公开(公告)号：US07766499B2

公开(公告)日：2010-08-03

申请号：US11936501

申请日：2007-11-07

Applicant: Jin Hee Park ,  Jung Tae Kang ,  Jin Ho Ha ,  Hyun Chul Bae ,  Joo Young Kim

Inventor： Jin Hee Park ,  Jung Tae Kang ,  Jin Ho Ha ,  Hyun Chul Bae ,  Joo Young Kim

IPC: G09F13/04 ,  G02F1/13357 ,  H01R33/09

CPC classification number: F21V19/0025 ,  G02F1/133603 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/182 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10856 ,  H05K2201/10878 ,  H01L2924/00014

Abstract: A light source unit including light emitting diodes mounted on a printed circuit board by not using a soldering method but a fitting method, and a backlight unit and liquid crystal display including the light source unit. The light source unit includes light emitting diodes including lead terminals and a printed circuit board including a fitting hole. Each of the lead terminals includes a base part and a fitting part protruding from the base part. The fitting part of the light emitting diode is fitted into the fitting hole of the printed circuit board and so that the light emitting diode is mounted on the printed circuit board.

Abstract translation: 一种光源单元，包括通过不使用焊接方法而不是使用拟合方法安装在印刷电路板上的发光二极管，以及包括该光源单元的背光单元和液晶显示器。 光源单元包括包括引线端子和包括装配孔的印刷电路板的发光二极管。 每个引线端子包括基部和从基部突出的嵌合部。 发光二极管的装配部分装配到印刷电路板的装配孔中，使得发光二极管安装在印刷电路板上。

公开(公告)号：US07706046B2

公开(公告)日：2010-04-27

申请号：US10863638

申请日：2004-06-08

Applicant: Frederick T. Bauer ,  Robert R. Turnbull ,  Thomas F. Guarr ,  Leroy J. Kloeppner ,  David L. Eaton ,  Joel A. Stray ,  Barry K. Nelson

Inventor： Frederick T. Bauer ,  Robert R. Turnbull ,  Thomas F. Guarr ,  Leroy J. Kloeppner ,  David L. Eaton ,  Joel A. Stray ,  Barry K. Nelson

IPC: G02F1/153

CPC classification number: B60R1/12 ,  B60R1/088 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2054

Abstract: According to the present invention, a rearview mirror comprises a first substrate having a front surface and a rear surface, a reflective coating disposed on a surface of the first substrate, and an electronic circuit component secured to the rear surface of the first substrate. The mirror element may be an electrochromic mirror element comprising a transparent second substrate positioned in front of the first substrate. The electronic component secured to the rear surface may be a component of a drive circuit for the electrochromic mirror element. The rearview mirror element may further comprise electrically conductive tracings provided on the rear surface of the first substrate electrically coupled to the electrical component. The tracings may be used to electrically couple the drive circuit to the electrodes of the electrochromic mirror element. The tracings may be deposited on the rear surface using numerous methods including inkjet printing techniques.

Abstract translation: 根据本发明，后视镜包括具有前表面和后表面的第一基板，设置在第一基板的表面上的反射涂层以及固定到第一基板的后表面的电子电路部件。 镜元件可以是电致变色镜元件，其包括位于第一衬底前面的透明第二衬底。 固定到后表面的电子部件可以是用于电致变色镜元件的驱动电路的部件。 后视镜元件还可以包括设置在电耦合到电气部件的第一基板的后表面上的导电跟踪。 跟踪可以用于将驱动电路电耦合到电致变色镜元件的电极。 可以使用包括喷墨印刷技术的许多方法将痕迹沉积在后表面上。

公开(公告)号：US20090201680A1

公开(公告)日：2009-08-13

申请号：US12318348

申请日：2008-12-29

Applicant: Hsien-Ching Chang ,  Tzu-Sung Chen

Inventor： Hsien-Ching Chang ,  Tzu-Sung Chen

IPC: B60Q1/00

CPC classification number: H05K3/326 ,  F21V19/0025 ,  F21V21/002 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01R4/2404 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/301 ,  H05K3/308 ,  H05K2201/0761 ,  H05K2201/09309 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10795 ,  H05K2203/1189 ,  H01L2924/00014

Abstract: An easy-to-assembly LED and substrate providing fast assembling, simple replacement and maintenance, exchangeable arrangement of LED (3) without wiring or welding process comprises: an assembling substrate (1) having sandwich-like structure, consists essentially of a plurality of conductive layers (10) and a plurality of non-conductive layers (11); a plurality of LED (3) having at least one lead partially insulated, all conductive sections and insulated sections of said LED (3) will correspond to the arrangement of conductive layers (10) and non-conductive layers (11) of said assembling substrate (1); and a power source (4).

Abstract translation: 一种易于组装的LED和基板，其提供快速组装，简单的更换和维护，LED（3）的可替换布置，无需布线或焊接工艺，包括：具有夹层结构的组装基板（1）基本上由多个 导电层（10）和多个非导电层（11）; 具有至少一个引线部分绝缘的多个LED（3），所述LED（3）的所有导电部分和绝缘部分将对应于所述组装衬底的导电层（10）和非导电层（11）的布置 （1）; 和电源（4）。

公开(公告)号：US20090174522A1

公开(公告)日：2009-07-09

申请号：US11970661

申请日：2008-01-08

Applicant: Martin Schulz ,  Peter Kanschat

Inventor： Martin Schulz ,  Peter Kanschat

IPC: H01C7/00

CPC classification number: H05K1/0203 ,  G01R1/203 ,  H01C1/014 ,  H01C1/08 ,  H01C1/14 ,  H01L2924/19107 ,  H05K1/0263 ,  H05K1/0268 ,  H05K3/328 ,  H05K2201/0209 ,  H05K2201/10022 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/049

Abstract: The invention relates to an arrangement comprising a shunt resistor with at least an electrically conductive first connecting leg and an electrically conductive second connecting leg. A resistance area of the shunt resistor is electrically connected to the first connecting leg and to the second connecting leg. The arrangement further comprises a circuit carrier with a first metallization and a second metallization. The first connecting leg is directly joined to the first metallization and the second connecting leg is directly joined to the second metallization. The resistance area of the shunt resistor is in thermal contact with the thermally conductive substrate by use of a thermal filler arranged between the resistance area and the substrate, and/or by directly contacting the resistance area with the substrate.The invention further relates to a method for producing an arrangement with a shunt resistor and a circuit carrier.

Abstract translation: 本发明涉及一种包括具有至少导电的第一连接腿和导电的第二连接腿的分流电阻器的装置。 分流电阻器的电阻区域电连接到第一连接腿部和第二连接腿部。 该装置还包括具有第一金属化和第二金属化的电路载体。 第一连接腿直接连接到第一金属化，第二连接腿直接连接到第二金属化。 分流电阻器的电阻区域通过使用布置在电阻区域和衬底之间的热填料和/或通过使电阻区域与衬底直接接触而与导热衬底热接触。 本发明还涉及一种用于产生具有分流电阻器和电路载体的装置的方法。

公开(公告)号：US20090086447A1

公开(公告)日：2009-04-02

申请号：US12243243

申请日：2008-10-01

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H05K3/30 ,  H05K5/00

CPC classification number: H05K3/303 ,  G07C9/00944 ,  H01L2924/1815 ,  H05K1/182 ,  H05K3/284 ,  H05K2201/10037 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49146

Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.

Abstract translation: 一种制造电子电路装置的方法包括制备具有至少一个突起的电子元件，将电子元件仅安装在电路板的第一侧上，使得突出部基本上保持与第一侧点接触 所述电路板在所述电路板和所述电子元件之间形成间隙，将所述电路板放置在模腔中，使得所述电路板的第二面与所述腔的内表面紧密接触。 该方法还包括通过用树脂材料填充空腔将电路板封装在壳体中，使得间隙填充有树脂材料。

公开(公告)号：US20090038826A1

公开(公告)日：2009-02-12

申请号：US12162740

申请日：2007-02-07

Applicant: Ki-Geon Lee

Inventor： Ki-Geon Lee

IPC: H05K7/20 ,  H05K1/11 ,  H05K1/16

CPC classification number: H05K1/0206 ,  H05K1/116 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10651

Abstract: A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop.

Abstract translation: 电路板的电路板和散热系统。 在电路基板中，在绝缘基板的两面分别形成涂布有导体的多个导电层区域，在绝缘基板的两侧的绝缘区域的两侧形成的导电层区域， 多个导电层区域包括穿过绝缘基板并在内壁上涂覆有导体的多个通孔，通孔中的导体导电多个导电层区域的涂覆导体，一个 基于绝缘区域将引线引脚连接到两侧的分离的导电层区域中的一个，另一个引脚与另一个导电层区域连接。 因此，电路板的高效散热可以防止元件故障，寿命降低，功率消耗增加和照度下降。

公开(公告)号：US20080314624A1

公开(公告)日：2008-12-25

申请号：US12090884

申请日：2006-10-13

Applicant: Maurice Alexander Hugo Donners

Inventor： Maurice Alexander Hugo Donners

IPC: H05K1/03 ,  H05K3/30

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

Abstract translation: 适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有适于安装在基板上的第一表面（3）的主体（2） （11），以及适于支撑所述表面安装装置（15）的第二表面（4）。 第二表面（4）相对于第一表面（3）倾斜。 支撑部件（1）还包括适于在基板（11）的第一基板导体（12）和表面安装装置（15）的第一电极（16）之间形成电接触的第一支撑部件导体（6） ）。 在将表面安装的装置（15）以倾斜的方式安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，表面安装装置（15）位于其上。

公开(公告)号：US20080224786A1

公开(公告)日：2008-09-18

申请号：US12075589

申请日：2008-03-12

Applicant: James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

Inventor： James L. Stolpman ,  Thomas A. Knecht ,  Jerry L. Shirar

IPC: H03B5/04 ,  H03L1/04

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10651

Abstract: An oscillator assembly includes an oscillator circuit that is configured to generate a frequency signal. A temperature compensation circuit is in communication with the oscillator circuit and adapted to adjust the frequency signal in response to changes in temperature. The oscillator and temperature compensation circuits are located within an oven. A heater and a temperature sensor in communication with the heater are also both located in the oven. The temperature sensor is adapted to directly control the heater in response to changes in temperature. In one embodiment, the oscillator components are mounted to a ball grid array substrate which, in turn, is mounted on a printed circuit board. In this embodiment, a resonator overlies the ball grid array substrate and a lid covers and defines an oven and enclosure for the resonator and the ball grid array substrate. The oscillator and temperature compensation circuit are defined on the ball grid array substrate.

Abstract translation: 振荡器组件包括被配置为产生频率信号的振荡器电路。 温度补偿电路与振荡器电路通信，并且适于根据温度变化调整频率信号。 振荡器和温度补偿电路位于烤箱内。 与加热器连通的加热器和温度传感器也都位于烤箱中。 温度传感器适用于根据温度变化直接控制加热器。 在一个实施例中，振荡器部件被安装到球栅阵列基板，该栅格阵列基板又安装在印刷电路板上。 在该实施例中，谐振器覆盖在球栅阵列基板上，并且盖覆盖并限定用于谐振器和球栅阵列基板的烤箱和外壳。 振荡器和温度补偿电路定义在球栅阵列基板上。

公开(公告)号：US20080203422A1

公开(公告)日：2008-08-28

申请号：US12012379

申请日：2008-02-01

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/00

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.

Abstract translation: 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

公开(公告)号：US07390108B1

公开(公告)日：2008-06-24

申请号：US10981385

申请日：2004-11-04

Applicant: Xinxin Wang

Inventor： Xinxin Wang

IPC: F21V29/00 ,  F21S13/14

CPC classification number: H05K1/145 ,  F21S4/20 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133628 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10651

Abstract: An LED source for a liquid crystal display includes a heat sink having a top surface and a first side surface and a plurality of LEDs arranged in a row. Each LED includes a base and a first lead and is disposed such that the base of each LED contacts the top surface of the heat sink. A first circuit board is disposed such that the first circuit board contacts the first side surface of the heat sink.

Abstract translation: 用于液晶显示器的LED源包括具有顶表面和第一侧表面的散热器以及排列成一排的多个LED。 每个LED包括基座和第一引线，并且被布置成使得每个LED的基座接触散热器的顶表面。 第一电路板被布置成使得第一电路板接触散热器的第一侧表面。