ke-Feng Lin

Inventor： Sheng-Hsiung Ho ,  Chuan-Mao Wei ,  Ke-Feng Lin

IPC: H01L23/48 ,  H01L23/06

CPC classification number: H05K1/117 ,  H05K3/323 ,  H05K2201/09381 ,  H05K2201/09663

Abstract: Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.

Abstract translation: 与诸如液晶显示面板和等离子体显示面板的电子设备中的各向异性导电膜（ACF）结合使用的增强型ACF接合焊盘具有至少两个指状部分。 当通过ACF膜与其它金属结构体接合时，通常设置在柔性引线上的这种接合焊盘与其它金属结构进行更好的电接触，因为改进的接合焊盘的指状部分之间的空间允许ACF膜的 粘合剂材料驻留在指状部分之间，防止接合焊盘的中心区域中的接合焊盘金属与其它金属结构分离。

公开(公告)号：US07000312B2

公开(公告)日：2006-02-21

申请号：US10308120

申请日：2002-12-03

Applicant: Kenji Fukunabe ,  Masanobu Okada ,  Kazuyoshi Nakaya

Inventor： Kenji Fukunabe ,  Masanobu Okada ,  Kazuyoshi Nakaya

IPC: H01R9/00 ,  H05K3/00

CPC classification number: H05K3/3442 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: In a circuit board, when lands provided on a rear surface of a substrate are each separated into a mainland and a sub-land, warping or other defects of the substrate can be ignored when soldering, and the substrate can be mounted with a high bonding strength. On the rear surface of a module substrate, partitions are each provided to separate a metal film into the mainland and the sub-land. Accordingly, when the substrate is mounted on a motherboard, solder applied beforehand from each end-surface electrode to the mainland can be largely protruded downward from the mainland, and warping or other defects of the substrate can be ignored by this protruding portion of the solder. In addition, in the state in which the substrate is mounted, since the solder is pushed out from between the mainland and the motherboard and overflows the partition, both the mainland and the sub-land can be soldered to the motherboard side, and hence stable bonding can be obtained at a large bonding area.

公开(公告)号：US06986917B2

公开(公告)日：2006-01-17

申请号：US10408588

申请日：2003-04-07

Applicant: Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

Inventor： Masaru Takada ,  Hiroyuki Kobayashi ,  Kenji Chihara ,  Hisashi Minoura ,  Kiyotaka Tsukada ,  Mitsuhiro Kondo

IPC: B05D3/04

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/116 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09381 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/0571 ,  H05K2203/107 ,  H05K2203/175 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (10), whereby the conductor circuit (6) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Abstract translation: 在具有导体电路（6）的绝缘板（7）的表面上印刷包括热固性树脂的阻焊剂。 然后将阻焊剂热固化以形成具有低热膨胀系数的绝缘膜（1）。 然后将激光束（2）施加到要形成开口的绝缘膜的部分，以烧掉用于形成开口（10）的相同部分，由此导体电路（6）暴露。 该开口可以通过在其内表面上形成金属电镀膜而形成为导电孔。 优选地，形成外部连接垫以覆盖开口。 通过使用在电镀完成后优选用激光束切断的电镀铅来形成金属涂膜。