公开(公告)号：US5741597A

公开(公告)日：1998-04-21

申请号：US453963

申请日：1995-05-30

Applicant: Tadahiko Sakai ,  Shinichi Kuroki

Inventor： Tadahiko Sakai ,  Shinichi Kuroki

IPC: B23K1/20 ,  H05K3/30 ,  H05K3/34 ,  B23K35/36

CPC classification number: B23K1/20 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/1163 ,  H05K3/341 ,  H05K3/3494 ,  Y02P70/613 ,  Y10T428/31678

Abstract: An electronic part is tacked to a circuit board, leads of the electronic part being made into contact with cream solder built up on the circuit board, and thereafter, the circuit board is heated up so as to melt the cream solder in order to solder the electronic part to the circuit board. In this procedure, the melting temperature of a hardener in the tacking bond, that is, the hardening temperature of the tacking bond--is higher than that of the cream solder, thereby making it possible to prevent hindrance to sinking of the lead terminal of the electronic part into the melted cream solder.

Abstract translation: 将电子部件固定到电路板上，使电子部件的引线与构成在电路板上的膏状焊膏接触，然后将电路板加热，使熔融焊膏熔化，从而焊接 电子部件到电路板。 在该方法中，粘合剂中的固化剂的熔融温度，即粘合剂的硬化温度，高于膏状焊料的熔融温度，从而可以防止引线端子的下沉 电子部分进入熔化的奶油焊料。

公开(公告)号：US4970365A

公开(公告)日：1990-11-13

申请号：US489838

申请日：1990-03-02

Applicant: Pedro A. Chalco

Inventor： Pedro A. Chalco

IPC: B23K1/005 ,  B23K20/10 ,  B23K26/06 ,  H05K3/32

CPC classification number: H01L24/85 ,  B23K1/0056 ,  B23K20/10 ,  B23K26/0093 ,  B23K26/06 ,  H01L24/50 ,  H01L24/78 ,  H01L24/80 ,  H05K3/328 ,  H01L2224/05647 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/48847 ,  H01L2224/78301 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K2201/10628 ,  H05K2201/10681 ,  H05K2203/0285 ,  H05K2203/107

Abstract: Component leads are bonded to pads disposed on a non-rigid substrate by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably an epoxy printed circuit board.

Abstract translation: 通过应用激光能量和超声波能量的组合，将元件引线结合到设置在非刚性基板上的焊盘。 焊盘优选是裸铜焊盘，没有贵金属涂层或化学预处理，非刚性基板优选为环氧印刷电路板。

公开(公告)号：US4814944A

公开(公告)日：1989-03-21

申请号：US220433

申请日：1988-07-13

Applicant: Hiroyuki Sagawa ,  Hirofumi Koga ,  Shunichi Agatahama ,  Hideyuki Okumura ,  Kazushige Matsuoka ,  Ryuichi Sato

Inventor： Hiroyuki Sagawa ,  Hirofumi Koga ,  Shunichi Agatahama ,  Hideyuki Okumura ,  Kazushige Matsuoka ,  Ryuichi Sato

IPC: H01H50/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38 ,  H05K7/10

CPC classification number: H05K3/305 ,  H05K3/3426 ,  H01H2001/5888 ,  H01H2050/044 ,  H01H50/14 ,  H05K2201/10053 ,  H05K2201/10568 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K3/381 ,  Y02P70/613

Abstract: In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection. The projection may extend from a central portion of the bottom surface of the component, or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.

Abstract translation: 在这种用于表面安装型电子部件的安装结构和方法中，该部件具有至少一个从其底表面突出并终止于脚部以用于焊接到印刷电路板的端子。 此外，突起从电子部件的该底面延伸一段距离稍微小于端子从其突出的量的距离。 该突起通过粘合剂临时固定到印刷电路板上，其中端子的底部部分覆盖要被焊接到该电路部分的电路部分，然后将该端子脚部焊接到该电路部分。 因此，在焊接过程中，由于附着的突起的定位动作，终端脚部不会从电路部分移位，从而严重焊接在其上。 突起可以从部件的底表面的中心部分延伸，或者可以以从底表面的边缘的中心部分延伸的方式多个地设置。 投影的结束可能会变得粗糙。

公开(公告)号：US3988563A

公开(公告)日：1976-10-26

申请号：US560069

申请日：1975-03-20

Applicant: Robert Charles Swengel, Sr. ,  J. A. Crumley

Inventor： Robert Charles Swengel, Sr. ,  J. A. Crumley

IPC: B23K1/00 ,  B23K9/22 ,  H01R4/02 ,  H01R43/02 ,  H05K3/40 ,  B23K11/04

CPC classification number: B23K1/0008 ,  B23K9/22 ,  H01R4/029 ,  H01R43/02 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10628 ,  H05K3/4046

Abstract: A welding method and means is disclosed utilizing a conductive foil disposed between or adjacent members to be welded together with the foil serving as one electrode and one or both of the members serving as another electrode of the welding circuit and with the members being forced together or with the foil being forced against the members by a separate electrode.

Abstract translation: 公开了一种焊接方法和装置，其使用设置在待焊接在一起的成员之间或相邻构件之间的导电箔，其中所述箔用作一个电极，并且所述构件中的一个或两个用作焊接电路的另一个电极，并且构件被强制在一起， 其中箔被单独的电极压在构件上。

公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US12080634B2

公开(公告)日：2024-09-03

申请号：US17756556

申请日：2020-11-25

Applicant: THE NOCO COMPANY

Inventor： James P. McBride ,  James Richard Stanfield

IPC: H05K1/18 ,  H01L23/495 ,  H01M10/42 ,  H01M50/519 ,  H05K1/14 ,  H05K3/34 ,  H01L25/11

CPC classification number: H01L23/49555 ,  H01L23/49562 ,  H01M10/4257 ,  H01M50/519 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3426 ,  H01L25/115 ,  H01M2010/4271 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2203/049

Abstract: Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

公开(公告)号：US20240277948A1

公开(公告)日：2024-08-22

申请号：US18645057

申请日：2024-04-24

Applicant: Norton (Waterford) Limited

Inventor： James Roche ,  Enrique Calderon Oliveras

IPC: A61M15/00 ,  G16H20/13 ,  G16H40/63 ,  H05K1/18

CPC classification number: A61M15/0001 ,  G16H20/13 ,  G16H40/63 ,  H05K1/181 ,  A61M2205/8206 ,  H05K2201/10037 ,  H05K2201/10628

Abstract: An electronic module for a medical device such as an inhaler is disclosed, the electronic module comprising a printed circuit board, and a damper configured to dampen energy transfer to and/or from a battery when a battery is connected to the electronic module and the electronic module is exposed to mechanical shock.

公开(公告)号：US11911825B2

公开(公告)日：2024-02-27

申请号：US16606310

申请日：2018-03-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  David George ,  Sterling Chaffins ,  Lihua Zhao

IPC: B29C64/165 ,  B22F7/08 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/194 ,  B29C64/112 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46 ,  B29K105/16 ,  B29L31/34

CPC classification number: B22F7/08 ,  B29C64/112 ,  B29C64/165 ,  B29C64/194 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4664 ,  B29K2105/162 ,  B29K2995/0005 ,  B29L2031/3425 ,  H05K2201/10022 ,  H05K2201/10628 ,  H05K2203/1131 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/20

Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

公开(公告)号：US11785703B2

公开(公告)日：2023-10-10

申请号：US17473093

申请日：2021-09-13

Applicant: Kioxia Corporation

Inventor： Kazuya Nagasawa ,  Tomoaki Morita ,  Takahisa Funayama ,  Norihiro Ishii ,  Hidenori Tanaka

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10628 ,  H05K2201/10901

Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.

公开(公告)号：US20230254975A1

公开(公告)日：2023-08-10

申请号：US18079267

申请日：2022-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunjae KIM ,  Kyongsoon CHO

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10628 ,  H05K2201/10977

Abstract: A semiconductor package that includes a circuit board having an opening therein. The circuit board includes a first portion, and a second portion disposed below the first portion. The first portion protrudes further in a horizontal direction towards the opening than the second portion. A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate. A connection terminal directly contacts a lower surface of the first portion of the circuit board and an upper surface of the image sensor chip. A gap-fill member covers the connection terminal and covers a portion of an upper surface of the image sensor chip and at least a portion of a lateral side surface of the image sensor chip. The transparent substrate has a greater horizontal width than the circuit board.