公开(公告)号：US20230260739A1

公开(公告)日：2023-08-17

申请号：US18012478

申请日：2020-07-13

Applicant: Hitachi High-Tech Corporation

Inventor： Keisuke TANUMA ,  Masato KAMIO ,  Hironori ITABASHI ,  Hiroki KANNAMI ,  Yusuke SEKI ,  Takumi UEZONO ,  Mitsuhiro NAKAMURA

IPC: H01J37/153 ,  H01J37/28 ,  H01J37/147

CPC classification number: H01J37/153 ,  H01J37/28 ,  H01J37/1474 ,  H01J2237/1536

Abstract: It is aimed to properly correct the various types of distortion without a reduction in observation throughput. The present disclosure provides a charged particle beam device that obtains an image by irradiating a specimen with a charged particle beam and includes: a deflection coil that scans the charged particle beam on the specimen; a D/A converter that converts a digital scan waveform into an analog scan waveform and outputs the analog scan waveform to the deflection coil to drive the deflection coil; and a scan waveform generation unit that generates a digital scan waveform and outputs the digital scan waveform to the D/A converter, in which the scan waveform generation unit has a basic LUT that stores parameters for correcting the digital scan waveform and includes a correction circuit that corrects a distortion characteristic of the deflection coil

公开(公告)号：US11728131B2

公开(公告)日：2023-08-15

申请号：US17553357

申请日：2021-12-16

Applicant: ASML Netherlands B.V.

Inventor： Ning Ye ,  Jun Jiang ,  Jian Zhang ,  Yixiang Wang

IPC: H01J37/28 ,  H01J37/244 ,  H01J37/26

CPC classification number: H01J37/28 ,  H01J37/244 ,  H01J37/265 ,  H01J2237/0047 ,  H01J2237/2817

Abstract: Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

公开(公告)号：US11728127B2

公开(公告)日：2023-08-15

申请号：US17518739

申请日：2021-11-04

Applicant: Hitachi High-Tech Corporation

Inventor： Takuma Yamamoto

IPC: H01J37/22 ,  H01J37/244 ,  H01J37/28

CPC classification number: H01J37/222 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/221 ,  H01J2237/2448 ,  H01J2237/24475

Abstract: Even when the amount of overlay deviation between patterns located in different layers is large, correct measurement of the amount of overlay deviation is stably performed. The charged particle beam device includes a charged particle beam irradiation unit that irradiates a sample with a charged particle beam, a first detection unit that detects secondary electrons from the sample, a second detection unit that detects backscattered electrons from the sample, and an image processing unit that generates a first image including an image of a first pattern located on the surface of the sample based on an output of the first detection unit, and generates a second image including an image of a second pattern located in a lower layer than the surface of the sample based on an output of the second detection unit. A control unit adjusts the position of a measurement area in the first image based on a first template image for the first image, and adjusts the position of a measurement area in the second image based on a second template image for the second image.

公开(公告)号：US11715619B2

公开(公告)日：2023-08-01

申请号：US17713189

申请日：2022-04-04

Applicant: ASML Netherlands B.V.

Inventor： Yongxin Wang ,  Weiming Ren ,  Zhonghua Dong ,  Zhongwei Chen

IPC: H01J37/244 ,  H01J37/28 ,  G01N23/2251

CPC classification number: H01J37/244 ,  G01N23/2251 ,  H01J37/28 ,  H01J2237/24465 ,  H01J2237/24495 ,  H01J2237/24507 ,  H01J2237/24578 ,  H01J2237/24592 ,  H01J2237/2817

Abstract: Systems and methods are provided for charged particle detection. The detection system can comprise a signal processing circuit configured to generate a set of intensity gradients based on electron intensity data received from a plurality of electron sensing elements. The detection system can further comprise a beam spot processing module configured to determine, based on the set of intensity gradients, at least one boundary of a beam spot; and determine, based on the at least one boundary, that a first set of electron sensing elements of the plurality of electron sensing elements is within the beam spot. The beam spot processing module can further be configured to determine an intensity value of the beam spot based on the electron intensity data received from the first set of electron sensing elements and also generate an image of a wafer based on the intensity value.

公开(公告)号：US11713964B1

公开(公告)日：2023-08-01

申请号：US17574055

申请日：2022-01-12

Applicant: Applied Materials Israel Ltd.

Inventor： David Goldovsky ,  Ido Almog ,  Ronny Barnea

IPC: G01B15/04 ,  H01J37/285 ,  H01J37/244 ,  H01J37/28

CPC classification number: G01B15/04 ,  H01J37/244 ,  H01J37/28 ,  H01J37/285

Abstract: Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.

公开(公告)号：US20230238290A1

公开(公告)日：2023-07-27

申请号：US18152252

申请日：2023-01-10

Applicant: Hitachi High-Tech Corporation

Inventor： Naoaki KONDO ,  Yuki DOI ,  Atsushi MIYAMOTO ,  Hideki NAKAYAMA ,  Hirohiko KITSUKI

IPC: H01L21/66 ,  G06T7/13 ,  H01J37/28 ,  G01N21/956 ,  G01N21/95

CPC classification number: H01L22/12 ,  G06T7/13 ,  H01J37/28 ,  G01N21/95607 ,  G01N21/9503 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: A defect observation method includes, as steps executed by a computer system, a first step of acquiring, as a bevel image, an image captured using defect candidate coordinates in a bevel portion as an imaging position by using a microscope or an imaging apparatus; and a second step of detecting a defect in the bevel image. The second step includes a step of determining whether there is at least one portion among a wafer edge, a wafer notch, and an orientation flat in the bevel image, a step of switching and selectively applying a defect detection scheme of detecting the defect from the bevel image from a plurality of schemes which are candidates based on a determination result, and a step of executing a process of detecting the defect from the bevel image in conformity with the switched scheme.

公开(公告)号：US20230230799A1

公开(公告)日：2023-07-20

申请号：US17928691

申请日：2020-07-14

Applicant: Hitachi High-Tech Corporation

Inventor： Yuta IMAI ,  Junichi KATANE

IPC: H01J37/22 ,  H01J37/28 ,  H01J37/26

CPC classification number: H01J37/222 ,  H01J37/28 ,  H01J37/265 ,  H01J2237/226 ,  H01J2237/24578

Abstract: Provided is a sample image observation device including an SEM and a control system configured to control the SEM. An observation region of a sample is divided into a plurality of sections, and restoration processing is performed on an image which is acquired by irradiating each section with a sparse electron beam, based on scanning characteristics in the section. A reduction in quality of a restored image due to a beam irradiation position deviation caused by a scanning response is prevented and restoration with high accuracy and high throughput under a condition for preventing sample damage is possible.

公开(公告)号：US20230230796A1

公开(公告)日：2023-07-20

申请号：US18009898

申请日：2020-07-03

Applicant: Hitachi High-Tech Corporation

Inventor： Tomohito NAKANO ,  Makoto SUZUKI ,  Yuzuru MIZUHARA ,  Ryota WATANABE

IPC: H01J37/141 ,  H01J37/28 ,  H01J37/21 ,  H01J37/153

CPC classification number: H01J37/141 ,  H01J37/28 ,  H01J37/21 ,  H01J37/153 ,  H01J2237/216

Abstract: This charged particle beam device comprises: a charged particle beam source that generates charged particle beams; an objective lens in which coil current is inputted to focus the charged particle beams on a sample; a control unit that controls the coil current; a hysteresis characteristics storage unit that stores hysteresis characteristics information of the objective lens; a history information storage unit that stores history information relating to the coil current; and an estimating unit that estimates the magnetic field generated by the objective lens based on the coil current, the history information, and the hysteresis characteristic information, and has a magnetic field correction unit that, when the absolute value of the change amount of the coil current is greater than a prescribed value, further adds to the magnetic field estimated by the estimating unit a correction value according to the coil current and its change amount, correcting the magnetic field generated by the objective lens.

公开(公告)号：US20230230209A1

公开(公告)日：2023-07-20

申请号：US18155289

申请日：2023-01-17

Applicant: Carl Zeiss Microscopy GmbH

Inventor： Manuel AMTHOR ,  Daniel Haase ,  Ralf Engelmann

IPC: G06T5/00 ,  H01J37/28 ,  H01J37/22

CPC classification number: G06T5/002 ,  H01J37/28 ,  H01J37/222 ,  G06T2207/10061 ,  H01J2237/221

Abstract: A method can be used for sensing and processing image data for an object to be imaged. The object is scanned incompletely by virtue of regions (eB) of the object being sensed, where the sensed image regions (eB) alternate with non-sensed image regions (neB) of the object. Image data (rBD) of the non-sensed image regions (neB) are reconstructed on the basis of the sensed image data (eBD) of the sensed image regions (eB). A noise signal (N) of the sensed image data (eBD) of the sensed regions (eB) is ascertained and transferred to the reconstructed image data (rBD) of the non-sensed regions (neB), so that a user obtains a homogeneous visual impression in relation to the noise arising in the overall image data of the object visualized in a resultant overall image (rGBInv).

公开(公告)号：US11703468B2

公开(公告)日：2023-07-18

申请号：US17365832

申请日：2021-07-01

Applicant: FEI Company

Inventor： Oleksii Kaplenko ,  Jan Klusá{hacek over (c)}ek ,  Tomá{hacek over (s)} Tůma ,  Mykola Kaplenko ,  Ond{hacek over (r)}ej Machek

IPC: G01N23/2252 ,  G01N23/20 ,  G01N23/203 ,  G01N23/04 ,  G06N3/02 ,  G01N23/083 ,  H01J37/28

CPC classification number: G01N23/2252 ,  G01N23/04 ,  G01N23/083 ,  G01N23/203 ,  G01N23/20083 ,  G06N3/02 ,  G01N2223/072 ,  H01J37/28 ,  H01J2237/2807

Abstract: Method and system are disclosed for determining sample composition from spectral data acquired by a charged particle microscopy system. Chemical elements in a sample are identified by processing the spectral data with a trained neural network (NN). If the identified chemical elements not matching with a known elemental composition of the sample, the trained NN is retrained with the spectral data and the known elemental composition of the sample. The retrained NN can then be used to identify chemical elements within other samples.