公开(公告)号：US20070030683A1

公开(公告)日：2007-02-08

申请号：US11542072

申请日：2006-10-03

Applicant: John Popovich ,  Gregory Honegger

Inventor： John Popovich ,  Gregory Honegger

IPC: F21V29/00

CPC classification number: F21V29/70 ,  A47C7/725 ,  F21K9/00 ,  F21K9/60 ,  F21K9/90 ,  F21V7/0025 ,  F21V7/005 ,  F21V19/001 ,  F21V29/507 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10S362/80 ,  Y10T29/49133 ,  Y10T29/49826

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

公开(公告)号：US07134918B2

公开(公告)日：2006-11-14

申请号：US11148531

申请日：2005-06-08

Applicant: Ning Wang ,  Zhi-giang Chen

Inventor： Ning Wang ,  Zhi-giang Chen

IPC: H01R13/64

CPC classification number: H05K1/182 ,  H01R12/722 ,  H01R13/64 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2203/167 ,  H05K2203/168

Abstract: An electrical connector assembly comprises a first connector (1) and a second connector (1′) having a same configuration with a housing (30, 30′) and a mounting face (34, 34′) adapted for mounting onto a printed circuit board PCB (100) except for a distinguishable portion (353, 353′) provided on the housing (30, 30′) adjacent to the mounting face (34, 34′) thereof. The first connector (1) is not able to be regarded as the second connector (1′) to be mounted onto the PCB (100) due to the different distinguishable portions (353, 353′) of the first and second connectors (1,1′).

Abstract translation: 电连接器组件包括具有与壳体（30,30'）相同构造的第一连接器（1）和第二连接器（1'）和适于安装到印刷电路板上的安装面（34,34'） PCB（100）除了设置在与其安装面（34,34'）相邻的壳体（30,30'）上的可区分部分（353,335'）之外。 由于第一连接器（1）和第二连接器（1）的不同的可区分部分（353,353'）不能将第一连接器（1）视为要安装到PCB（100）上的第二连接器（1' 1'）。

公开(公告)号：US07113061B2

公开(公告)日：2006-09-26

申请号：US10991164

申请日：2004-11-16

Applicant: Yasuhiro Ootori ,  Kenichi Nagase ,  Mitsuyuki Tokusashi ,  Tomonori Hasegawa ,  Hironori Yagi

Inventor： Yasuhiro Ootori ,  Kenichi Nagase ,  Mitsuyuki Tokusashi ,  Tomonori Hasegawa ,  Hironori Yagi

IPC: H05K5/02

CPC classification number: H04B1/08 ,  H01R24/50 ,  H05K1/144 ,  H05K1/18 ,  H05K9/006 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).

Abstract translation: 接收器（2）包括调谐器单元（1）和（3）以及电路板（21）。 调谐器单元（1）包括连接器（11），调谐器板（12）和用于容纳它们的壳体（13）。 调谐器板（12）位于垂直于连接器（11）的连接方向（由箭头P表示）的高度尺寸L的限度内。 此外，在壳体（13）中形成凹部（141B），其中设置在凹部（141B）上的电路板（21）也位于与垂直于凹部（141B）的方向垂直的高度尺寸L的极限内 连接器（11）的连接（由箭头P描绘）。

公开(公告)号：US07088591B2

公开(公告)日：2006-08-08

申请号：US10695463

申请日：2003-10-28

Applicant: Tadao Kishimoto ,  Yutaka Igarashi ,  Hironobu Hirayama

Inventor： Tadao Kishimoto ,  Yutaka Igarashi ,  Hironobu Hirayama

IPC: H05K7/06 ,  H05K9/00

CPC classification number: H05K1/0234 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/116 ,  H05K3/325 ,  H05K3/429 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/10446 ,  Y10T29/49155

Abstract: There is described a multi-layer printed circuit board and a method of installing it. The circuit board includes a first signal layer formed on its obverse surface; a ground layer arranged at a position next to the first signal layer; an electronic power source layer arranged at a position next to the ground layer; and a second signal layer formed on its reverse surface. The first and second patterns are formed around peripheral areas of the first and second signal layers, respectively. The first ground pattern and the second ground pattern are electrically coupled to each other by plural through holes, and the multi-layer printed circuit board is installed on an electro-conductive housing in such a manner that a substantially whole area of the second ground pattern electrically contacts a mounting area of the electro-conductive housing, the mounting area being an electro-conductive area continuously coupled to the electro-conductive housing.

Abstract translation: 描述了一种多层印刷电路板及其安装方法。 电路板包括在其正面上形成的第一信号层; 布置在与所述第一信号层相邻的位置处的接地层; 布置在接地层旁边的位置处的电子电源层; 以及形成在其反面上的第二信号层。 第一和第二图案分别形成在第一和第二信号层的周边区域周围。 第一接地图案​​和第二接地图案通过多个通孔彼此电耦合，并且多层印刷电路板以这样的方式安装在导电外壳上，使得第二接地图案的大致整个区域 电接触导电壳体的安装区域，该安装区域是连续耦合到导电壳体的导电区域。

公开(公告)号：US20060152869A1

公开(公告)日：2006-07-13

申请号：US11163574

申请日：2005-10-24

Applicant: Chih-Chiang Su ,  Chieh-Chih Liu ,  Wei-Chih Liu

Inventor： Chih-Chiang Su ,  Chieh-Chih Liu ,  Wei-Chih Liu

IPC: H02H9/00

CPC classification number: H05K3/0052 ,  H05K1/0259 ,  H05K1/18 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10446 ,  H05K2203/175

Abstract: A printed circuit board capable of resisting electrostatic discharge and a routing method of the one or multi-layer printed circuit board are disclosed. The routing method includes planning a first routing area, planning a second routing area apart from the first routing area for a predetermined distance at least, and connecting an attenuating component between the first routing area and the second routing area for attenuating an impulse generated by electrostatic discharge in order to prevent the impulse spreading to the second routing area from the first routing area.

Abstract translation: 公开了能够抵抗静电放电的印刷电路板和一层或多层印刷电路板的布线方法。 路由方法包括规划第一路由区域，至少规划距离第一路由区域第二路由区域预定距离，以及在第一路由区域和第二路由区域之间连接衰减分量，以衰减由静电产生的脉冲 放电，以防止从第一路由区域到第二路由区域的脉冲扩展。

公开(公告)号：US20060133819A1

公开(公告)日：2006-06-22

申请号：US11131342

申请日：2005-05-18

Applicant: Juhyun Yu ,  Kinya Yamazaki ,  Hidetaka Kawauchi ,  Tenpei Inoue ,  Hiroki Katayama

Inventor： Juhyun Yu ,  Kinya Yamazaki ,  Hidetaka Kawauchi ,  Tenpei Inoue ,  Hiroki Katayama

IPC: H04B10/00

CPC classification number: H05K1/147 ,  G02B6/4204 ,  G02B6/4292 ,  H04B10/501 ,  H05K1/141 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10598

Abstract: An optical transmission module has: an optical module having an optical element and a receptacle portion; a circuit board that is electrically connected to the optical module through an electrical connection member; and a housing in which the optical module and the circuit board are placed. The optical module is in surface-contact with and fixed onto the housing. The receptacle portion and the circuit board are not in contact with the housing. The receptacle portion is restricted in position while having a positional degree of freedom at least in a direction perpendicular to an optical axis of light emitted from the optical element. The circuit board is restricted in position while having a positional degree of freedom at least in a direction of the optical axis.

Abstract translation: 光传输模块具有：具有光学元件和插座部分的光学模块; 电路板，其通过电连接构件电连接到所述光学模块; 以及其中放置光学模块和电路板的壳体。 光学模块与壳体表面接触并固定在壳体上。 插座部分和电路板不与壳体接触。 容纳部分至少在与从光学元件发射的光的光轴垂直的方向上具有位置自由度的同时受到限制。 电路板被限制在至少沿光轴的方向具有位置自由度的位置。

公开(公告)号：US20060133058A1

公开(公告)日：2006-06-22

申请号：US11146000

申请日：2005-06-07

Applicant: Soon-Yong Hur

Inventor： Soon-Yong Hur

IPC: H05K7/14

CPC classification number: H05K3/325 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/10159 ,  H05K2201/10446 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.

公开(公告)号：US20060087844A1

公开(公告)日：2006-04-27

申请号：US11294974

申请日：2005-12-06

Applicant: Jagath Swaris ,  Scott Ness

Inventor： Jagath Swaris ,  Scott Ness

IPC: F21V21/00 ,  F21V29/00

CPC classification number: F21V29/70 ,  F21S4/20 ,  F21V17/007 ,  F21Y2115/10 ,  G09F13/0404 ,  G09F13/22 ,  H01L25/13 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/0058 ,  H05K2201/10106 ,  H05K2201/10446 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having at least one LED. The module includes a heat conductive body portion adapted to conduct heat generated by the LED away from the LED. As a result, the LED can be operated with a higher current than normally allowed. Thus, LED brightness and performance is increased without decreasing life expectancy. An adhesive connects the LED module to the mount surface. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.

Abstract translation: 提供了一种模块化发光二极管（LED）安装配置，其包括具有至少一个LED的光源模块。 该模块包括适于将由LED产生的热量远离LED的导热体部分。 因此，LED可以以比正常允许的更高的电流工作。 因此，LED的亮度和性能提高而不降低寿命。 粘合剂将LED模块连接到安装表面。 多个这样的LED模块可以以基本上连续的方式预先布线在一起并且设置在诸如卷筒或盒子的分配器中。 因此，为了安装多个这样的LED模块，工作者根据需要简单地从分配器拉模块，将适当数量的模块固定就位，并将组装的模块连接到电源。

公开(公告)号：US20060024005A1

公开(公告)日：2006-02-02

申请号：US11236123

申请日：2005-09-26

Applicant: Donald Ice ,  Stephen Nelson ,  Darin Douma

Inventor： Donald Ice ,  Stephen Nelson ,  Darin Douma

IPC: G02B6/36

CPC classification number: H05K3/3405 ,  G02B6/4201 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4255 ,  G02B6/4292 ,  H01R13/6315 ,  H05K1/0278 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2203/302

Abstract: An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

公开(公告)号：US06976854B2

公开(公告)日：2005-12-20

申请号：US10773964

申请日：2004-02-05

Applicant: Andreas Stockhaus ,  Christian Carstens

Inventor： Andreas Stockhaus ,  Christian Carstens

IPC: G02B6/38 ,  H01R12/00 ,  H01R12/71 ,  H05K1/14 ,  H05K1/18 ,  H01R12/20

CPC classification number: H05K1/147 ,  G02B6/3897 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/10121 ,  H05K2201/10446

Abstract: An arrangement for connecting the terminal contacts of an electronic component to electrical contacts formed on a printed circuit board. An at least partly flexible conductor support having a plurality of interconnects provides an electrical connection between the terminal contacts of the electronic component and the electrical contacts of the printed circuit board such that a portion of the conductor support that is connected to the printed circuit board is arranged on an end face of the printed circuit board and extends perpendicularly in relation to the upper and lower surfaces of the printed circuit board. Furthermore, a conductor support formed with relatively narrow middle portion is provided to facilitate such an arrangement.