LIGHT DETECTION DEVICE
    103.
    发明申请

    公开(公告)号:US20190072431A1

    公开(公告)日:2019-03-07

    申请号:US16082616

    申请日:2017-03-03

    Abstract: A light detection device includes a Fabry-Perot interference filter provided with a light transmitting region on a predetermined line, a light detector disposed on one side with respect to the Fabry-Perot interference filter on the line, a package having an opening positioned on the other side with respect to the Fabry-Perot interference filter on the line, a light transmitting member provided in the package such that the opening is blocked, and a temperature control element having an endothermic region thermally connected to the Fabry-Perot interference filter and the light detector. The endothermic region is positioned on one side with respect to the light detector on the line.

    SPATIALLY VARIABLE FILTER SYSTEMS AND METHODS
    105.
    发明申请

    公开(公告)号:US20190041265A1

    公开(公告)日:2019-02-07

    申请号:US16057276

    申请日:2018-08-07

    Applicant: VERIFOOD, Ltd.

    Abstract: An improved compact spectrometer system comprising an improved spatially variable filter is disclosed herein. A spatially variable filter may be configured to have a plurality of different transmission profiles at different locations of the filter, to spectrally separate light incident on the filter. The spatially variable filter may comprise a plurality of different filter regions having different transmission profiles, and a plurality of similar filter regions comprising similar transmission profiles. The spatially variable filter may be optically coupled to a detector comprising a plurality of detector elements configured to measure the intensity of light. The measurement data generated by the plurality of detector elements coupled to the plurality of similar filter regions can be used to determine a spatial variation on incident light intensity.

    Light-detecting device
    107.
    发明授权

    公开(公告)号:US10184832B2

    公开(公告)日:2019-01-22

    申请号:US15031786

    申请日:2014-10-31

    Abstract: A spectral sensor includes a Fabry-Perot interference filter which is provided with an opening to pass light transmitted according to a distance between a first mirror and a second mirror along a facing direction; a light detector which has a light reception unit to receive the light having passed through the opening; a wiring substrate on which the light detector is mounted; and a plurality of spacers which support the filter on the wiring substrate, such that a second space continuous with a first space in the opening and including the first space when viewed from the facing direction is formed between the filter and the wiring substrate. The light detector is disposed in the second space. The light reception unit is disposed in a region corresponding to the first space in the second space, when viewed from the facing direction.

    Light-detecting device
    108.
    发明授权

    公开(公告)号:US10175107B2

    公开(公告)日:2019-01-08

    申请号:US15031780

    申请日:2014-10-31

    Abstract: A spectral sensor 1A includes a Fabry-Perot interference filter 10 which has a light transmission region 11; a light detector 3 which detects light having transmitted the light transmission region 11; spacers 4A and 4B which support the Fabry-Perot interference filter 10 in a surrounding region of the light transmission region 11; and a die bond resin 5 which adheres the Fabry-Perot interference filter 10 and the spacers 4A and 4B to each other. The die bond resin 5 has one opening A2 communicating with an inner side of the surrounding region and an outer side of the surrounding region, when viewed from a light transmission direction in the light transmission region 11.

    PRODUCTION METHOD FOR FABRY-PEROT INTERFERENCE FILTER

    公开(公告)号:US20180373021A1

    公开(公告)日:2018-12-27

    申请号:US16065856

    申请日:2017-05-01

    Abstract: A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

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