公开(公告)号：US07452213B2

公开(公告)日：2008-11-18

申请号：US11517842

申请日：2006-09-08

Applicant: Brett Robert Herdendorf ,  Ronald Eldon Anderson ,  Michael Jon Roe

Inventor： Brett Robert Herdendorf ,  Ronald Eldon Anderson ,  Michael Jon Roe

IPC: H01R12/00

CPC classification number: H01R12/62 ,  G01R1/0735 ,  G11B5/4853 ,  H01R12/79 ,  H01R13/03 ,  H01R13/22 ,  H01R2201/20 ,  H05K1/118 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/09172 ,  H05K2201/2009

Abstract: An assembly comprises a flex circuit including a first set of electrical contacts on a first side of the flex circuit and a compliant support backing adjacent a second side of the flex circuit and opposite the set of electrical contacts. The first set of electrical contacts is configured to connect to a second set of electrical contacts on an electronic component. The compliant support backing includes a set of support elements that individually support the first set of electrical contacts to increase the contact pressure between the first set of electrical contacts and the second set of electrical contacts when the flex circuit is connected to the electronic component. Embodiments may provide robust electrical contracts which provide a reliable connection useful for testing electronic components, such as head gimbal assemblies.

Abstract translation: 组件包括柔性电路，该柔性电路包括在柔性电路的第一侧上的第一组电触头和邻近柔性电路的第二侧并与该组电触点相对的柔性支撑背衬。 第一组电触头被配置为连接到电子部件上的第二组电触点。 柔性支撑背衬包括一组支撑元件，当柔性电路连接到电子部件时，单独地支撑第一组电触点以增加第一组电触点和第二组电触点之间的接触压力。 实施例可以提供可靠的电气合同，其提供用于测试电子部件（例如头部万向节组件）的可靠连接。

公开(公告)号：US20080275527A1

公开(公告)日：2008-11-06

申请号：US11924696

申请日：2007-10-26

Applicant: Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

Inventor： Robert J. Greenberg ,  Matthew J. McMahon ,  James Singleton Little ,  Kelly H. McClure ,  Brian V. Mech ,  Neil Hamilton Talbot ,  Jordan M. Neysmith

IPC: A61N1/00

CPC classification number: A61N1/36046 ,  A61N1/0543 ,  A61N1/37223 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/2009 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/302 ,  Y10T29/49158

Abstract: Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.

Abstract translation: 聚合物材料可用作用于神经刺激的电极阵列体。 它们特别有用于视网膜刺激以产生人造视觉，耳蜗刺激以产生人造听觉和皮质刺激以及许多相关目的。 通过电极阵列对视网膜或其他神经组织施加的压力是至关重要的。 太小的压力会导致电阻增加以及电场分散。 太大的压力可能会阻止血液流动。 通常的柔性电路制造技术通常需要使柔性电路电极阵列平坦。 由于神经组织几乎从不平坦，平面阵列必然会施加不均匀的压力。 此外，柔性电路聚合物阵列的边缘可以是尖锐的并切割精细的神经组织。 通过将适量的热应用于完整的阵列，可以引起曲线。 对于热塑性聚合物，可以进一步有利的是在多个模具中反复加热柔性电路，每个模具具有减小的半径。 此外，沿着边缘添加材料是有利的。 在柔性电路阵列中提供折叠或扭曲是更有利的。 可以在折叠内部和外部添加附加材料以促进与组织的良好密封。

公开(公告)号：US20080178723A1

公开(公告)日：2008-07-31

申请号：US11986643

申请日：2007-11-21

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: B26D5/08

CPC classification number: H01L23/4985 ,  H01L21/67092 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/118 ,  H05K3/005 ,  H05K3/0052 ,  H05K3/0064 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y10T83/869

Abstract: A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals extending from the first region to the second region formed on another surface thereof in a manner that the reinforcing member overlaps the terminals and a part thereof protrudes from the first region to the second region; cutting the terminals along a boundary between the first region and the second region; and continuously cutting the reinforcing member from an inboard side thereof to an outboard side along the boundary between the first region and the second region.

公开(公告)号：US20080173997A1

公开(公告)日：2008-07-24

申请号：US11983868

申请日：2007-11-13

Applicant: Hiroshi Kobayashi

Inventor： Hiroshi Kobayashi

IPC: H01L23/48 ,  H01L21/58

CPC classification number: H05K1/0271 ,  G06K19/0723 ,  H01L21/563 ,  H01L23/4985 ,  H01L23/49855 ,  H01L24/12 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/189 ,  H05K3/305 ,  H05K3/3494 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/0278 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing an electronic device includes the steps of: forming a conductive pattern on a film made of a resin material and thereby forming a base body on which a circuit chip is mounted; forming a reinforcing layer that suppresses expansion and contraction of the film in either one of a mounting area on the film which area the circuit chip is mounted on and a rear area at the back of the mounting area; applying a thermosetting adhesive; mounting the circuit chip; pinching the base body mounted with the circuit chip by a heating device that heats the thermosetting adhesive and has a pressing section and a supporting section; and fixing the circuit chip to the conductive pattern by hardening the thermosetting adhesive through heating by the heating device.

Abstract translation: 一种制造电子器件的方法包括以下步骤：在由树脂材料制成的膜上形成导电图案，从而形成其上安装有电路芯片的基体; 在安装有电路芯片的区域的膜的安装区域和安装区域的背面的后部区域中形成抑制膜的膨胀和收缩的增强层; 涂上热固性粘合剂; 安装电路芯片; 通过加热装置夹住安装有电路芯片的基体，并且具有加压部分和支撑部分; 并且通过加热装置的加热硬化热固性粘合剂将电路芯片固定到导电图案上。

公开(公告)号：US07385788B2

公开(公告)日：2008-06-10

申请号：US10990139

申请日：2004-11-16

Applicant: Takashi Kubota ,  Kenji Kobae

Inventor： Takashi Kubota ,  Kenji Kobae

IPC: G11B21/21 ,  G11B5/48

CPC classification number: H05K3/361 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/386 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/0285

Abstract: A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.

Abstract translation: 构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题 飞行引线被拔出不会发生接合端子。 柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行 引线被压在接合端子上。 另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动 接合端子。

公开(公告)号：US07384272B2

公开(公告)日：2008-06-10

申请号：US11477937

申请日：2006-06-30

Applicant: Sang-Ju Na

Inventor： Sang-Ju Na

IPC: H05K1/10

CPC classification number: H01R12/62 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/056 ,  H05K2201/10598 ,  H05K2201/2009 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: The present invention relates to a flexible printed circuit board assembly. A flexible printed circuit board assembly of the present invention comprises a flexible printed circuit board having a plurality of circuit patterns; a connector mounted at a location spaced apart by a certain distance from an end of the flexible printed circuit board and electrically connected to the, circuit patterns; and a stiffener attached to a region on a bottom surface of the flexible printed circuit board below the connector and having a size corresponding to that of the connector. A connector inside portion and a connector outside portion of the flexible printed circuit board located inside and outside with respect to the connector can be bent. The connector outside portion is bent and bonded to a bottom surface of the stiffener, and the connector inside portion is bent and bonded to a bottom surface of the connector outside portion.

Abstract translation: 本发明涉及柔性印刷电路板组件。 本发明的柔性印刷电路板组件包括具有多个电路图案的柔性印刷电路板; 连接器，其安装在与所述柔性印刷电路板的端部间隔开一定距离并且电连接到所述电路图案的位置处; 以及加强件，其附接到所述柔性印刷电路板的位于所述连接器下方的底表面上的区域，并且具有与所述连接器的尺寸相对应的尺寸。 柔性印刷电路板的连接器内部部分和连接器外侧部分相对于连接器位于内部和外侧可以弯曲。 连接器外侧部分弯曲并结合到加强件的底表面，并且连接器内部部分弯曲并结合到连接器外侧部分的底表面。

公开(公告)号：US20080132001A1

公开(公告)日：2008-06-05

申请号：US12011918

申请日：2008-01-30

Applicant: Munehide Saimen

Inventor： Munehide Saimen

IPC: H01L21/304

CPC classification number: H05K1/118 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/0058 ,  H05K2201/09236 ,  H05K2201/09727 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0228 ,  H01L2924/00

Abstract: A method for manufacturing an electronic part, including: cutting a wiring substrate, which contains a base substrate, a wiring pattern provided on a first surface of the base substrate, and a reinforcing member provided on a second surface of the base substrate, along a line intersecting with an outer circumference of the reinforcing member; wherein a wire, out of a plurality of wires composing the wiring pattern, arranged closest to an intersecting point of the outer circumference of the reinforcing member and the line has a widest width.

Abstract translation: 一种电子部件的制造方法，其特征在于，包括：切断包含基底基板的布线基板，设置在所述基板的第一面上的布线图案，以及沿着所述基板的第二面设置的加强部件 与所述加强构件的外周相交的线; 其特征在于，构成所述布线图案的多根配线最靠近所述加强部件的外周的交叉点布线的线最宽。

公开(公告)号：US07382946B2

公开(公告)日：2008-06-03

申请号：US11861766

申请日：2007-09-26

Applicant: Stefano S. Oggioni ,  Bert J. Offrein

Inventor： Stefano S. Oggioni ,  Bert J. Offrein

IPC: G02B6/12

CPC classification number: H05K1/147 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09127 ,  H05K2201/2009

Abstract: An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.

Abstract translation: 公开了一种包括柔性连接电缆和对准能力的电光模块。 电光器件可以焊接在诸如玻璃的透明衬底或包括其中导电迹线被设计的光波导的衬底上，形成电光模块。 当将这种电光模块插入并对准印刷电路板时，包括导电迹线和焊盘（称为柔性电缆）的基板的外部部分朝向PCB的安装平面向下弯曲，允许建立 这些焊盘和PCB之间的电气连接。 衬底可以沿着预先形成的凹槽断裂，并且衬底的外部部分可被移除，使得柔性电缆部分到位。

公开(公告)号：US20080079143A1

公开(公告)日：2008-04-03

申请号：US11536570

申请日：2006-09-28

Applicant: Edmund B. Boucher ,  George C. Anderson ,  Jose N. Diaz

Inventor： Edmund B. Boucher ,  George C. Anderson ,  Jose N. Diaz

IPC: H01L23/34

CPC classification number: H01L23/66 ,  H01L2223/6644 ,  H01L2924/0002 ,  H05K1/0237 ,  H05K1/0271 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/2009 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A miniature multiple die packaging assembly suitable for use in a radio is provided. The assembly includes a heatsink having contact with a chassis of the radio, a circuit board containing a plurality of active devices having leads to a perimeter of the circuit board, and a mating board having an opening. The mating board attaches along a top perimeter of the circuit board to pass the leads of the circuit board for extending a connection of the active devices to a radio board. The plurality of active devices are in contact and coplanar with the heatsink for providing efficient heat dissipation. The circuit board can interchangeably accept single package die or multiple package die having different sizes and layouts.

Abstract translation: 提供一种适用于无线电的微型多模包装组件。 该组件包括与无线电装置的底盘接触的散热器，包含多个有线器件的电路板，该有源器件具有通向电路板周边的引线，以及具有开口的匹配板。 配对板沿着电路板的顶部周边附接，以通过电路板的引线，用于将有源器件的连接延伸到无线电板。 多个有源器件与散热器接触并共面以提供有效的散热。 电路板可以互换地接受具有不同尺寸和布局的单一封装裸片或多个封装裸片。

公开(公告)号：US20080073765A1

公开(公告)日：2008-03-27

申请号：US11535740

申请日：2006-09-27

Applicant: John S. Corbin ,  David L. Edwards ,  David C. Long ,  Jason S. Miller

Inventor： John S. Corbin ,  David L. Edwards ,  David C. Long ,  Jason S. Miller

IPC: H01L23/02

CPC classification number: H05K3/325 ,  H05K1/0271 ,  H05K3/0058 ,  H05K2201/10719 ,  H05K2201/2009 ,  H05K2203/074

Abstract: An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

Abstract translation: 公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器 用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。 基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。