公开(公告)号：US08908386B2

公开(公告)日：2014-12-09

申请号：US13564483

申请日：2012-08-01

Applicant: Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

Inventor： Zhiwei Jiang ,  Xiaochen Chen ,  Zhipeng Guo

IPC: H05K7/10 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: A printed circuit board assembly (PCBA) chip package component includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad.

Abstract translation: 印刷电路板组件（PCBA）芯片封装组件包括：模块板和接口板。 第一个焊盘设置在模块板的底部，第二个焊盘设置在接口板的顶部，第二个焊盘为城堡式结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。

公开(公告)号：US20140008117A1

公开(公告)日：2014-01-09

申请号：US13541649

申请日：2012-07-03

Applicant: Hsin-Mao Huang

Inventor： Hsin-Mao Huang

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/025 ,  H05K2201/0939 ,  H05K2201/09727 ,  Y02P70/611

Abstract: A connecting structure of a circuit board is provided. The connecting structure includes at least one connecting trace and at least one connecting pad. The connecting trace and the connecting pad are disposed on a surface, or inside of the circuit board. The connecting pad has a first end surface and a second end surface at two opposite end surfaces thereof. The first end surface is a convex curved surface and connected to the connecting trace, and a cross section area of the connecting pad is gradually increased from the first end surface.

Abstract translation: 提供电路板的连接结构。 连接结构包括至少一个连接迹线和至少一个连接焊盘。 连接迹线和连接焊盘设置在电路板的表面或内部。 连接垫在其两个相对的端面处具有第一端面和第二端面。 第一端面是凸曲面并连接到连接迹线，并且连接焊盘的横截面积从第一端面逐渐增大。

公开(公告)号：US20130279134A1

公开(公告)日：2013-10-24

申请号：US13862038

申请日：2013-04-12

Applicant: CANON KABUSHIKI KAISHA

Inventor： Seiji Hayashi ,  Takuya Kondo ,  Shoji Matsumoto

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48227 ,  H05K1/0228 ,  H05K1/0242 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/114 ,  H05K1/116 ,  H05K1/14 ,  H05K1/141 ,  H05K1/162 ,  H05K1/18 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09454 ,  H05K2201/09463 ,  H05K2201/09636 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract translation: 第一和第二信号布线图案形成在第一导体层中。 通过第一通孔电连接到第一信号布线图案的第一电极焊盘和通过第二通孔电连接到第二信号布线图案的第二电极焊盘形成在作为表面层的第二导体层中。 第三导体层设置在第一导体层和第二导体层之间，绝缘体插在这些导体层之间。 电连接到第一通孔的第一焊盘形成在第三导体层中。 第一焊盘包括与垂直于印刷电路板的表面的方向观察的与第二电极焊盘重叠并且通过绝缘体与第二电极焊盘相对的相对部分。 这使得能够减少在信号布线之间引起的串扰噪声。

公开(公告)号：US20130269995A1

公开(公告)日：2013-10-17

申请号：US13851946

申请日：2013-03-27

Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Lu-Qing MENG ,  Hsing-Suang KAO

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/0939

Abstract: A printed circuit board is provided. The printed circuit board includes a number of welding points in a row for soldering of a series of welding feet of a component thereto. Each welding point includes a welding hole defined in the printed circuit board and a C-shaped welding pad surrounding the welding hole. The welding pads have an opening facing an adjacent welding pad.

Abstract translation: 提供印刷电路板。 印刷电路板包括多个焊接点，用于焊接组件的一系列焊脚。 每个焊接点包括限定在印刷电路板中的焊接孔和围绕焊接孔的C形焊接焊盘。 焊盘具有面向相邻焊接垫的开口。

公开(公告)号：US20130052099A1

公开(公告)日：2013-02-28

申请号：US13572001

申请日：2012-08-10

Applicant: Burkhardt REICHMUTH

Inventor： Burkhardt REICHMUTH

IPC: B01L3/02

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument with a cable holding space in which a printed circuit board cable device is arranged. The printed circuit board cable device has at least one printed circuit board with first and second sides and, arranged in succession, at least one first circuit board section, at least one second circuit board section and at least one third circuit board section, and with the circuit board having a number of conductor tracks arranged in parallel with respect to one another and extending from a first track section arranged in the first circuit board section, via the second circuit board section to the third circuit board section, in which a second track section is arranged, wherein, in the second circuit board section, at least one conductor track is arranged on the first side of the board and at least one track is arranged on the second side.

Abstract translation: 本发明涉及具有电缆保持空间的实验室样品仪器，其中布置有印刷电路板电缆装置。 印刷电路板电缆装置具有至少一个具有第一和第二侧面的印刷电路板，并且连续地布置有至少一个第一电路板部分，至少一个第二电路板部分和至少一个第三电路板部分，并且具有 所述电路板具有相对于彼此并联布置并从布置在所述第一电路板部分中的第一轨道部分经由所述第二电路板部分延伸到所述第三电路板部分的多个导体轨迹，所述第二轨道 其中，在第二电路板部分中，至少一个导体轨道布置在板的第一侧上，并且至少一个轨道布置在第二侧上。

公开(公告)号：US08351070B2

公开(公告)日：2013-01-08

申请号：US12318961

申请日：2009-01-13

Applicant: Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

Inventor： Kwansoo Yun ,  Prasad Jvv ,  Jaewoo Joung ,  Shanghoon Seo ,  Sangdo Cho

IPC: G06F15/00 ,  H04N1/60

CPC classification number: H05K3/125 ,  H05K1/11 ,  H05K3/0005 ,  H05K3/0008 ,  H05K2201/0939

Abstract: A method of obtaining image data for printing a circular pad having a radius R by forming ink blots having a radius r in an overlapping manner. The method can include: setting a base pitch as the base distance between adjacent ink blots, arranging the vector data of the pad in an x-y coordinate system, setting a first base point in the coordinate system, selecting a first determination point that is separated from the first base point by a unit distance along each of the x-axis and y-axis in any one direction of 45 degrees and 135 degrees, comparing the distance from the first base point to the first determination point with the base pitch, and storing the coordinates of the first determination point as print data if the distance from the first base point to the first determination point is greater than or equal to the base pitch.

Abstract translation: 通过以重叠的方式形成具有半径r的油墨印迹，获得用于印刷具有半径R的圆形垫的图像数据的方法。 该方法可以包括：将基座间距设置为相邻墨迹之间的基本距离，将该垫的矢量数据排列在xy坐标系中，在坐标系中设置第一基点，选择与 第一基点以45度和135度的任何一个方向沿着x轴和y轴的每一个单位距离，将从第一基点到第一确定点的距离与基座间距进行比较，并且存储 如果从第一基点到第一确定点的距离大于或等于基本间距，则第一确定点的坐标作为打印数据。

公开(公告)号：US06316736B1

公开(公告)日：2001-11-13

申请号：US09092821

申请日：1998-06-08

Applicant: Vivek Amir Jairazbhoy ,  Richard Keith McMillan

Inventor： Vivek Amir Jairazbhoy ,  Richard Keith McMillan

IPC: H01R909

CPC classification number: H05K3/3442 ,  H01L2224/10175 ,  H01L2924/384 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.

Abstract translation: 这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。 印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。

公开(公告)号：US5898574A

公开(公告)日：1999-04-27

申请号：US926082

申请日：1997-09-02

Applicant: Wiling Tan ,  Raymond Teh Wai Tiong ,  Lian It Song

Inventor： Wiling Tan ,  Raymond Teh Wai Tiong ,  Lian It Song

IPC: H01C1/144 ,  H01C17/00 ,  H05K3/34 ,  H05K7/02

CPC classification number: H01C17/006 ,  H01C1/144 ,  H05K3/3442 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09809 ,  H05K2201/10643 ,  Y02P70/613

Abstract: An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) formed on an inner region of the body, and a second terminal (210) formed around outer regions of the body surrounding the first terminal (205).

Abstract translation: 电气设备（400）包括其上形成有焊盘（215,220）的衬底（300）和安装到焊盘（215,220）的自对准电子部件（200）。 自对准电子部件（200）包括具有圆筒形状的主体，形成在主体的内部区域上的第一端子（205）和围绕第一端子的主体的外部区域周围形成的第二端子（210） 205）。