公开(公告)号：US09640881B2

公开(公告)日：2017-05-02

申请号：US14904702

申请日：2014-07-04

Applicant: PHOENIX CONTACT GMBH & CO. KG

Inventor： Juergen Feye-Hohmann

IPC: H01R13/42 ,  H01R12/58 ,  H05K3/32 ,  H01R43/20 ,  F16B37/06 ,  H01R4/06 ,  H01R4/36 ,  H01R12/51 ,  H01R12/53

CPC classification number: H01R12/585 ,  F16B37/067 ,  H01R4/06 ,  H01R4/36 ,  H01R12/515 ,  H01R12/53 ,  H01R12/58 ,  H01R43/205 ,  H05K3/325 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611

Abstract: A contact device for establishing an electrical connection to a contact point of a printed circuit board is insertable into a contact hole arranged at the contact point, so as to establish an electrical connection to the contact point of the printed circuit board. The contact device includes a contact element having a deformation portion and a screw element operable to be screwed into the contact element. The deformation portion is in a longitudinal extension state when in a pre-assembly state and is operable to be deformed out of the longitudinal extension state when in an assembled state by means of the screw element being screwed at least part way into the contact element.

公开(公告)号：US09638400B2

公开(公告)日：2017-05-02

申请号：US14428226

申请日：2013-09-13

Applicant: LG DISPLAY CO., LTD.

Inventor： Minsoo Kang ,  Ducksu Oh ,  Sung-Ryun Lim ,  Dong-Hyuk Heo

IPC: H01L51/50 ,  F21V19/00 ,  H05B33/06 ,  H05B33/14 ,  H05B33/28 ,  H05K1/18 ,  H05K3/40 ,  F21K9/20 ,  H05K3/32 ,  F21Y105/00 ,  F21Y115/15

CPC classification number: F21V19/0025 ,  F21K9/20 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/50 ,  H01L2251/5361 ,  H05B33/06 ,  H05B33/145 ,  H05B33/28 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4015 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611

Abstract: The present invention discloses a lighting module using an organic light emitting device (OLED) and particularly, a lighting module using the OLED which stably couples a power supply terminal to an electrode pad which is formed on a glass substrate of an OLED illumination plate.

公开(公告)号：US09609775B2

公开(公告)日：2017-03-28

申请号：US14435682

申请日：2013-10-25

Applicant: NSK Ltd.

Inventor： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC: H05K7/00 ,  H05K7/02 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L23/14

CPC classification number: H05K7/02 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

公开(公告)号：US20170084861A1

公开(公告)日：2017-03-23

申请号：US15364604

申请日：2016-11-30

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Takeshi Fukunaga

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  H01L27/32

CPC classification number: H01L51/524 ,  G01N33/497 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3227 ,  H01L27/3262 ,  H01L27/3276 ,  H01L27/3279 ,  H01L27/3288 ,  H01L27/329 ,  H01L31/153 ,  H01L33/62 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5315 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/093 ,  H05K2201/10128 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

公开(公告)号：US09485868B2

公开(公告)日：2016-11-01

申请号：US14762671

申请日：2014-09-17

Applicant: Nantong Fujitsu Microelectronics Co., Ltd.

Inventor： Yujuan Tao

IPC: H05K1/18 ,  H05K1/11 ,  H01L25/10 ,  H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H05K1/181 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/10 ,  H01L25/16 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/113 ,  H05K2201/10234 ,  H05K2201/1031 ,  H05K2201/10378 ,  H05K2201/10522 ,  H05K2201/10962 ,  H05K2201/10977 ,  H01L2224/81 ,  H01L2924/00

Abstract: A package structure, including: a circuit board, including a first surface and a second surface opposite to the first surface, where the circuit board possesses multiple carrying units arranged in a matrix form, each of which possesses multiple input pads on the first surface and multiple output pads on the second surface, where the input pads and the output pads are interconnected electrically; a pre-packaged panel, including a first encapsulation layer, which possesses multiple integrating units arranged in a matrix form, wherein each of the integrating units possesses at least one semiconductor chip with multiple first pads, where first metal bumps are disposed on the first pads; wherein the pre-packaged panel is mounted on the first surface; a filling layer, filling a space between the first surface and the pre-packaged panel; and second metal bumps, disposed on the output pads. Accordingly, the package structure improves package efficiency.

Abstract translation: 一种封装结构，包括：电路板，包括与所述第一表面相对的第一表面和第二表面，其中所述电路板具有布置成矩阵形式的多个承载单元，每个所述承载单元在所述第一表面上具有多个输入焊盘， 第二表面上的多个输出焊盘，其中输入焊盘和输出焊盘电连接; 包括第一封装层的预封装面板，其具有以矩阵形式布置的多个积分单元，其中每个积分单元具有至少一个具有多个第一焊盘的半导体芯片，其中第一金属凸块设置在第一焊盘上 ; 其中所述预包装的面板安装在所述第一表面上; 填充层，填充第一表面和预包装面板之间的空间; 和第二金属凸块，设置在输出垫上。 因此，封装结构提高了封装效率。

公开(公告)号：US20160273751A1

公开(公告)日：2016-09-22

申请号：US14870503

申请日：2015-09-30

Applicant: General Electric Company

Inventor： Kun Xiao ,  Zhifeng Bao

IPC: F21V23/06 ,  F21K99/00 ,  F21V23/00

CPC classification number: F21V23/06 ,  F21K9/232 ,  F21K9/238 ,  F21V23/006 ,  F21Y2103/33 ,  F21Y2115/10 ,  H01R12/57 ,  H01R12/721 ,  H01R12/737 ,  H01R33/09 ,  H01R33/945 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/1031 ,  Y02P70/611

Abstract: The present invention comprises a type of connector used to electrically connect a light source board and a driver board in LED lighting equipment, and the LED lighting equipment that uses this connector. The connector is mounted on the light source board, and comprises two or more conduction terminals, each of which comprises at least one flexible arm whose points of contact with the driver board can achieve an electronic connection between the light source board and the driver board. Compared to earlier models, the connector structure of the present invention is simple and easy to assemble and fabricate, facilitating large-scale automated production of LED lighting equipment and helping to reduce costs.

Abstract translation: 本发明包括一种用于电连接LED照明设备中的光源板和驱动器板的连接器，以及使用该连接器的LED照明设备。 连接器安装在光源板上，并且包括两个或更多个导电端子，每个导电端子包括至少一个柔性臂，其与驱动器板的接触点可以实现光源板和驱动器板之间的电子连接。 与以前的型号相比，本发明的连接器结构简单易于组装和制造，促进了LED照明设备的大规模自动化生产并且有助于降低成本。

公开(公告)号：US20160260546A1

公开(公告)日：2016-09-08

申请号：US15059047

申请日：2016-03-02

Applicant: TDK CORPORATION

Inventor： Masahiro MORI ,  Takayuki SAKAI ,  Katsumi KOBAYASHI

IPC: H01G4/228 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/301 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a chip component and an external terminal. The external terminal includes a terminal electrode connection part, a mounting connection part, and a support part. The terminal electrode connection part is arranged to face an end surface electrode part of a terminal electrode of the chip component. The mounting connection part is connectable to a mounting surface. The support part faces one side surface of an element body of the chip component closest to the mounting surface so as to support the one side surface spaced from the mounting surface. A bonding region and a non-bonding region are formed between the terminal electrode connection part of the external terminal and the end surface electrode part of the terminal electrode. The non-bonding region is formed from the terminal electrode connection part to the support part.

Abstract translation: 电子设备包括芯片组件和外部终端。 外部端子包括端子电极连接部，安装连接部和支撑部。 端子电极连接部被配置为与芯片部件的端子电极的端面电极部相对。 安装连接部分可连接到安装表面。 支撑部分面向最靠近安装表面的芯片部件的元件主体的一个侧表面，以支撑与安装表面间隔开的一个侧表面。 在外部端子的端子电极连接部和端子电极的端面电极部之间形成接合区域和非接合区域。 非接合区域由端子电极连接部分形成到支撑部分。

公开(公告)号：US09368517B2

公开(公告)日：2016-06-14

申请号：US14255394

申请日：2014-04-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Takeshi Fukunaga

IPC: H05B33/04 ,  H05B33/02 ,  H01L27/12 ,  G01N33/497 ,  H01L27/32 ,  H01L51/52 ,  H01L33/62 ,  H01L31/153 ,  H05K3/36 ,  H05K1/02 ,  H05K3/32

CPC classification number: H01L51/524 ,  G01N33/497 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3227 ,  H01L27/3262 ,  H01L27/3276 ,  H01L27/3279 ,  H01L27/3288 ,  H01L27/329 ,  H01L31/153 ,  H01L33/62 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5315 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/093 ,  H05K2201/10128 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Abstract translation: 提供具有均匀性高的图像质量的发光装置。 面向其上形成有发光元件（102）的基板（第一基板）（101）设置有印刷布线板（第二基板）（107）。 印刷电路板（107）上的PWB侧布线（第二组布线）（110）通过各向异性导电膜（105a，105b）与元件侧布线（第一组布线）（103,104）电连接。 此时，由于使用低电阻铜箔来形成PWB侧布线（110），可以降低元件侧布线（103,104）的电压降和信号的延迟。 因此，提高了图像质量的均匀性，并且提高了驱动器电路部分的操作速度。

公开(公告)号：US20160156115A1

公开(公告)日：2016-06-02

申请号：US14904702

申请日：2014-07-04

Applicant: PHOENIX CONTACT GMBH & CO. KG

Inventor： Juergen Feye-Hohmann

IPC: H01R12/58 ,  H01R43/20

CPC classification number: H01R12/585 ,  F16B37/067 ,  H01R4/06 ,  H01R4/36 ,  H01R12/515 ,  H01R12/53 ,  H01R12/58 ,  H01R43/205 ,  H05K3/325 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611

Abstract: A contact device for establishing an electrical connection to a contact point of a printed circuit board is insertable into a contact hole arranged at the contact point, so as to establish an electrical connection to the contact point of the printed circuit board. The contact device includes a contact element having a deformation portion and a screw element operable to be screwed into the contact element. The deformation portion is in a longitudinal extension state when in a pre-assembly state and is operable to be deformed out of the longitudinal extension state when in an assembled state by means of the screw element being screwed at least part way into the contact element.

Abstract translation: 用于建立与印刷电路板的接触点的电连接的接触装置可插入布置在接触点处的接触孔中，以便建立到印刷电路板的接触点的电连接。 接触装置包括具有变形部分的接触元件和可操作以拧入接触元件的螺钉元件。 当处于预组装状态时，变形部分处于纵向延伸状态，并且当处于组装状态时，通过螺纹元件至少部分地拧入接触元件中，该变形部分可操作以变形到纵向延伸状态之外。

公开(公告)号：US09350105B2

公开(公告)日：2016-05-24

申请号：US14803444

申请日：2015-07-20

Applicant: JOINSET CO., LTD. ,  Sun-Ki Kim

Inventor： Sun-Ki Kim ,  Tae-Man Kang ,  Eung-Won Kim

IPC: H01R13/24 ,  H01R4/02 ,  B23K1/00 ,  B23K33/00 ,  H01R12/57 ,  H01R12/71 ,  H05K3/34

CPC classification number: H01R13/2464 ,  B23K1/0016 ,  B23K33/002 ,  H01R4/02 ,  H01R4/028 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2421 ,  H01R13/2428 ,  H05K3/341 ,  H05K2201/1031 ,  Y02P70/611

Abstract: Provided is a surface-mount type electric connecting terminal which is disposed between opposing conductive objects and is configured to electrically connecting the objects while easily adjusting pressing force and recovery force. The electric connecting terminal includes a cylindrical fixed member which is made from a metallic material; a cylindrical movable member which is slidably inserted in the fixed member and is made from a metallic material; and an electrical conductive spring which is accommodated in the fixed member and whose one end contacts with the bottom of the fixed member and the other end contacts with the bottom of the movable member for thereby allowing the movable member to elastically slide against the fixed member.

Abstract translation: 提供了一种表面安装型电连接端子，其设置在相对的导电物体之间，并且被配置为电连接物体，同时容易地调节按压力和恢复力。 电连接端子包括由金属材料制成的圆柱形固定构件; 可滑动地插入固定构件并由金属材料制成的圆柱形可动构件; 以及导电弹簧，其容纳在固定构件中，并且其一端与固定构件的底部接触，另一端与可动构件的底部接触，从而允许可动构件弹性滑动抵靠固定构件。