公开(公告)号：US5352325A

公开(公告)日：1994-10-04

申请号：US98637

申请日：1993-07-28

Applicant: Yoji Kato

Inventor： Yoji Kato

IPC: H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  B44C1/22 ,  B23F1/00 ,  B29C37/00

CPC classification number: H05K3/002 ,  H05K2201/09509 ,  H05K2201/09836 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0554 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/1184 ,  H05K3/427

Abstract: The present invention is a method of forming micro through holes in printed wiring board substrate materials by means of chemical etching.In a typical printed wiring board substrate material consisting of a resinous dielectric base material, (which may or may not incorporate glass fibers), clad on both sides by a conductive layer, after the dielectric material in specific locations where through holes are to be formed is exposed by typical processes in which the conductor layer is selectively removed by etching, said exposed dielectric material is first softened, then removed by chemical etching involving several steps and procedures as well as a variety of chemical solutions, under vibratory agitation, forming through holes in said locations of 100 microns diameter or less.Employing the method of the present invention it is possible to determine the position, size and shape of the through hole required and also by means of plating to connect the conductive layers through the dielectric forming micro plated through holes in printed wiring boards.

Abstract translation: 本发明是通过化学蚀刻在印刷线路板基板材料中形成微通孔的方法。 在由树脂电介质基材（其可以或可以不包括玻璃纤维）组成的典型的印刷线路板基板材料中，在导电层的两侧上包覆在介电材料在要形成通孔的特定位置之后 通过通过蚀刻选择性地去除导体层的典型工艺暴露，首先软化所述暴露的电介质材料，然后通过涉及几个步骤和程序的化学蚀刻以及各种化学溶液在振动搅拌下除去，形成通孔 在直径为100微米或更小的所述位置。 采用本发明的方法，可以确定所需通孔的位置，尺寸和形状，并且还可以通过电镀来连接通过印刷电路板中的电介质形成微电镀通孔的导电层。

公开(公告)号：US20150380391A1

公开(公告)日：2015-12-31

申请号：US14848504

申请日：2015-09-09

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Yong HA WOO ,  E-Tung CHOU ,  Wen-Lun LO

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H05K1/09 ,  H05K1/11

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/09 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/181 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0379 ,  H05K2201/09836 ,  H05K2201/10674 ,  H05K2203/0384 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts is larger than that of each of the first conductive posts. A manufacturing method thereof is also provided.

Abstract translation: 封装基板包括电路板，多个第一导电柱和多个第二导电柱。 电路板包括形成在第一基底的第一表面上的第一基底和第一导电图案层。 第一导电柱从第一导电图案层延伸并电连接到第一导电图案层。 第二导电柱从第一导电图案层延伸并与之电连接。 每个第二导电柱的高度大于每个第一导电柱的高度。 还提供了其制造方法。

公开(公告)号：US20150201500A1

公开(公告)日：2015-07-16

申请号：US14169169

申请日：2014-01-31

Applicant: Zohar SHINAR ,  Joel VIDAL

Inventor： Zohar SHINAR ,  Joel VIDAL

IPC: H05K3/12 ,  B29C67/00

CPC classification number: H05K3/125 ,  B29C64/112 ,  B29C64/135 ,  B29C64/386 ,  B29C70/882 ,  B29K2105/0058 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3425 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  H05K1/0206 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/165 ,  H05K1/167 ,  H05K1/186 ,  H05K3/0005 ,  H05K3/1283 ,  H05K3/225 ,  H05K3/284 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4664 ,  H05K3/4685 ,  H05K3/4688 ,  H05K2201/0367 ,  H05K2201/037 ,  H05K2201/0391 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/098 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/09872 ,  H05K2201/10098 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/163 ,  H05K2203/166

Abstract: Device, system, and method of three-dimensional printing. A device includes: a first 3D-printing head to selectively discharge conductive 3D-printing material; a second 3D-printing head to selectively discharge insulating 3D-printing material; and a processor to control operations of the first and second 3D-printing heads based on a computer-aided design (CAD) scheme describing a printed circuit board (PCB) intended for 3D-printing. A 3D-printer device utilizes 3D-printing methods, in order to 3D-print: (a) a functional multi-layer PCB; or (b) a functional stand-alone electric component; or (c) a functional PCB having an embedded or integrated electric component, both of them 3D-printed in a unified 3D-printing process.

Abstract translation: 三维打印的设备，系统和方法。 一种装置包括：第一3D打印头，用于选择性地排放导电3D打印材料; 第二3D打印头，用于选择性地放电绝缘3D打印材料; 以及基于描述用于3D打印的印刷电路板（PCB）的计算机辅助设计（CAD）方案来控制第一和第二3D打印头的操作的处理器。 3D打印机设备利用3D打印方法，以便3D打印：（a）功能性多层PCB; 或（b）功能独立电气部件; 或（c）具有嵌入或集成电气部件的功能PCB，它们都以统一的3D打印过程3D打印。

公开(公告)号：US20150076113A1

公开(公告)日：2015-03-19

申请号：US14481572

申请日：2014-09-09

Applicant: ASAHI GLASS COMPANY, LIMITED

Inventor： Kohei HORIUCHI

IPC: B44C1/22

CPC classification number: B44C1/228 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/54 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0029 ,  H05K2201/09836 ,  H05K2201/10204 ,  H05K2203/163 ,  H01L2924/00

Abstract: A method including a) forming a through-hole in a dummy substrate including a surface by radiating a laser to the surface of the dummy substrate in a state where the dummy substrate is moved relative to the laser along a direction parallel to the surface of the dummy substrate, b) determining an angle α (−90°

Abstract translation: 一种方法，包括：在虚拟衬底相对于激光器沿着平行于所述虚拟衬底的表面的方向相对于激光器移动的状态下，通过在所述虚设衬底的表面辐射激光而在包括表面的虚设衬底中形成通孔 虚拟基板，b）确定通孔相对于垂直于虚设基板的表面的线的角度α（-90°<α<+ 90°），以及c）在绝缘基板中形成通孔 与步骤a）相同的条件，除了以角度＆bgr辐射激光; 相对于垂直于绝缘基板的表面的线。 角度＆bgr 被设定为相对于垂直于绝缘基板的表面的线的角度α线对称，并且满足＆bgr =α的关系。

公开(公告)号：US20150053475A1

公开(公告)日：2015-02-26

申请号：US14463489

申请日：2014-08-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung Keun Kim

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/115 ,  H05K2201/09536 ,  H05K2201/09636 ,  H05K2201/09836 ,  H05K2201/09854

Abstract: There is provided a multi layered printed circuit board. The multi layered printed circuit board according to an exemplary embodiment of the present disclosure includes: a plurality of circuit layers; insulating layers each formed between the plurality of circuit layers; and a via penetrating through the insulating layers and the circuit layers and electrically connecting the plurality of circuit layers to each other, wherein the via includes a first via and a second via, and the second via is a large diameter via having a diameter larger than that of the first via.

Abstract translation: 提供了多层印刷电路板。 根据本公开的示例性实施例的多层印刷电路板包括：多个电路层; 绝缘层各自形成在所述多个电路层之间; 以及穿过绝缘层和电路层并且将多个电路层彼此电连接的通孔，其中所述通孔包括第一通孔和第二通孔，并且所述第二通孔是大直径通孔，其直径大于 那第一个通过。

公开(公告)号：US20130328214A1

公开(公告)日：2013-12-12

申请号：US13966633

申请日：2013-08-14

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Takamasa Takano

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15786 ,  H01L2924/1579 ,  H05K1/113 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09436 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/1178 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49165 ,  H01L2224/05647 ,  H01L2924/01024 ,  H01L2924/01079

Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

Abstract translation: 一种制造通孔电极基板的方法包括在基板上形成多个通孔，通过在多个通孔中填充导电材料形成多个通孔电极，在一个通孔上形成第一绝缘层 在所述第一绝缘层上形成多个第一开口，所述多个第一开口将与所述多个通孔电极中的每一个相对应的多个通孔电极暴露在所述第一绝缘层上，并且使用所述关系来校正所述多个第一开口的位置 在多个通孔中的倾斜通孔的打开位置的测量距离值的偏移量与多个通孔中的倾斜通孔的打开位置的设计距离值之间， 相对于基板的中心位置。

公开(公告)号：US08453917B1

公开(公告)日：2013-06-04

申请号：US13655555

申请日：2012-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

公开(公告)号：US08383957B2

公开(公告)日：2013-02-26

申请号：US12875156

申请日：2010-09-03

Applicant: Shou-Kuo Hsu ,  Yung-Chieh Chen ,  Hsien-Chuan Liang ,  Wen-Laing Tseng ,  Shen-Chun Li ,  Chia-Nan Pai

Inventor： Shou-Kuo Hsu ,  Yung-Chieh Chen ,  Hsien-Chuan Liang ,  Wen-Laing Tseng ,  Shen-Chun Li ,  Chia-Nan Pai

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K2201/09836 ,  Y10T428/24917

Abstract: A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle θ, the angle θ is less than cos−1[(Lv2−Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.

Abstract translation: 印刷电路板（PCB）包括两层，两条信号传输路径和一条垂直互连接口（via）。 信号传输迹线分别布置在层上。 信号传输迹线通过通孔彼此电连接。 具有垂直线的通孔的中心线形成锐角和角度;角度和角度; 小于cos-1 [（Lv2-Lt2）/（Lv2 + Lt2）]。 其中Lt是以单位长度丢失两个信号传输迹线，并且Lv是单位长度中的通孔的损失。

公开(公告)号：US08373194B2

公开(公告)日：2013-02-12

申请号：US13000042

申请日：2009-06-23

Applicant: Marcus Johannes Gerardus Elzinga

Inventor： Marcus Johannes Gerardus Elzinga

IPC: H01L33/36 ,  H01L21/00

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

公开(公告)号：US20120273258A1

公开(公告)日：2012-11-01

申请号：US13156359

申请日：2011-06-09

Applicant: YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN ,  DAN-CHEN WU

Inventor： YUNG-CHIEH CHEN ,  SHOU-KUO HSU ,  HSIEN-CHUAN LIANG ,  SHIN-TING YEN ,  DAN-CHEN WU

IPC: H05K1/09

CPC classification number: H05K1/0251 ,  H05K1/0245 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09836

Abstract: A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire.

Abstract translation: 印刷电路板依次包括第一信号层，第一参考层，第二信号层和第三信号层，并且包括第一倾斜通孔和第二倾斜通孔。 第一信号层包括并行的第一传输线和第二传输线。 第一和第二传输线彼此耦合并协同地构成具有边缘耦合结构的第一差分对。 第二信号层包括第三传输线。 第三信号层包括与第三传输线并联并与第三传输线耦合的第四传输线。 第三和第四传输线协作地构成具有宽边耦合结构的第二差分对。 第一倾斜地倾斜地在第一传输线和第三传输线之间互连。 第二倾斜地倾斜地在第二传输线和第四传输线之间互连。