公开(公告)号：US20110058298A1

公开(公告)日：2011-03-10

申请号：US12555583

申请日：2009-09-08

Applicant: Joseph Kuczynski ,  Melissa K. Miller ,  Heidi Williams ,  Jing Zhang

Inventor： Joseph Kuczynski ,  Melissa K. Miller ,  Heidi Williams ,  Jing Zhang

IPC: H02H5/04

CPC classification number: H05K1/0201 ,  H05K1/0268 ,  H05K3/306 ,  H05K2201/044 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10545

Abstract: A method and apparatus directed to detecting and preventing excessive heating in power connectors is disclosed. In one embodiment, a system includes a power connector having an array of pins. A circuit board, such as a midplane of a blade server chassis, has an array of electrical vias passing through the circuit board that are arranged to receive the array of pins and at least one heat flux sensor positioned on one of the vias at the back of the midplane. The heat flux sensor is configured for generating an electrical signal in relation to an applied heat flux. A controller in communication with the heat flux sensor is configured for powering off the electrical power supply in response to the electrical signal reaching a setpoint corresponding to a selected heat flux threshold.

Abstract translation: 公开了一种用于检测和防止电力连接器中的过度加热的方法和装置。 在一个实施例中，系统包括具有引脚阵列的电源连接器。 电路板，例如刀片服务器机箱的中平面，具有通过电路板的电气通孔阵列，其布置成接收引脚阵列，并且至少一个热通量传感器位于后面的通孔中的一个上 的中平面。 热通量传感器被配置为相对于施加的热通量产生电信号。 与热通量传感器通信的控制器被配置为响应于电信号达到对应于所选择的热通量阈值的设定点来断电电源。

公开(公告)号：US07893534B2

公开(公告)日：2011-02-22

申请号：US11891530

申请日：2007-08-10

Applicant: Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

Inventor： Toshiki Hirano ,  Haruhide Takahashi ,  Tatsumi Tsuchiya

IPC: H01L23/48

CPC classification number: H01L23/49816 ,  G11B5/4853 ,  G11B5/4873 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0201 ,  H05K1/111 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/10727 ,  H05K2203/041 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49028 ,  Y10T29/4903 ,  Y10T29/49032 ,  H01L2924/00

Abstract: A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.

Abstract translation: 描述了用于焊料回流的隔热焊盘。 接合焊盘包括结构。 该结构形成接合垫。 接合焊盘还包括形成在结构上的绝缘体。 绝缘体被配置为插入在结构和要布置所述接合焊盘的部件的基板之间。 当所述接合焊盘经受在其上进行的焊料回流工艺时，所述接合焊盘为所述衬底提供热绝缘。

公开(公告)号：US07884553B2

公开(公告)日：2011-02-08

申请号：US11749456

申请日：2007-05-16

Applicant: Haruaki Wada ,  Kunio Oshimo ,  Takenobu Urazono

Inventor： Haruaki Wada ,  Kunio Oshimo ,  Takenobu Urazono

IPC: H05B37/00

CPC classification number: H05B33/0827 ,  G02F2001/133612 ,  H05B33/0824 ,  H05K1/0201

Abstract: A light-emitting diode illumination circuit includes light-emitting diodes connected in series and compensating elements connected in parallel with the light-emitting diodes. Each of the compensating elements includes positive and negative terminals and at least one conductor having a predetermined melting point. The conductor melts in the event of open-circuit failure so that the terminals are connected.

Abstract translation: 发光二极管照明电路包括串联连接的发光二极管和与发光二极管并联连接的补偿元件。 每个补偿元件包括正端子和负端子以及至少一个具有预定熔点的导体。 在发生开路故障的情况下，导体熔断，使端子相连。

公开(公告)号：US07880570B2

公开(公告)日：2011-02-01

申请号：US12259202

申请日：2008-10-27

Applicant: Jianying Zhou ,  Yuheng Lee ,  Yan Yang Zhao ,  Bernd Huebner

Inventor： Jianying Zhou ,  Yuheng Lee ,  Yan Yang Zhao ,  Bernd Huebner

IPC: H01P3/00

CPC classification number: H01P3/003 ,  H01P1/04 ,  H01P3/006 ,  H05K1/0201 ,  H05K1/0237

Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.

Abstract translation: 本发明的实施例包括通过将外壳外部的第一电路连接到壳体内的第二电路的高速馈电。 第一电路包括第一高速集成电路芯片，第二电路包括第二高速集成电路芯片或光电子器件。 高速馈送包括至少部分地位于壳体内部的内部共面结构，内部共面结构连接到第二电路。 高速进料通过还包括至少部分地位于壳体外部的外共面结构，外共面结构连接到第一回路。 一种材料将内部共面结构和外部共面结构分开。 至少一个导向孔延伸穿过材料，连接内部共面结构和外部共面结构。

公开(公告)号：US07832098B2

公开(公告)日：2010-11-16

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20100263915A1

公开(公告)日：2010-10-21

申请号：US12735193

申请日：2008-12-12

Applicant: Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

Inventor： Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

IPC: H05K1/00

CPC classification number: H05K1/0206 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/05 ,  H05K3/306 ,  H05K7/205 ,  H05K2201/10272

Abstract: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.

Abstract translation: 为了通过使用电路板的金属芯实现有效的散热和放热，端子块包括绝缘块体和端子。 至少一个端子设置有用于与电路板连接的端子部分。 端子部分插入到电路板的相应通孔中，电路板在其表面层具有图形电路，并且在厚度方向上的中间部分处具有导电金属芯，使得金属芯或两者的热量 金属芯和图案电路被吸收并传送到端子。 汇流条块包括绝缘块体和具有不同长度的几个并行汇流条。 汇流条末端的端子部分插入电路板上的发热部件附近，进入电路板的通孔。

公开(公告)号：US20100143788A1

公开(公告)日：2010-06-10

申请号：US12458897

申请日：2009-07-27

Applicant: Seok Koh ,  Eunok Kwak

Inventor： Seok Koh ,  Eunok Kwak

IPC: H01M2/00

CPC classification number: H01M10/4257 ,  H01M2/0404 ,  H01M10/42 ,  H01M2200/00 ,  H01M2200/106 ,  H05K1/0201 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A secondary battery including a bare cell, a protection circuit module electrically coupled to the bare cell, and a holder between the bare cell and the protection circuit module, wherein the protection circuit module includes a flexible printed circuit board having an upper and a lower surface, a charging/discharging terminal on the upper surface of the flexible printed circuit board and a protection circuit unit on the lower surface of the flexible printed circuit board opposite to the charging/discharging terminal, and the holder is disposed on the protection circuit unit on the lower surface of the flexible printed circuit board.

Abstract translation: 包括裸电池，电耦合到裸电池的保护电路模块和裸电池与保护电路模块之间的保持器的二次电池，其中保护电路模块包括柔性印刷电路板，其具有上表面和下表面 ，柔性印刷电路板的上表面上的充电/放电端子和柔性印刷电路板的与充电/放电端子相对的下表面上的保护电路单元，保持器设置在保护电路单元上 柔性印刷电路板的下表面。

公开(公告)号：US20100123115A1

公开(公告)日：2010-05-20

申请号：US12615321

申请日：2009-11-10

Applicant: Warren M. Farnworth

Inventor： Warren M. Farnworth

IPC: H01L23/52 ,  H01L45/00 ,  H01L21/60

CPC classification number: H01L23/4275 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05684 ,  H01L2224/11452 ,  H01L2224/11464 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13184 ,  H01L2224/16238 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/0201 ,  H05K3/3436 ,  H05K2201/10977 ,  H05K2203/304 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An interconnect for mounting an electronic device to a substrate includes a base layer between the electronic device and the substrate in electrical communication with integrated circuits on the electronic device, a phase change layer on the base layer made of a material which is liquid at normal operating temperatures of the electronic device. and a retaining layer surrounding the phase change layer, and configured to retain the phase change layer in liquid form on the base layer.A method for mounting an electronic device to a substrate includes the steps of: forming a base layer on the device (or on the substrate); forming a phase change layer on the base layer; placing the phase change layer in contact with a corresponding electrode on the substrate (or on the device); and then forming a retaining layer between the device and the substrate configured to surround the base layer, the phase change layer, and the electrode, and to retain the phase change layer in liquid form between the base layer and the electrode.

Abstract translation: 用于将电子器件安装到衬底的互连件包括在电子器件和衬底之间的基底层，与电子器件上的集成电路电连通;基底层上的相变层，由在正常工作时为液体的材料制成 电子设备的温度。 以及围绕所述相变层的保持层，并且被配置为将所述相变层保持在所述基底层上。 一种将电子器件安装到衬底上的方法包括以下步骤：在器件（或衬底）上形成基底层; 在基层上形成相变层; 将相变层与相应的电极接触在衬底（或器件上）上; 然后在所述器件和所述衬底之间形成保持层，所述保持层被构造成围绕所述基底层，所述相变层和所述电极，并且将所述相变层保持在所述基底层和所述电极之间。

公开(公告)号：US20100091464A1

公开(公告)日：2010-04-15

申请号：US12530277

申请日：2008-11-28

Applicant: Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

Inventor： Tohru Ohnishi ,  Hitoshi Kouno ,  Toshiyuki Taniguchi ,  Koji Nakashima ,  Toshiyuki Nakata ,  Tsunetsugu Imanishi ,  Keiichi Nakao

IPC: H05K7/20 ,  B21D53/02

CPC classification number: H01L23/3735 ,  H01L23/053 ,  H01L23/49861 ,  H01L23/645 ,  H01L25/162 ,  H01L2023/4025 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K7/1432 ,  H05K7/209 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.

Abstract translation: 本发明涉及一种散热结构板和使用这种用于混合动力车辆或电动车辆等可靠性高的目的的散热结构的模块以及制造散热结构的方法。 树脂结构设置在安装在该引线框架等上的构成散热板和异型电子部件等的引线框架上以覆盖引线框架和异型电子部件等，以及 该树脂结构固定在金属板，装置的底盘等上，构成散热结构板整体，由此固定引线框和异型电子部件等的固定强度， 可以增强在引线框架和传热层之间的界面处的强度等。

公开(公告)号：US07663891B2

公开(公告)日：2010-02-16

申请号：US11431097

申请日：2006-05-10

Applicant: Hirokazu Tanaka ,  Hiroyuki Ishibashi

Inventor： Hirokazu Tanaka ,  Hiroyuki Ishibashi

IPC: H05K7/00

CPC classification number: H05K1/0203 ,  H05K1/0201 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/202 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09972 ,  H05K2201/2036 ,  H05K2203/1316

Abstract: In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.

Abstract translation: 在引线框架板中，在安装有低耐热性发热部件的低耐热发热部件安装区域中设置由具有较高导热性的树脂形成的散热壁部件，但是热阻壁 在具有较高耐热发热部件的高耐热发热部件安装区域和非发热部件安装区域中设置具有较低热导率的树脂构成的部件， 被安装。 因此，在低耐热性发热部件安装区域和高耐热发热部件安装区域和非发热部件安装区域之间进行热阻，并且在低耐热性下提高散热功能 发热部件。