公开(公告)号：US20150107879A1

公开(公告)日：2015-04-23

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  C04B41/00 ,  H05K1/14

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US20150068032A1

公开(公告)日：2015-03-12

申请号：US14023757

申请日：2013-09-11

Applicant: Ronald Steven Cok

Inventor： Ronald Steven Cok

IPC: H05K3/46

CPC classification number: G06F3/047 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01L29/413 ,  H01L33/42 ,  H01L51/5215 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/117 ,  H05K3/465 ,  H05K3/4664 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  Y10T29/49155

Abstract: A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.

Abstract translation: 制造多层微线结构的方法包括提供具有衬底边缘的衬底和形成在衬底上的第一和第二层。 一个或多个微通道被印刷在第一和第二层中的每一个以及位于压印的微通道中的第一和第二微细线中，微线形成每个层中暴露的连接焊盘的至少一部分。 对于第二层边缘的至少一部分，第二层边缘比距第一层边缘更远离基板边缘，使得第一连接焊盘通过第二层曝光。

公开(公告)号：US08975527B2

公开(公告)日：2015-03-10

申请号：US13437033

申请日：2012-04-02

Applicant: Hidekiyo Takaoka

Inventor： Hidekiyo Takaoka

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K3/4614 ,  H05K3/4632 ,  H05K3/4691 ,  H05K2201/09036

Abstract: A circuit board prevents breakage at a boundary between a rigid region and a flexible region and includes a body including stacked flexible sheets, and rigid regions and a flexible region more flexible than the rigid regions. A circuit is defined by a conductor provided in the body. In the flexible region on a principal surface of the body, grooves are arranged to be in contact with boundaries between the flexible region and the rigid regions and to extend along the boundaries.

Abstract translation: 电路板防止在刚性区域和柔性区域之间的边界处的断裂，并且包括包括堆叠的柔性片材的主体以及比刚性区域更柔性的刚性区域和柔性区域。 电路由身体中提供的导体限定。 在主体的主表面上的柔性区域中，凹槽布置成与柔性区域和刚性区域之间的边界接触并且沿边界延伸。

公开(公告)号：US08963672B2

公开(公告)日：2015-02-24

申请号：US14129148

申请日：2012-06-21

Applicant: Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H01F27/29 ,  H01F27/28 ,  H05K1/11 ,  H05K3/20 ,  H05K1/16 ,  H05K1/02

CPC classification number: H05K1/115 ,  H01F27/2804 ,  H05K1/0265 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/118 ,  H05K1/165 ,  H05K3/20 ,  H05K2201/0305 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/09745

Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Abstract translation: 该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。 第一导体图案和第二导体图案粘附到绝缘芯基板。 第二导体图案具有第一表面和第二表面。 第二导体图案具有凹部和通孔。 通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。 第一导体图案位于凹部的开口处。 第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。

公开(公告)号：US20150036299A1

公开(公告)日：2015-02-05

申请号：US14306056

申请日：2014-06-16

Applicant: Samsung Display Co., Ltd.

Inventor： Jun NAMKUNG ,  Seong-Jun LEE

IPC: H05K1/02

CPC classification number: G02F1/133345 ,  G02F1/133305 ,  G02F2001/133311 ,  G02F2001/133388 ,  G02F2201/50 ,  H01L27/3244 ,  H01L27/3276 ,  H01L51/5253 ,  H01L2251/5338 ,  H01L2251/566 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09036 ,  H05K2201/10136 ,  Y10T428/10 ,  Y10T428/1036

Abstract: A flexible display device that can suppress spread of cracks of an inorganic layer is provided. A flexible display device includes a flexible substrate including a display area and a periphery surrounding the display area, an inorganic layer formed on the flexible substrate, a display unit formed on the display area, and a thin film encapsulation layer covering the display unit. The inorganic layer includes an opening disposed on a periphery between edges of the flexible substrate and the thin film encapsulation layer.

Abstract translation: 提供了可以抑制无机层的裂纹扩展的柔性显示装置。 柔性显示装置包括柔性基板，其包括显示区域和围绕显示区域的外围，形成在柔性基板上的无机层，形成在显示区域上的显示单元和覆盖显示单元的薄膜封装层。 无机层包括设置在柔性基板的边缘与薄膜封装层的边缘之间的开口。

公开(公告)号：US20150022953A1

公开(公告)日：2015-01-22

申请号：US14173140

申请日：2014-02-05

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： YONG-HEON CHO

IPC: H05K7/00 ,  H05K1/02

CPC classification number: H05K7/00 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/147 ,  H05K3/28 ,  H05K2201/09036 ,  H05K2201/2009

Abstract: A display device includes: a display substrate, and a flexible printed circuit film connected to the display substrate. The flexible printed circuit film includes a main body including a bending region, and a first cover layer disposed on a first side of the main body, and the first cover layer has a first opening exposing a portion of the bending region.

Abstract translation: 显示装置包括：显示基板和连接到显示基板的柔性印刷电路膜。 柔性印刷电路膜包括具有弯曲区域的主体和设置在主体的第一侧上的第一覆盖层，第一覆盖层具有暴露弯曲区域的一部分的第一开口。

公开(公告)号：US20150021402A1

公开(公告)日：2015-01-22

申请号：US14173815

申请日：2014-02-06

Applicant: David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

Inventor： David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q7/00

CPC classification number: G06K19/07794 ,  G06K19/07769 ,  H01F38/14 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49162

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

Abstract translation: 用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及 扩展天线（EA）有助于增强天线（BA）的电感。 还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

公开(公告)号：US20150008806A1

公开(公告)日：2015-01-08

申请号：US14322538

申请日：2014-07-02

Applicant: Schroff GmbH

Inventor： Dietmar Mann ,  Sergej Dizel ,  Dietmar Gauges ,  Jochen Müller

IPC: H05K5/02 ,  H05K7/14

CPC classification number: H05K5/0256 ,  H05K1/144 ,  H05K7/1427 ,  H05K7/1445 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y10T29/53183

Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.

Abstract translation: 用于容纳电子插件卡的机柜具有用于插入插卡和第一和第二垂直背板的前后卡筐。 第一背板的前侧面向机柜的前部，第二个背板的前侧面向机柜后部。 距离件连接两个背板，并且在两个背板的至少一个后侧设置沉孔。 钻孔后沉孔的深度或背板的残余厚度的尺寸使得第二背板前侧与机柜前部之间的距离为预定值。 这确保了推到第二背板上的插入卡被完全接收在后卡筐内，插卡的前板与后卡筐齐平。

公开(公告)号：US08926785B2

公开(公告)日：2015-01-06

申请号：US13523935

申请日：2012-06-15

Applicant: Takahiro Yada

Inventor： Takahiro Yada

IPC: B29C65/00 ,  B32B37/00 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T156/1002 ,  Y10T156/1066 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/24612

Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.

Abstract translation: 一种用于制造具有框架部分和连接到框架部分的多个部分的多片板的方法包括：从用于框架部分的制造面板形成框架部分，通过检查片段的质量来分选多个可接受片段， 在框架部分和可接受的片部分中形成切口部分，使得切口部分允许相对于框架部分布置可接受的片部分，将片部分和框架部分临时固定在相应的位置，将粘合剂注入 当框架部分和片段彼此临时固定时，由切口部分形成的空腔，以及通过固化注入到空腔中的粘合剂将可接受片段与框架部分接合。

公开(公告)号：US20140345924A1

公开(公告)日：2014-11-27

申请号：US13902149

申请日：2013-05-24

Applicant: Nokia Corporation

Inventor： Mark Lee ALLEN ,  Chris BOWER ,  Darryl COTTON

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0272 ,  H01L23/52 ,  H01L24/00 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/24101 ,  H01L2224/24226 ,  H01L2224/24997 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/82101 ,  H01L2224/82138 ,  H01L2224/8284 ,  H01L2224/82862 ,  H01L2224/82874 ,  H01L2224/82877 ,  H01L2224/82986 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K1/092 ,  H05K1/097 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0257 ,  H05K2201/0302 ,  H05K2201/09036 ,  H05K2201/09227 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid channel through the fluid channel to a component end of the fluid channel, the component end extending to the component region of the substrate to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region, formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir and fluid channel.

Abstract translation: 包括流体储存器和连接的流体通道的基板，所述流体储存器远离所述基板的部件区域定位，所述流体通道被配置为从所述流体储存器延伸以在所述流体储存器的储存器端部处从所述流体储存器引导导电流体 通过流体通道的流体通道流到流体通道的部件端，部件端部延伸到基板的部件区域，以使得能够形成与适当地定位在部件区域中的电子部件的连接器的电连接，形成 的电连接，允许使用一个或多个流体储存器和流体通道将电子部件互连到其他电子部件。