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    Solderless connector for opto-electric module
    91.
    发明授权
    Solderless connector for opto-electric module 有权

    公开(公告)号：US06619999B2

    公开(公告)日：2003-09-16

    申请号：US10036855

    申请日：2001-12-31

    Applicant: Edward Bright

    Inventor： Edward Bright

    IPC: H01R1342

    CPC classification number: G02B6/3897 ,  H05K1/141 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/1059 ,  Y10S439/943

    Abstract: An opto-electric module for connection with a printed circuit board having a through-hole comprising: (1) a substrate; (2) an opto-electric device electrically connected to the substrate; and (3) a compliant pin coupled to the opto-electric device and extending from the substrate for electrically connecting the through-hole of the printed circuit board with the opto-electric device. The compliant pin enables the opto-electric module to be electrically coupled to the printed circuit board in a one-step process without exposing the opto-electric device to potentially damaging temperatures associated with soldering.

    Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
    93.
    发明申请
    Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device 失效
    光收发器，连接器，基板单元，光发射器，光接收器和半导体器件

    公开(公告)号：US20030123818A1

    公开(公告)日：2003-07-03

    申请号：US10307285

    申请日：2002-12-02

    Inventor： Toshiaki Watanabe

    IPC: G02B006/42 ,  G02B006/36

    CPC classification number: H05K1/141 ,  G02B6/4201 ,  G02B6/4246 ,  H05K1/0219 ,  H05K1/024 ,  H05K3/3447 ,  H05K2201/09609 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/1059

    Abstract: One ends of a plurality of interface pins are attached to a substrate in a line. Optical semiconductor device and an electric circuit are mounted on this substrate. The other ends of the interface pins are fit into holes in an another substrate. Signals are exchanged between the two substrates via the interface pins. The interface pins are embedded in a dielectric material. A plurality of ground pins and/or ground through holes may be provided in the dielectric material around the interface pins. The dielectric constant of the dielectric material is less than the dielectric constants of the two substrates.

    Abstract translation: 多个接口引脚的一端以一行连接到基板。 光学半导体器件和电路安装在该衬底上。 接口引脚的另一端装配在另一个基板上的孔中。 信号通过接口引脚在两个基板之间交换。 接口引脚嵌入电介质材料中。 多个接地引脚和/或接地通孔可以设置在接口引脚周围的电介质材料中。 介电材料的介电常数小于两个基片的介电常数。

    Interposition structure between substrates
    94.
    发明申请
    Interposition structure between substrates 有权
    基板之间的间隔结构

    公开(公告)号：US20010031567A1

    公开(公告)日：2001-10-18

    申请号：US09753986

    申请日：2001-01-03

    Applicant: Fujitsu Limited, Fujisu Takamisawa, & Honda Tsushin Kogyo

    Inventor： Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

    IPC: H05K001/00

    CPC classification number: H05K3/368 ,  H01L2924/00013 ,  H01R12/523 ,  H01R12/585 ,  H01R43/205 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2201/2036 ,  H01L2224/29099

    Abstract: An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body. The interposition structure is interposed between upper and lower substrates with the positioning protuberance received in a recess formed in the upper surface of the lower substrate, and the connection pin is inserted through a hole in the upper substrate, the through hole, and a hole in the lower substrate.

    Abstract translation: 插入在基板之间并且能够引导用于将基板彼此电连接的连接销的插入结构，从而即使在要连接的基板或其他构件具有尺寸误差的情况下也可以适当地插入连接销 在其生产期间，定位误差等。 插入结构具有插入体，其中形成通孔，使得连接针入口和出口部分的内径在从内部到其对应的外部开口端的方向上具有逐渐增加的内径，并且还具有定位 设置在插入体下面的凸起。 插入结构插入在上下基板之间，定位突起容纳在形成在下基板的上表面中的凹部中，并且连接销穿过上基板，通孔和孔中的孔 下基板。

    Three-dimensional molded sockets for mechanical and electrical component attachment
    95.
    发明授权
    Three-dimensional molded sockets for mechanical and electrical component attachment 失效
    用于机械和电气部件连接的三维模制插座

    公开(公告)号：US5994648A

    公开(公告)日：1999-11-30

    申请号：US826461

    申请日：1997-03-27

    Applicant: Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

    Inventor： Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

    IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

    CPC classification number: H05K3/326 ,  H05K1/119 ,  H05K1/183 ,  H05K1/184 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K3/284 ,  Y02P70/611

    Abstract: An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

    Abstract translation: 不需要焊接处理的电路组件，包括具有布置在其表面中的至少一个上的终端的电子部件，以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔，其中，空腔基本上符合电子形状 零件。 近似空腔是与电子部件的各个端子匹配的多个电触点，其中至少一个电触点连接到基板上的至少一个电路迹线。 空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合，使得当部件放置在其中时，部件保持在腔内。 组件设置在空腔中，使得其端子与其相应的电触点物理和电连接。

    Deformable pin connector for multiple PC boards
    99.
    发明授权
    Deformable pin connector for multiple PC boards 失效
    用于多个PC板的可变形针连接器

    公开(公告)号：US5761050A

    公开(公告)日：1998-06-02

    申请号：US702348

    申请日：1996-08-23

    Applicant: Ian Archer

    Inventor： Ian Archer

    IPC: H01R12/58 ,  H05K3/30 ,  H05K3/36 ,  H01R23/68 ,  H01R9/09

    CPC classification number: H01R12/585 ,  H01R12/523 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K3/308

    Abstract: A press-fit or compliant section or deformable pin electrical connector. The connector is designed to be inserted into several plated through holes in printed circuit boards. Specifically, the pin connector can electrically and mechanically connect two or more printed circuit boards (PCBs). Uniquely, it is possible to have a single pin that is both electrically and mechanically connected to two PCBs and have the pin extending through a plated through hole of a third PCB without establishing any electrical or mechanical contact with the third PCB. Additionally, the pin has at least two compliant sections for press fitting into a plated through-hole in a PCB or the like. Each compliant section has a different size diameter. Specifically, the top compliant section is the smallest, the bottom compliant section is the largest in diameter, and the remaining compliant sections will gradually increase in size as they are located from the tip to the base of the pin.

    Abstract translation: 压配或柔性部分或可变形销电连接器。 连接器被设计成插入印刷电路板中的几个电镀通孔中。 具体来说，针式连接器可电气和机械地连接两个或多个印刷电路板（PCB）。 独特地，可以有一个引脚既电气又机械地连接到两个PCB，并且使引脚延伸穿过第三PCB的电镀通孔，而不与第三PCB建立任何电气或机械接触。 此外，销具有至少两个柔性部分，用于压配合到PCB等中的电镀通孔中。 每个顺应部分的直径不同。 具体来说，顶部顺应部分是最小的，底部柔顺部分的直径是最大的，并且剩余的柔顺部分将随着从尖端到销的底部的位置逐渐增大。

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