公开(公告)号：US20080113566A1

公开(公告)日：2008-05-15

申请号：US11598258

申请日：2006-11-10

Applicant: Janos Legrady

Inventor： Janos Legrady

IPC: H01R4/02

CPC classification number: H01R12/52 ,  H01R12/718 ,  H01R43/0256 ,  H05K1/144 ,  H05K3/341 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/1084

Abstract: A board-stacking connector has surface-mounting connections to electrical contact pads or lands on two facing surfaces on two printed circuit boards that are spaced from each other a predetermined distance in two substantially parallel planes. The connector takes the form of a generally cylindrical shell of metallic material and defines an axis and a substantially uniform cross-sectional area along that axis. The shell has a wall closed on itself to define an internal cavity forming two openings, one at each of its axial ends, and this wall further defines generally flat contact surfaces normal to said axis and surrounds each of said respective openings. One of the contact surfaces is arranged to be in contact with a pad or land on one printed circuit board and the other of the contact surfaces is arranged to be in contact with a pad or land on the other spaced printed circuit board. The internal cavity is dimensioned so as to produce capillary action of molten solder on each of the pads or lands that are in contact with the contact surfaces, so that excess solder on the pads or lands is drawn into this cavity, at both axial openings, during reflow soldering.

Abstract translation: 电路板堆叠连接器具有与两个印刷电路板上的两个相对表面上的电接触焊盘或焊盘的表面安装连接，这两个印刷电路板在两个基本上平行的平面中彼此间隔开预定距离。 连接器采用大致圆柱形的金属材料壳体的形式，并且沿轴线限定一个轴线和一个基本上均匀的横截面积。 壳体具有在其自身上封闭的壁，以限定形成两个开口的内部空腔，每个轴向端部中的一个开口，并且该壁还限定与所述轴线垂直的大致平坦的接触表面并且围绕每个所述各个开口。 一个接触表面布置成与一个印刷电路板上的焊盘或焊盘接触，并且另一个接触表面布置成与另一间隔开的印刷电路板上的焊盘或焊盘接触。 内腔的尺寸被设计成在与接触表面接触的每个焊盘或焊盘上产生熔融焊料的毛细管作用，使得焊盘或焊盘上的多余焊料在两个轴向开口处被拉入该空腔中， 在回流焊接。

公开(公告)号：US07207837B2

公开(公告)日：2007-04-24

申请号：US11504176

申请日：2006-08-15

Applicant: Hiroshi Nakano

Inventor： Hiroshi Nakano

IPC: H01R13/70

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A circuit board connector (1) has a housing (10), male terminals (20) and fixing members (30). Each fixing member (30) is formed by bending a metal plate into an L-shape to define a mounting portion (31) to mount the fixing member (30) to the housing (10), and a bonding portion (32) to be soldered. The bonding portion (32) is formed with connecting pieces (33) by making U-shaped cuts through the bonding portion (32) and then bending areas enclosed by the cuts upward. A clearance (S) is defined between the bottom edge of the leading end of each connecting piece (33) and the corresponding through hole (34). The lower surfaces of the connecting pieces (33) and the inner surfaces of the through holes (34) can be soldered.

Abstract translation: 电路板连接器（1）具有壳体（10），阳端子（20）和固定构件（30）。 每个固定构件（30）通过将金属板弯曲成L形形成以形成用于将固定构件（30）安装到壳体（10）的安装部分（31）和形成为 焊接。 通过在接合部分（32）上形成U形切口，然后由向上切割的弯曲区域形成接合部分（32）。 在每个连接件（33）的前端的底部边缘和相应的通孔（34）之间限定有间隙（S）。 连接片（33）的下表面和通孔（34）的内表面可被焊接。

公开(公告)号：US20060113666A1

公开(公告)日：2006-06-01

申请号：US11282834

申请日：2005-11-21

Applicant: Jun Oonishi

Inventor： Jun Oonishi

IPC: H01L23/48

CPC classification number: H05K3/3426 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface-mounted electronic component has an outer lead extending from a package for connection to a circuit pattern on a printed circuit board by using a connecting member. The outer lead has a hole having an opening at least on a connecting member facing side in a portion of the outer lead for connecting the outer lead to the circuit pattern.

Abstract translation: 表面安装的电子部件具有从用于连接到印刷电路板上的电路图案的封装件延伸的外部引线，通过使用连接部件。 外部引线具有至少在外部引线的一部分中的连接构件朝向侧的开口，用于将外部引线连接到电路图案。

公开(公告)号：US20040192087A1

公开(公告)日：2004-09-30

申请号：US10401884

申请日：2003-03-31

Inventor： Ted Ju

IPC: H01R012/00

CPC classification number: H05K3/3426 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/3436 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: An electric connector is disclosed to include an electrically insulative housing, the housing having a plurality of terminal slots and a protruded block in each terminal slot near the bottom side, a plurality of U-shaped terminals respectively mounted in the terminal slots in the housing, each terminal having two bonding ends held between two opposite lateral sidewalls of the corresponding terminal slot and two sides of the corresponding protruded block, and a plurality of solder balls located on the bottom side of the housing and supported on the protruded block in each terminal slot and clamped between the bonding ends of each terminal.

Abstract translation: 公开了一种电连接器，其包括电绝缘壳体，所述壳体具有多个端子槽和在底侧附近的每个端子槽中的突出块，分别安装在壳体中的端子槽中的多个U形端子， 每个端子具有两个接合端部，其保持在相应的端子槽的两个相对的侧向侧壁和相应的突出块的两侧之间，以及多个焊球，位于壳体的底侧并且支撑在每个端子槽中的突出块上 并夹在每个端子的接合端之间。

公开(公告)号：US20040171315A1

公开(公告)日：2004-09-02

申请号：US10746192

申请日：2003-12-26

Applicant: Delta Electronics Inc.

Inventor： Pei-Sheng Liao ,  Jui-Yuan Hsu ,  Bay Shao-Ru Su

IPC: H01R013/42

CPC classification number: H01R12/7023 ,  H01R12/7058 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/0311 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2201/10856 ,  H05K2203/167

Abstract: A joint structure of electronic element for linking circuit board and electronic element is provided. The joint structure of an electronic element for being electrically connected to a circuit board has at least one slot positioned thereon. And, the joint structure of the electronic element includes: at least one terminal which has a curved portion including a deflected angle with a normal line of a plane of the circuit board, wherein when the joint structure of the electronic element is connected with the slot, the terminal produces an elastic stress through suffering a jostle from the slot so as to urge against the slot for forming an electrical connection therebetween.

Abstract translation: 提供了用于连接电路板和电子元件的电子元件的接合结构。 用于电连接到电路板的电子元件的接合结构具有至少一个位于其上的槽。 并且，电子元件的接合结构包括：至少一个端子，其具有包括与电路板的平面的法线的偏转角度的弯曲部分，其中当电子元件的接合结构与槽 ，终端通过从槽中穿过约束而产生弹性应力，以便推动抵靠槽以在它们之间形成电连接。

公开(公告)号：US06680434B2

公开(公告)日：2004-01-20

申请号：US10037705

申请日：2001-12-29

Applicant: Ryan Yeh

Inventor： Ryan Yeh

IPC: H02G308

CPC classification number: H05K3/303 ,  H01R43/0256 ,  H01R43/0263 ,  H05K3/3426 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/1084 ,  Y02P70/611 ,  Y02P70/613

Abstract: A locating means assembly (100) includes a housing (1) and a plurality of terminals (2). The housing has a plurality of side walls (14) and defines a plurality of passageways (13) therein. A pair of ribs (12) protrude inwardly from lower portions of two side walls in each passageway and define a pair of grooves (11). Each terminal has a planar soldering portion (21), and a pair of fins (211) extending and bending upwardly from two lateral sides of the soldering portion, respectively. The terminal is received in the housing, the pair of fins elastically engaging in the two grooves, respectively. After the housing with the terminal is picked up and placed on a printed circuit board (PCB), the terminal is soldered to the PCB, and then the housing is removed.

Abstract translation: 定位装置组件（100）包括壳体（1）和多个端子（2）。 壳体具有多个侧壁（14）并且在其中限定多个通道（13）。 一对肋（12）从每个通道中的两个侧壁的下部向内突出并限定一对凹槽（11）。 每个端子具有平面焊接部分（21）和分别从焊接部分的两个侧面向上延伸并向上弯曲的一对散热片（211）。 端子容纳在壳体中，一对翅片分别弹性地接合在两个凹槽中。 将带有端子的外壳拿起并放置在印刷电路板（PCB）上后，将端子焊接到PCB上，然后拆下外壳。

公开(公告)号：US06646332B2

公开(公告)日：2003-11-11

申请号：US10213760

申请日：2002-08-07

Applicant: Terence Quintin Collier

Inventor： Terence Quintin Collier

IPC: H01L2302

CPC classification number: H01L24/83 ,  H01L23/49541 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512

Abstract: Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a 3D bond. As disclosed, the layers may comprise leads, dice, bond pads, or other substantially planar semiconductor package surfaces.

Abstract translation: 公开了半导体封装和方法，其结合在含铅和非铅性多层封装的层中使用通孔。 通孔提供层之间的流体连通，使得结合材料在用于形成3D结合的层之间流动。 如所公开的，这些层可以包括引线，裸片，接合焊盘或其它基本上平面的半导体封装表面。

公开(公告)号：US20030136812A1

公开(公告)日：2003-07-24

申请号：US10341191

申请日：2003-01-13

Applicant: NAS INTERPLEX, INC.

Inventor： Jack Seidler

IPC: B23K031/00

CPC classification number: H05K9/0028 ,  B23K1/0016 ,  B23K2101/40 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613

Abstract: An electromagnetic shield is provided and includes a shield body having an upper wall connected to opposing side walls and opposing end walls. At least two opposing walls of the electromagnetic shield each have a plurality of resilient fingers formed at a lower edge thereof. The electromagnetic shield also includes a solder mass securely held by the fingers by being interleaved between the fingers of each of the at least two opposing walls. The interleaving of the solder mass results in the solder mass being securely held by the fingers and ready for mounting to an electronic component for shielding a portion of the electronic component from undesirable and potentially damaging emissions from neighboring components. A method of mounting an electromagnetic shield to an electronic component having a planar surface and a method of interleaving the solder mass are also provided.

Abstract translation: 提供了一种电磁屏蔽，其包括屏蔽体，该屏蔽体具有连接到相对侧壁和相对端壁的上壁。 电磁屏蔽的至少两个相对的壁各自在其下边缘处形成有多个弹性指状物。 电磁屏蔽还包括通过在至少两个相对壁中的每一个的手指之间交错地由手指牢固地保持的焊料块。 焊料质量的交错导致焊料质量由手指牢固地保持，并且准备安装到电子部件上，用于屏蔽电子部件的一部分不受相邻部件的不期望的和潜在的破坏性的排放。 还提供了一种将电磁屏蔽件安装到具有平坦表面的电子部件和交错焊料块的方法。

公开(公告)号：US06552277B1

公开(公告)日：2003-04-22

申请号：US09658764

申请日：2000-09-08

Applicant: Stuart D. Downes

Inventor： Stuart D. Downes

IPC: H01R1204

CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: The invention is directed to techniques for forming a connection between a pin and a circuit board using a pin having protruding portions and grooved surfaces that extend between the protruding portions. The protruding portions (i) prevent the pin from inadvertently slipping through a via of the circuit board, and (ii) maintains the pin's proper position relative to the circuit board via. The grooved surfaces enable gas to vent from a cavity in the via during the solder process thus enabling solder to flow within the via and form a reliable and robust solder joint between the pin and the circuit board via. In one arrangement, the protruding portions and grooved surfaces are at both ends of the pin enabling the pin to be soldered between two circuit board sections. In one arrangement, the pin is simultaneously soldered to both circuit board sections. In another arrangement, the pin is initially soldered to one circuit board section, and subsequently soldered to another circuit board section. In either arrangement, the protruding portions of the pin, and in some arrangements close tolerances between the pin and the via, facilitate positioning of the pin in its proper location and the additional surface area provided by the grooved surfaces and the protruding portions (i.e., wetted metallic surfaces having a high affinity for solder) retain solder in the via cavities of the circuit board sections in order to form healthy solder joints. Accordingly, the invention is suitable for use in connecting multiple circuit board sections together at opposite ends of a pin.

Abstract translation: 本发明涉及使用具有在突出部分之间延伸的突出部分和凹槽表面的销来形成销和电路板之间的连接的技术。 突出部分（i）防止销不经意地滑过电路板的通孔，并且（ii）保持销相对于电路板通孔的适当位置。 沟槽表面使得气体在焊接过程期间能够从通孔中的空腔排出，从而使得焊料能够在通孔内流动，并在销和电路板通孔之间形成可靠且牢固的焊接接头。 在一种布置中，突出部分和沟槽表面位于销的两端，使得销能够焊接在两个电路板部分之间。 在一种布置中，引脚同时焊接到两个电路板部分。 在另一种布置中，该引脚最初被焊接到一个电路板部分，并随后焊接到另一个电路板部分。 在任何一种布置中，销的突出部分和在销和通孔之间的一些布置中的公差很容易将销定位在其正确的位置以及由凹槽表面和突出部分（即， 对焊料具有高亲和力的润湿金属表面）将焊料保留在电路板部分的通孔中，以形成健康的焊点。 因此，本发明适用于在引脚的相对端部处将多个电路板部分连接在一起。

公开(公告)号：US20020056571A1

公开(公告)日：2002-05-16

申请号：US10043002

申请日：2002-01-09

Inventor： Antonio Canova

IPC: H05K001/00 ,  H05K001/16

CPC classification number: H05K3/305 ,  H05K1/0263 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2203/0588 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

Abstract: There is described a process for producing printed circuits comprising a laminar support, an electrically conductive track on the laminar support, and an auxiliary conductive element soldered to the conductive track. There is a provision to apply the auxiliary conductive element by means of an apparatus for applying SMD components.

Abstract translation: 描述了一种用于生产印刷电路的方法，该印刷电路包括层状载体，层状载体上的导电轨道和焊接到导电轨道的辅助导电元件。 通过用于施加SMD部件的装置来施加辅助导电元件。