公开(公告)号：US09117883B2

公开(公告)日：2015-08-25

申请号：US13897480

申请日：2013-05-20

Applicant: The Boeing Company

Inventor： Keith Daniel Humfeld

IPC: H01L21/768 ,  H01L23/532 ,  H05K3/22 ,  B82Y30/00

CPC classification number: H05K3/222 ,  B82Y30/00 ,  H01L21/76838 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0367 ,  H05K2201/10363 ,  H01L2924/00

Abstract: A fabricated substrate has at least one plurality of posts. The plurality is fabricated such that the two posts are located at a predetermined distance from one another. The substrate is exposed to a fluid matrix containing functionalized carbon nanotubes. The functionalized carbon nanotubes preferentially adhere to the plurality of posts rather than the remainder of the substrate. A connection between posts of the at least one plurality of posts is induced by adhering one end of the functionalized nanotube to one post and a second end of the functionalized carbon nanotube to a second post.

Abstract translation: 制造的基板具有至少多个柱。 多个制造成使得两个柱彼此相隔预定距离。 将基底暴露于含有官能化碳纳米管的流体基质。 功能化的碳纳米管优先粘附到多个柱而不是衬底的其余部分。 通过将功能化纳米管的一端粘附到官能化碳纳米管的一个柱和第二端到第二柱来诱导至少一个多个柱的柱之间的连接。

公开(公告)号：US20150216036A1

公开(公告)日：2015-07-30

申请号：US14601720

申请日：2015-01-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinsuke Serizawa

IPC: G03G15/00 ,  H05K1/00

CPC classification number: H05K1/0296 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

Abstract translation: 印刷电路板包括狭缝部分和跨越狭缝部分设置的第一导电部件。 在印刷电路板连接到具有弹性力的第二导电构件的一端连接的装置的状态下，第二导电构件的另一端接触第一导电构件，而第二导电构件的另一端 构件穿过狭缝部分。

公开(公告)号：US20140353827A1

公开(公告)日：2014-12-04

申请号：US13903828

申请日：2013-05-28

Applicant: Yueli Liu ,  Qinglei Zhang ,  Amanda E. Schuckman ,  Rui Zhang

Inventor： Yueli Liu ,  Qinglei Zhang ,  Amanda E. Schuckman ,  Rui Zhang

IPC: H01L23/00

CPC classification number: H01L23/5381 ,  H01L23/4821 ,  H01L23/53238 ,  H01L23/538 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/26 ,  H01L24/27 ,  H01L24/33 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/171 ,  H01L2224/2746 ,  H01L2224/32225 ,  H01L2224/3303 ,  H01L2224/33505 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81455 ,  H01L2224/81463 ,  H01L2224/81466 ,  H01L2224/8147 ,  H01L2224/81472 ,  H01L2224/81479 ,  H01L2224/81481 ,  H01L2224/81484 ,  H01L2224/81487 ,  H01L2224/81815 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/10363 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/04941 ,  H01L2924/01074 ,  H01L2924/01072 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0481 ,  H01L2924/0496 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for layered interconnect structures for bridge interconnection in integrated circuit assemblies. In one embodiment, an apparatus may include a substrate and a bridge embedded in the substrate. The bridge may be configured to route electrical signals between two dies. An interconnect structure, electrically coupled with the bridge, may include a via structure including a first conductive material, a barrier layer including a second conductive material disposed on the via structure, and a solderable material including a third conductive material disposed on the barrier layer. The first conductive material, the second conductive material, and the third conductive material may have different chemical composition. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于集成电路组件中的桥互连的分层互连结构的技术和配置。 在一个实施例中，装置可以包括衬底和嵌入衬底中的桥。 桥可以被配置为在两个管芯之间布置电信号。 与电桥电耦合的互连结构可以包括通孔结构，其包括第一导电材料，包含布置在通孔结构上的第二导电材料的阻挡层，以及包含布置在阻挡层上的第三导电材料的可焊材料。 第一导电材料，第二导电材料和第三导电材料可以具有不同的化学组成。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20130264711A1

公开(公告)日：2013-10-10

申请号：US13897480

申请日：2013-05-20

Applicant: The Boeing Company

Inventor： Keith Daniel Humfeld

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H05K3/222 ,  B82Y30/00 ,  H01L21/76838 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0367 ,  H05K2201/10363 ,  H01L2924/00

Abstract: A fabricated substrate has at least one plurality of posts. The plurality is fabricated such that the two posts are located at a predetermined distance from one another. The substrate is exposed to a fluid matrix containing functionalized carbon nanotubes. The functionalized carbon nanotubes preferentially adhere to the plurality of posts rather than the remainder of the substrate. A connection between posts of the at least one plurality of posts is induced by adhering one end of the functionalized nanotube to one post and a second end of the functionalized carbon nanotube to a second post.

Abstract translation: 制造的基板具有至少多个柱。 多个制造成使得两个柱彼此相隔预定距离。 将基底暴露于含有官能化碳纳米管的流体基质。 功能化的碳纳米管优先粘附到多个柱而不是衬底的其余部分。 通过将功能化纳米管的一端粘附到官能化碳纳米管的一个柱和第二端到第二柱来诱导至少一个多个柱的柱之间的连接。

公开(公告)号：US08120927B2

公开(公告)日：2012-02-21

申请号：US12098474

申请日：2008-04-07

Applicant: Nan-Jang Chen ,  Hong-Chin Lin

Inventor： Nan-Jang Chen ,  Hong-Chin Lin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/0216 ,  H01L2924/0002 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/10363 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

Abstract translation: 公开了印刷电路板。 印刷电路板包括具有顶表面和底表面的基底。 地平面位于底面。 信号迹线沿着第一方向在顶表面上。 至少两个隔离的电源平面分别位于与信号迹线的相对侧相邻的顶表面上。 沿着第二方向的导电连接在信号迹线上耦合到两个电源层，而不与电信号迹线电连接，其中信号迹线不经过接地层的任何分裂。

公开(公告)号：US07645943B2

公开(公告)日：2010-01-12

申请号：US11827442

申请日：2007-07-11

Applicant: Jason R. Horiuchi

Inventor： Jason R. Horiuchi

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/222 ,  H05K1/0263 ,  H05K1/029 ,  H05K3/0047 ,  H05K3/306 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/10272 ,  H05K2201/10363 ,  H05K2203/0242 ,  H05K2203/175

Abstract: A configurable printed circuit board can be used with a bussed electrical center in a vehicle and has a dielectric body. The dielectric body defines an array of plated through-holes that are constructed to receive a terminal of an electrical adaptor. A conductive trace is also adhered to a surface of the dielectric body and is routed through some of the plated through-holes for carrying current between them. An aperture is defined through a portion of some of the plated through-holes and the respective conductive traces to electrically isolate one side of the conductive trace from another side; and thus the printed circuit board can accommodate more than one electrical device in a single section.

Abstract translation: 可配置的印刷电路板可以与车辆中的总线电气中心一起使用并且具有电介质体。 电介质体限定了电镀通孔的阵列，其被构造成接收电适配器的端子。 导电迹线也粘附到电介质体的表面，并且被引导通过一些电镀通孔以在它们之间承载电流。 通过一些电镀通孔和相应的导电迹线的一部分限定孔，以使导电迹线的一侧与另一侧电隔离; 因此印刷电路板可以在单个部分中容纳多于一个的电气设备。

公开(公告)号：US07618283B1

公开(公告)日：2009-11-17

申请号：US12108010

申请日：2008-04-23

Applicant: Brian Patrick Costello

Inventor： Brian Patrick Costello

IPC: H01R31/08

CPC classification number: H01R12/52 ,  H01R12/585 ,  H05K1/142 ,  H05K3/308 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/1059

Abstract: A bridge connector that is configured to electrically and mechanically couple first and second circuit boards is provided. Each circuit board includes a board surface having through-holes. The connector includes a housing having a coupling side configured to interface with the board surfaces when the housing is coupled to the first and second circuit boards. The connector also includes a plurality of bridge contacts that are held within the housing. Each contact includes tail portions that project from the coupling side. Each tail portion is configured to form an interference fit with a corresponding through-hole in order to couple the first and second circuit boards. The tail portions are arranged to hold the first and second circuit boards along the coupling side.

Abstract translation: 提供了一种被配置为电和机械地耦合第一和第二电路板的桥连接器。 每个电路板包括具有通孔的电路板表面。 连接器包括壳体，该壳体具有联接侧，当壳体联接到第一和第二电路板时，耦合侧被配置为与板表面接合。 连接器还包括保持在壳体内的多个桥接触头。 每个触点包括从耦合侧突出的尾部。 每个尾部构造成与对应的通孔形成过盈配合，以便联接第一和第二电路板。 尾部布置成沿联接侧保持第一和第二电路板。

公开(公告)号：US20090154120A1

公开(公告)日：2009-06-18

申请号：US12333524

申请日：2008-12-12

Applicant: Takatoshi Ueyama ,  Toshiyuki Kajimura

Inventor： Takatoshi Ueyama ,  Toshiyuki Kajimura

IPC: H05K7/02

CPC classification number: H05K1/0243 ,  H05K1/0219 ,  H05K1/023 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10363 ,  H05K2201/10689 ,  H05K2201/10969

Abstract: An electronic component, including: a first terminal group including a plurality of functional terminals provided along a first side of the electronic component; a second terminal group including a plurality of functional terminals provided along a second side of the electronic component opposing the first side; and an element that is connected to at least one of the functional terminals of the first terminal group and to at least one of the functional terminals of the second terminal group. The first terminal group includes a first dummy terminal in at least one space between the functional terminals of the first terminal group; the second terminal group includes a second dummy terminal in at least one space between the functional terminals of the second terminal group; and the first and second dummy terminals are not connected to any element inside the electronic component.

Abstract translation: 一种电子部件，包括：第一端子组，包括沿着所述电子部件的第一侧设置的多个功能端子; 第二端子组，包括沿着与第一侧相对的电子部件的第二侧设置的多个功能端子; 以及与第一端子组的至少一个功能端子和第二端子组的至少一个功能端子连接的元件。 第一端子组包括在第一端子组的功能端子之间的至少一个空间中的第一虚拟端子; 第二终端组在第二终端组的功能终端之间的至少一个空间中包括第二虚拟终端; 并且第一和第二虚拟端子不连接到电子部件内部的任何元件。

公开(公告)号：US07518882B2

公开(公告)日：2009-04-14

申请号：US10585573

申请日：2005-02-04

Applicant: Toshiki Shimizu ,  Kouichi Takagi ,  Fumiaki Mizuno

Inventor： Toshiki Shimizu ,  Kouichi Takagi ,  Fumiaki Mizuno

IPC: H01R9/00

CPC classification number: H05K3/202 ,  H05K1/0263 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/0394 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: In respect to an electrical connection between a control circuit board 20 and bus bars 14 interbonded together, it is an object to enhance stability in quality and reliability in connection. As a solution for achieving the object, the control circuit board 20 is provided with a conductor segment 26 to be electrically connected to a specific one of the bus bars 14 on the opposite side of a rear surface thereof bonded to the bus bars 14, and a through-hole 24 penetrating a main body thereof at a position adjacent to the conductor segment 26 so as to expose the specific bus bar 14 therethrough. Further, an electrically-connecting member 70 is disposed to bridge over the through-hole 24 and the conductor segment 26, and soldered onto the conductor segment 26 and the bus bar portion located in the through-hole 24.

Abstract translation: 关于控制电路板20和串联在一起的母线14之间的电连接，其目的是提高连接的质量和可靠性的稳定性。 作为实现该目的的解决方案，控制电路板20设置有导体段26，以与其连接到母线14的后表面的相对侧上的特定一个母线14电连接，并且 通孔24在与导体段26相邻的位置处贯通其主体，以便露出特定母线14。 此外，电连接构件70设置成跨过通孔24和导体段26，并焊接到位于通孔24中的导体段26和汇流条部分上。

公开(公告)号：US07425684B2

公开(公告)日：2008-09-16

申请号：US12075336

申请日：2008-01-30

Applicant: Sang Henry Ta

Inventor： Sang Henry Ta

IPC: H05K1/00

CPC classification number: H05K1/142 ,  H05K1/0287 ,  H05K1/029 ,  H05K3/42 ,  H05K2201/09627 ,  H05K2201/09963 ,  H05K2201/10363 ,  H05K2203/173

Abstract: In Electronics, there exists three distinctive areas namely, discrete components or devices, circuits, and systems. A circuit is built from devices and a system is built from circuits. This invention aims at reducing the implementation of electronic systems down to just three steps namely, systems design, printed-circuit-board planar assembly, and systems test when-as a plurality of Universal Systems Printed-Circuit Blocks of pre-defined sizes is used. Each of said Universal Systems Printed-Circuit Blocks being usable and reusable for prototypes and production is built from a printed circuit board having thereon a functional circuit and a variety of circuit patterns and interconnection structures such that, any of said blocks, when joined together with other blocks on the same plane by standard connectors or electrically conductive compounds to form a systems board, can send and receive signals and voltages to and from any other blocks.

Abstract translation: 在电子学中，存在三个独特的领域，即分立元件或器件，电路和系统。 电路由设备构成，系统由电路构成。 本发明旨在将电子系统的实现降低到三个步骤，即系统设计，印刷电路板平面组装和系统测试 - 当使用预定义尺寸的多个通用系统印刷电路块 。 每个所述通用系统印刷电路块可用于和可重复使用的原型和生产由其上具有功能电路和各种电路图案和互连结构的印刷电路板构成，使得任何所述块当与 通过标准连接器或导电化合物形成系统板的同一平面上的其他块可以向任何其他块发送和接收信号和电压。