公开(公告)号：US09414513B2

公开(公告)日：2016-08-09

申请号：US14576452

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo Nakagoshi ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Hidekiyo Takaoka ,  Kosuke Nakono ,  Akihiko Kamada ,  Masaaki Mizushiro

IPC: H05K1/18 ,  H05K7/02 ,  H01L23/498 ,  H01L25/16 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H01L23/15 ,  H05K3/28

CPC classification number: H05K7/02 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/186 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/047

Abstract: A plating layer of a Cu-M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu-M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu-M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Abstract translation: 在暴露侧的连接端子构件的端面上形成Cu-M系合金的镀层（M表示Ni和/或Mn），Cu-M系合金能够产生金属间化合物 所述Sn基低熔点金属包含在形成接合部分并且具有不同于金属间化合物的晶格常数的接合材料中的50％以上。 在回流工序中，即使接合材料通过再熔化即将流出，由于接合材料与Cu-M系镀层接触，所以金属间化合物的高熔点合金 形成为阻挡连接端子构件和树脂层之间的界面。

公开(公告)号：US09324678B2

公开(公告)日：2016-04-26

申请号：US13996498

申请日：2011-12-20

Applicant: Sanka Ganesan ,  Ram S. Viswanath

Inventor： Sanka Ganesan ,  Ram S. Viswanath

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/40 ,  H01L23/00 ,  H01R12/62 ,  H05K3/36 ,  H01L23/498 ,  H01B7/04 ,  H05K1/14

CPC classification number: H01R12/79 ,  H01B7/04 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01R12/62 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.

Abstract translation: 介绍了一种集成电路封装。 在一个实施例中，集成电路封装具有形成在封装基板的顶侧上的接触焊盘，电连接到接触焊盘的管芯，以及形成在封装基板的顶侧上的输入/输出（I / O）焊盘。 I / O焊盘电连接到接触焊盘。 集成电路封装还包括电连接到封装衬底的顶侧上的I / O焊盘的挠性电缆插座。 柔性电缆插座不可压缩地附接到柔性电缆连接器，并且包括电连接到I / O焊盘的插座连接引脚。

公开(公告)号：US09245829B2

公开(公告)日：2016-01-26

申请号：US13949206

申请日：2013-07-23

Applicant: OMRON Corporation

Inventor： Shintaro Hara ,  Shoichi Konagata ,  Yuzo Iwasaki ,  Tomonori Shiraishi

IPC: H01L23/48 ,  H01L23/492 ,  H01L23/00 ,  H05K1/11 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.

Abstract translation: 本发明提供一种能够有效地防止由于回流焊接期间焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的基板结构。 在基板上，通过焊膏安装半导体芯片。 基板设置有连续或不连续地包围焊膏的槽部。

公开(公告)号：US20150345766A1

公开(公告)日：2015-12-03

申请号：US14653945

申请日：2013-12-16

Applicant: Linhua WANG ,  Xiaolei ZHU ,  Lin ZHOU ,  Han ZHAO

Inventor： Linhua Wang ,  Xiaolei Zhu ,  Lin Zhou ,  Han Zhao

IPC: F21V23/06 ,  H01R33/22 ,  H01R33/18 ,  F21K99/00 ,  F21V23/00

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.

Abstract translation: 提供使用电连接构件的电连接构件和LED灯。 电连接构件用于光源基板和LED灯的驱动板之间的电连接，并且包括输入端子和输出端子。 LED灯包括驱动板和光源基板。 输出端子设置在LED灯的驱动板上。 输入端子设置在光源基板上并与光源基板电连接。 输出端子包括两个触点，两个触点中的每一个的一端分别电连接到驱动板。 输入端子包括分别对应于两个触头设置的两个连接头。 两个连接头中的每一个的一端分别电连接到光源基板。

公开(公告)号：US09137904B2

公开(公告)日：2015-09-15

申请号：US14181036

申请日：2014-02-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Akihiko Kamada

IPC: H05K1/00 ,  H05K3/40 ,  H05K1/11 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/4007 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/113 ,  H05K3/243 ,  H05K3/3436 ,  H05K2201/09436 ,  H05K2201/10318 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0346 ,  H05K2203/1327

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract translation: 模块包括电路板，树脂层，外部连接导体，焊​​料凸块。 树脂层设置在电路板的第一主表面上。 外部连接导体布置在树脂层中，具有连接到电路板的第一端和通过树脂层的表面突出的第二端，并且包括沿着树脂层的表面延伸的突出部分，突出部分 树脂层的表面。 焊料凸点设置在外部连接导体的第二端上。

公开(公告)号：US09132494B2

公开(公告)日：2015-09-15

申请号：US13354043

申请日：2012-01-19

Applicant: Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

Inventor： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

IPC: H05K1/11 ,  B23K1/00 ,  B23K35/26 ,  B23K35/22 ,  C22C11/06 ,  C22C13/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H05K3/46

CPC classification number: B23K1/00 ,  B23K35/22 ,  B23K35/26 ,  C22C11/06 ,  C22C13/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2924/15174 ,  H01L2924/15312 ,  H05K3/4682 ,  H05K2201/10318 ,  H01L2924/014

Abstract: A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.

Abstract translation: 提供了一种通过树脂加强的布线板和制造布线板的方法。 布线板的实施例允许将连接构件（如插座）可靠地附接到端子构件。 例如，将端子引脚的基座放置在引脚格栅阵列（PGA）端子焊盘上，并且将包含焊料的接合材料浆料和由树脂制成的电绝缘材料放置在每个PGA端子焊盘上。 然后将接合材料浆料加热以熔化焊料并软化电绝缘材料。 随后，将接合材料浆料冷却以固化焊料，并将每个基底结合到相应的PGA端子焊盘上，并在各个基底所接合的每个焊接点的暴露表面上形成电绝缘表面层。

公开(公告)号：US20150214666A1

公开(公告)日：2015-07-30

申请号：US14166897

申请日：2014-01-29

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher

IPC: H01R13/6461 ,  H05K3/10 ,  H05K1/02 ,  H01R13/6477 ,  H01R24/64

CPC classification number: H01R13/6477 ,  H01R4/023 ,  H01R13/6461 ,  H01R13/6464 ,  H01R13/6469 ,  H01R24/64 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/165 ,  H05K3/10 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/1034 ,  Y02P70/611 ,  Y10T29/49155

Abstract: Printed circuit boards for communications connectors are provided that include a dielectric substrate formed of a first insulative material having a first dielectric constant. First and second pairs of input terminals and first and second pairs of output terminals are provided on the dielectric substrate. A first differential transmission line electrically connect the first pair of input terminals to the first pair of output terminals, and a second differential transmission line electrically connect the second pair of input terminals to the second pair of output terminals. The dielectric substrate includes an opening that is positioned between the conductive paths of the first differential transmission line, the opening containing a second insulative material having a second dielectric constant.

Abstract translation: 提供了用于通信连接器的印刷电路板，其包括由具有第一介电常数的第一绝缘材料形成的电介质基板。 第一和第二对输入端子和第一和第二对输出端子设置在电介质基板上。 第一差分传输线将第一对输入端子电连接到第一对输出端子，并且第二差分传输线路将第二对输入端子电连接到第二对输出端子。 电介质基板包括位于第一差动传输线的导电路径之间的开口，该开口包含具有第二介电常数的第二绝缘材料。

公开(公告)号：US20140077375A1

公开(公告)日：2014-03-20

申请号：US13949206

申请日：2013-07-23

Applicant: OMRON CORPORATION

Inventor： Shintaro Hara ,  Shoichi Konagata ,  Yuzo Iwasaki ,  Tomonori Shiraishi

IPC: H01L23/492 ,  H01L23/00

CPC classification number: H01L23/492 ,  H01L23/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/40 ,  H01L2224/73221 ,  H01L2224/73271 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/13033 ,  H01L2924/15747 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10053 ,  H05K2201/1031 ,  H05K2201/10318 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/37099

Abstract: This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste.

Abstract translation: 本发明提供一种能够有效地防止由于回流焊接期间焊剂蒸发引起的爆炸而产生的焊球的散射以及熔融焊料向周围扩散的基板结构。 在基板上，通过焊膏安装半导体芯片。 基板设置有连续或不连续地包围焊膏的槽部。

公开(公告)号：US08422195B2

公开(公告)日：2013-04-16

申请号：US12755967

申请日：2010-04-07

Applicant: Robert A. Stevenson

Inventor： Robert A. Stevenson

IPC: H01G4/35

CPC classification number: H01G4/35 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/147 ,  H05K3/306 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: A feedthrough flat-through capacitor includes a capacitor having a first and second set of electrode plates, a first feedthrough passageway through the capacitor, a first lead disposed within the first feedthrough passageway and conductively coupled to the first set of electrode plates, a second feedthrough passageway through the capacitor disposed remote from the first feedthrough passageway, and a second lead disposed within the second feedthrough passageway and conductively coupled to the first set of electrode plates. The second set of electrode plates are typically conductively coupled to a ground. An EMI shield may be provided to electromagnetically isolate the first lead from the second lead.

Abstract translation: 馈通平坦电容器包括具有第一和第二组电极板的电容器，通过电容器的第一馈通通道，设置在第一馈通通道内并与第一组电极板导电耦合的第一引线，第二馈通 通过远离第一馈通通道布置的电容器的通道，以及设置在第二馈通通道内并与第一组电极板导电耦合的第二引线。 第二组电极板通常与地面电连接。 可以提供EMI屏蔽以将第一引线与第二引线电磁隔离。

公开(公告)号：US08373428B2

公开(公告)日：2013-02-12

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R31/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。