公开(公告)号：US20080106475A1

公开(公告)日：2008-05-08

申请号：US12015535

申请日：2008-01-17

Applicant: Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

Inventor： Gregory JANDZIO ,  Anders Pedersen ,  Gary Rief ,  Walter Whybrew

IPC: H01Q9/04

CPC classification number: H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

Abstract: A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel,

Abstract translation: 结构印刷线路板面板包括具有相对的外表面和层间互连的多层印刷线路板，其布置RF，功率和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板，

公开(公告)号：US20080074795A1

公开(公告)日：2008-03-27

申请号：US11903979

申请日：2007-09-25

Applicant: Isao Kobayashi

Inventor： Isao Kobayashi

IPC: G11B5/60

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  B41J2202/08 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09554

Abstract: A recording apparatus, including: a recording head including an actuator; a head holder holding the head; a circuit board disposed on the holder and configured to be connected to an external signal source; a drive circuit operable to drive the actuator; a flexible wiring member which includes wires that connect the actuator and the circuit board, which is elongated in a direction in which the wires extend, which is connected to the actuator and the circuit board at longitudinally opposite ends thereof, respectively, and on which the drive circuit is mounted between the longitudinal opposite ends, the wires including (a) a common voltage wire which connects common-voltage portions of the drive circuit and the circuit board and (b) a drive signal wire for driving the actuator; and a radiator having heat conductivity and electric conductivity and disposed between the head and the circuit board so as to extend along the wiring member, the radiator being heat-conductively and electrically joined to: (a) the common voltage wire in the vicinity of the drive circuit; (b) at least one portion of the common voltage wire intermediate between the drive circuit and the circuit board; and (c) at least one of (c-1) the common voltage wire in the vicinity of the circuit board and (c-2) the common-voltage portion of the circuit board connected to the commom voltage wire of the wiring member.

Abstract translation: 一种记录装置，包括：包括致动器的记录头; 持有头部的头架; 设置在所述保持器上并且被配置为连接到外部信号源的电路板; 可操作以驱动致动器的驱动电路; 柔性布线构件，其包括连接致动器和电路板的导线，所述导线在导线延伸的方向上延伸，其分别在其纵向相对端连接到致动器和电路板，并且其上 驱动电路安装在纵向相对端之间，导线包括（a）连接驱动电路的公共电压部分和电路板的公共电压线和（b）用于驱动致动器的驱动信号线; 以及散热器，其具有导热性和导电性，并且设置在所述头部和所述电路板之间，沿着所述布线构件延伸，所述散热器被导热和电接合到：（a）所述公共电压线在 驱动电路; （b）在驱动电路和电路板之间的中间的公共电压线的至少一部分; 和（c）电路板附近的（c-1）公共电压线中的至少一个，（c-2）连接到配线部件的公共电压线的电路板的公共电压部分。

公开(公告)号：US20080029293A1

公开(公告)日：2008-02-07

申请号：US11882667

申请日：2007-08-03

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

IPC: H05K1/00

CPC classification number: H05K1/0259 ,  G11B5/486 ,  G11B5/6094 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/0969

Abstract: [Object] To provide a wired circuit board in which charged static electricity can be efficiently removed before mounting of electronic components and electrical stability of a wired circuit body portion can be reliably secured after the mounting of the electronic components.[Solution Means] In a suspension board with circuit 1 in which a metal supporting layer 12, an insulating base layer 13, a conductive pattern 14 having a main wired circuit 5 formed on a wired circuit body portion 2 and an auxiliary wired circuit 11 formed on an electrostatic charge removing portion 3, and an insulating cover layer 15 are sequentially laminated, a semiconductive layer 9 covering the auxiliary wired circuit 11 is formed on the insulating base layer 13 in the electrostatic charge removing portion 3. Before mounting of a magnetic head, static electricity charged on the wired circuit body portion 2 can be efficiently removed via the semiconductive layer 9. After the mounting of the magnetic head, the electrostatic charge removing portion 3 is separated from the wired circuit body portion 2 using a conduction cut-off portion 4 as a boundary, so that electrical conduction between the wired circuit body portion 2 and the electrostatic charge removing portion 3 is cut off.

Abstract translation: 提供一种布线电路板，其中在安装电子部件之前可以有效地去除带电静电，并且在安装电子部件之后可以可靠地确保布线电路主体部分的电气稳定性。 [解决方案]在具有电路1的悬挂板中，其中金属支撑层12，绝缘基底层13，形成在布线电路主体部分2上的主布线电路5的导电图案14和形成的辅助布线电路11 在静电电荷去除部分3和绝缘覆盖层15上依次层叠，在静电电荷去除部分3的绝缘基底层13上形成覆盖辅助布线电路11的半导体层9。 在安装磁头之前，可以通过半导体层9有效地去除充电在布线电路主体部分2上的静电。 在安装磁头之后，使用导通截止部分4作为边界，将静电电荷去除部分3与布线电路主体部分2分开，使得布线电路主体部分2和静电电荷 去除部分3被切断。

公开(公告)号：US20080000673A1

公开(公告)日：2008-01-03

申请号：US11819596

申请日：2007-06-28

Applicant: Jun Ishii ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasunari Ooyabu

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/16

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

Abstract: A wired circuit board has a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires arranged in mutually spaced-apart relation, and a plurality of semiconductive layers formed on the insulating layer and electrically connected to the metal supporting board and the respective wires. The semiconductive layers are provided independently of each other in correspondence to the respective wires.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有互相间隔布置的多根导线的导电图案，以及形成在多个半导体层上的多个半导体层 绝缘层并且电连接到金属支撑板和相应的导线。 半导体层相应于相应的导线彼此独立地设置。

公开(公告)号：US07301108B2

公开(公告)日：2007-11-27

申请号：US10959711

申请日：2004-10-05

Applicant: Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

Inventor： Frank D. Egitto ,  Donald S. Farquhar ,  Voya R. Markovich ,  Mark D. Poliks ,  Douglas O. Powell

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1092

Abstract: A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.

Abstract translation: 多层互连结构和形成方法。 在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。 在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

公开(公告)号：US20070246247A1

公开(公告)日：2007-10-25

申请号：US11785873

申请日：2007-04-20

Applicant: Yasunari Ooyabu ,  Jun Ishii

Inventor： Yasunari Ooyabu ,  Jun Ishii

IPC: H05K1/03

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

Abstract: The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.

Abstract translation: 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的半导体层，以及 接地连接部分形成在金属支撑板上以与金属支撑板和半导体层接触。

公开(公告)号：US20070226998A1

公开(公告)日：2007-10-04

申请号：US11760217

申请日：2007-06-08

Applicant: Kevin Olson ,  Alan Wang

Inventor： Kevin Olson ,  Alan Wang

IPC: H05K3/10 ,  H01L23/495

CPC classification number: H01L21/486 ,  C09D5/4488 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/388 ,  H05K3/426 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0179 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2203/0582 ,  H05K2203/135 ,  H01L2924/00

Abstract: Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.

Abstract translation: 提供了用于制造多层电路组件的工艺和通过这些工艺制造的多层电路组件。 该方法包括（a）提供基底，其至少一个区域包括多个通孔，这些区域的通孔密度为500至10,000个孔/平方英寸（75至1550个孔/平方厘米）; （b）将介电涂层施加到所述基底的所有暴露表面上以在其上形成保形涂层; 和（c）在基片的所有表面上涂一层金属。 可以包括诸如电路化的附加处理步骤。

公开(公告)号：US07272889B2

公开(公告)日：2007-09-25

申请号：US11156607

申请日：2005-06-21

Applicant: Hidenori Aonuma ,  Yasuhito Ohwaki

Inventor： Hidenori Aonuma ,  Yasuhito Ohwaki

IPC: H01K3/10

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/06 ,  H05K3/108 ,  H05K3/243 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2203/0323 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A production method of a suspension board with circuit that can provide reduced number of man-hour and complicated processes for forming the ground terminal, to provide production cost reduction. An insulating base layer 4 having a base opening portion 3 is formed on a metal board 2 at a ground terminal 13 forming position, and a thin metal film 5 is formed on the metal board 2 exposed in the base opening portion 3 and on the insulating base layer 4. Then, a conductive pattern 7 is formed on the thin metal film 5. Then, an insulating cover layer 9 covering the conductive pattern 7 and having a cover opening portion 8 which correspond in position to the base opening portion 3 is formed on the insulating base layer 4. Then, a metal board opening portion 11 from which the base opening portion 3 and the insulating base layer 4 around it are exposed is formed in the metal board 2. Then, an electrolytic plating layer 12 is formed on each side of the conductive pattern 7 exposed in the cover opening portion 8, feeding electric power from the conductive pattern 7, and a metal filling layer 14 is formed in the metal board opening portion 11, to allow the electrolytic plating layer 12 and the metal board 2 to be conductive with each other.

Abstract translation: 一种具有电路的悬挂板的制造方法，其能够提供减少的工时数量和复杂的用于形成接地端子的工艺，以提供生产成本降低。 在接地端子13的形成位置的金属板2上形成具有基部开口部3的绝缘基底层4，在露出于基部开口部3的绝缘金属板2上形成金属薄膜5， 基层4。 然后，在金属薄膜5上形成导电图案7。 然后，在基底绝缘层4上形成覆盖导电图案7并且具有与基部开口部3相对应的盖开口部8的绝缘覆盖层9。 然后，在金属板2上形成金属基板开口部11，基部开口部3及其周围的绝缘基底层4露出。 然后，在暴露于盖开口部8的导电图案7的两侧形成电解镀层12，从导电图案7供给电力，在金属板开口部11形成有金属填充层14， 以使电解镀层12和金属板2彼此导电。

公开(公告)号：US20070111561A1

公开(公告)日：2007-05-17

申请号：US11565715

申请日：2006-12-01

Applicant: Alan Wang ,  Kevin Olson ,  Thomas DiStefano

Inventor： Alan Wang ,  Kevin Olson ,  Thomas DiStefano

IPC: H01R12/00

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09554 ,  H05K2201/10446 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Abstract translation: 提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分 到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 和（d）以一种方式将第一电路板与一次性部分分离，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。 还提供了通过该方法形成的电路板。

公开(公告)号：US20070080447A1

公开(公告)日：2007-04-12

申请号：US11607910

申请日：2006-12-04

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H01L23/34 ,  H01L21/00

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。