公开(公告)号：US5884398A

公开(公告)日：1999-03-23

申请号：US839760

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R9/00

CPC classification number: B23K20/004 ,  B23K20/007 ,  C25D7/12 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/326 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2886 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5852257A

公开(公告)日：1998-12-22

申请号：US794761

申请日：1996-05-30

Applicant: Eberhard Siegfried Dittman ,  Mukund Kantilal Saraiya

Inventor： Eberhard Siegfried Dittman ,  Mukund Kantilal Saraiya

IPC: B23K1/005 ,  B23K35/26 ,  G02B6/42 ,  H01R43/02 ,  H01S3/00 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01R13/46

CPC classification number: B23K35/268 ,  B23K1/0056 ,  G02B6/4201 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4246 ,  G02B6/4292 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/363 ,  B23K2201/40 ,  G02B6/4263 ,  G02B6/4269 ,  G02B6/4274 ,  G02B6/4281 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/0397 ,  H05K2201/10121 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/306 ,  H05K3/3457 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/366 ,  H05K3/4092 ,  Y02P70/613

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend from the optical sub-assemblies. At the other end of the cable leads extend across interconnection pads on the surface of the rigid interconnect structure for soldered connection. The top surface of the interconnect pads is 10/90 (Sn/Pb) solder to provide a high temperature soldered joint. Solder flux can not be used because cleaning solvents would contaminate the interconnect structure. An atmosphere of formic acid mixed with nitrogen surrounds the lead and pad and a fluxless solder joint is formed.

Abstract translation: 光学模块包含形成电缆的柔性电路板，其连接在光学模块内的光学子组件和刚性互连结构之间。 电缆的一端包括靠近通孔的焊盘，用于焊接连接到从光学子组件延伸的销。 在电缆引线的另一端延伸穿过用于焊接连接的刚性互连结构的表面上的互连焊盘。 互连焊盘的顶面是10/90（Sn / Pb）焊料，以提供高温焊接接头。 不能使用焊剂，因为清洁溶剂会污染互连结构。 与氮气混合的甲酸气氛围绕铅和焊盘，形成无助焊剂焊点。

公开(公告)号：US5812378A

公开(公告)日：1998-09-22

申请号：US511131

申请日：1995-08-04

Applicant: Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. DiStefano ,  A. Christian Walton

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H05K7/12 ,  H01R9/09

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/72 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2485 ,  H05K3/326 ,  H05K3/3436 ,  H05K7/1069 ,  G01R1/06733 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H05K1/118 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/3431 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connector for microelectronic includes a sheet-like body having a plurality of holes, desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact such as a ring of a sheet metal having a plurality of projections extending inwardly over the hole of a first major surface of the body. Terminals on a second surface of the connector body are electrically connected to the contacts. The connector can be attached to a substrate such a multi-layer circuit panel so that the terminals on the connector are electrically connected to the leads within the substrate. Microelectronic elements having bump leads thereon may be engaged with the connector and hence connected to the substrate, by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子的连接器包括具有多个孔的片状体，理想地布置成规则的格子图案。 每个孔设置有弹性层状接触，例如金属板的环，其具有在主体的第一主表面的孔的内部向内延伸的多个突起。 连接器主体的第二表面上的端子电连接到触点。 连接器可以附接到诸如多层电路板的基板，使得连接器上的端子电连接到基板内的引线。 具有凸起引线的微电子元件可以与连接器接合并且因此连接到基板，通过将凸块引线推进到连接器的孔中以与触点接合凸起引线。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：US5802711A

公开(公告)日：1998-09-08

申请号：US163202

申请日：1993-12-06

Applicant: Duane Foster Card ,  Eberhard Siegfried Dittman ,  Mukund Kantilal Saraiya

Inventor： Duane Foster Card ,  Eberhard Siegfried Dittman ,  Mukund Kantilal Saraiya

IPC: B23K1/005 ,  B23K35/26 ,  G02B6/42 ,  H01L31/0203 ,  H05K1/00 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/3447 ,  B23K1/0056 ,  B23K35/268 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4274 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H01L31/0203 ,  H01R12/62 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/363 ,  B23K2201/40 ,  G02B6/4201 ,  G02B6/4269 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/306 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/366 ,  H05K3/4092 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to leads which extend from the optical sub-assemblies and are substantially smaller than the hole. A soldering bridge comprising several separate tabs equally spaced about the land and which project from the land into the hole and are very flexible in relation to the lead so that the lead can be placed in any radial position within the hole, but regardless of the position of the lead within the hole the projections of the soldering bridge project close enough to the lead so that during wave soldering a joint of desired configuration is produced. The soldering bridge can be integral with the land so that the bridge helps connect the solder to the land allowing the land to be smaller and thus providing for closer spacing between connection holes. More generally, the soldering bridge of the invention is useful for mass soldering of any flexible or rigid circuit board in which leads are to be inserted into substantially larger passages or passages are to be very closely spaced.

Abstract translation: 光学模块包含形成电缆的柔性电路板，其连接在光学模块内的光学子组件和刚性互连结构之间。 电缆包括靠近通孔的焊盘，用于焊接连接到从光学子组件延伸并且基本上小于孔的引线。 一种焊接桥，包括几个单独的突出部，其平行地围绕该平台分隔开并且从该凸台突出到该孔中并且相对于引线非常柔性，使得该引线可以放置在该孔内的任何径向位置，而不管该位置 在孔内的引线内，焊接桥的突出部分足够靠近引线，使得在波峰焊期间产生所需构造的接头。 焊接桥可以与焊盘成一体，使得桥接器有助于将焊料连接到焊盘，从而使焊盘更小，从而在连接孔之间提供更紧密的间隔。 更一般来说，本发明的焊接桥可用于任何柔性或刚性电路板的大规模焊接，其中引线将被插入到基本较大的通道中或通道将非常紧密地间隔开。

公开(公告)号：US5801441A

公开(公告)日：1998-09-01

申请号：US440665

申请日：1995-05-15

Applicant: Thomas H. DiStefano ,  John W. Smith

Inventor： Thomas H. DiStefano ,  John W. Smith

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52 ,  H01R4/58 ,  H01R9/09

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

公开(公告)号：US5793611A

公开(公告)日：1998-08-11

申请号：US752009

申请日：1996-11-19

Applicant: Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

Inventor： Norio Nakazato ,  Shigeki Hirasawa ,  Shoji Masukawa ,  Heikichi Kuwahara

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0201 ,  H05K1/0207 ,  H05K7/20509 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/0187 ,  H05K2201/0397 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/1028 ,  H05K2201/10416 ,  H05K2203/304

Abstract: An electronic device comprises a substrate having electronic parts, electric conductive wires for electrically connecting between the electronic parts, a front surface on which the electronic parts and electric conductive wires are mounted, a reverse surface and at least one electronic part back portion opposite to the electronic parts; and at least one high thermal conductivity member, a thermal conductivity coefficient thereof being higher than that of the substrate, the high thermal conductivity member being connected to the electronic part back portion while the high thermal conductivity member is opposite to the electronic parts in a substrate width direction to decrease a difference in temperature between the electronic parts.

Abstract translation: 电子设备包括具有电子部件的基板，用于电连接电子部件的导电线，安装有电子部件和导电线的前表面，反面以及与该电子部件相对的至少一个电子部件后部 电子零件; 和至少一个高导热性部件，其导热系数高于基板的导热系数，高导热性部件连接到电子部件背部，同时高导热性部件与基板中的电子部件相对 宽度方向以减小电子部件之间的温度差。

公开(公告)号：US5703752A

公开(公告)日：1997-12-30

申请号：US518505

申请日：1995-08-23

Applicant: Suk Ha Woo

Inventor： Suk Ha Woo

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K7/20

CPC classification number: H05K3/4084 ,  H05K1/0204 ,  H01L2924/0002 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/4092 ,  H05K3/44

Abstract: A heat dissipating apparatus for a semiconductor device for use in a motor drive that improves heat dissipation efficiency by transferring heat from the semiconductor device directly to a heat sink, using ground leads or nonconnection leads of element lead pins. In addition, it is possible to connect the semiconductor device to the heat sink without extra fixing members

Abstract translation: 一种用于电机驱动器中的半导体器件的散热装置，其通过使用元件引线引脚的接地引线或非连接引线将热量从半导体器件直接传递到散热器来提高散热效率。 此外，可以在没有额外的固定构件的情况下将半导体器件连接到散热器

公开(公告)号：US5604831A

公开(公告)日：1997-02-18

申请号：US976620

申请日：1992-11-16

Applicant: Eberhard S. Dittman ,  Mukund K. Saraiya

Inventor： Eberhard S. Dittman ,  Mukund K. Saraiya

IPC: B23K1/005 ,  B23K35/26 ,  G02B6/42 ,  H01R43/02 ,  H01S3/00 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: B23K35/268 ,  B23K1/0056 ,  G02B6/4201 ,  G02B6/4236 ,  G02B6/4238 ,  G02B6/4246 ,  G02B6/4292 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/363 ,  B23K2201/40 ,  G02B6/4263 ,  G02B6/4269 ,  G02B6/4274 ,  G02B6/4281 ,  H05K1/0393 ,  H05K1/118 ,  H05K2201/0397 ,  H05K2201/10121 ,  H05K2201/1059 ,  H05K2203/0195 ,  H05K2203/107 ,  H05K3/306 ,  H05K3/3457 ,  H05K3/3468 ,  H05K3/3494 ,  H05K3/366 ,  H05K3/4092 ,  Y02P70/613

Abstract: An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connection to pins which extend from the optical sub-assemblies. At the other end of the cable leads extend across interconnection pads on the surface of the rigid interconnect structure for soldered connection. The top surface of the interconnect pads is 10/90 (Sn/Pb) solder to provide a high temperature soldered joint. Solder flux can not be used because cleaning solvents would contaminate the interconnect structure. An atmosphere of formic acid mixed with nitrogen surrounds the lead and pad and a fluxless solder joint is formed.

Abstract translation: 光学模块包含形成电缆的柔性电路板，其连接在光学模块内的光学子组件和刚性互连结构之间。 电缆的一端包括靠近通孔的焊盘，用于焊接连接到从光学子组件延伸的销。 在电缆引线的另一端延伸穿过用于焊接连接的刚性互连结构的表面上的互连焊盘。 互连焊盘的顶面是10/90（Sn / Pb）焊料，以提供高温焊接接头。 不能使用焊剂，因为清洁溶剂会污染互连结构。 与氮气混合的甲酸气氛围绕铅和焊盘，形成无助焊剂焊点。

公开(公告)号：US5598627A

公开(公告)日：1997-02-04

申请号：US471168

申请日：1995-06-06

Applicant: Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

Inventor： Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

IPC: H01R12/62 ,  H05K1/11 ,  H05K3/10 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K7/00 ,  H01R43/04

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/363 ,  H05K7/005 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/052 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10977 ,  H05K3/103 ,  H05K3/281 ,  H05K3/4092 ,  Y10T29/49117 ,  Y10T29/49181

Abstract: A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.

Abstract translation: 线束包括主电路部分1，其包括绝缘导体布线电路板3，其中导体8布置在基底绝缘膜9上，以通过转动，弯曲，交叉或分支导体形成布线电路并且被覆盖有柔性 此外，分支连接部件2设置有印刷电路板4，印刷电路板4通过形成在其上的连接区域14B连接到主电路部分1中的连接区域14A，并且适于接收引导电线5.导体布线 电路板30是柔性电路板，其具有绝缘基膜33，并置在基膜上的导体31，上覆盖膜32和用于导体31的连接区域36，导体31在背面侧具有粘合层37 通过沿着覆盖膜32的横向除去基膜33的预定宽度38形成连接区域36。

公开(公告)号：US5482200A

公开(公告)日：1996-01-09

申请号：US200038

申请日：1994-02-22

Applicant: Bruce A. Myers ,  Ronnie J. Runyon

Inventor： Bruce A. Myers ,  Ronnie J. Runyon

IPC: B23K1/00 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  B23K1/018 ,  B23K31/02

CPC classification number: B23K1/001 ,  H05K3/363 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2203/0338 ,  H05K2203/162 ,  H05K2203/176 ,  H05K3/3484 ,  H05K3/4092

Abstract: A method is provided for applying solder to a flip chip pattern on a circuit board. The method involves forming solder bumps on a chip, and then transferring the solder bumps to the flip chip pattern by soldering the chip to the flip chip pattern, and then gradually heating the solder bumps while applying a force to separate the chip from the circuit board, such that the solder bumps substantially remain adhered to the flip chip pattern. The solder is transferred to the flip chip pattern in order to allow a flexible circuit interconnect to be soldered to the flip chip pattern for the purpose of establishing electronic communications between the circuit board's electronic circuit components and a microprocessor emulator. The electronic circuit can then be evaluated and tested without a microprocessor chip being present on the substrate.

Abstract translation: 提供了一种用于将焊料施加到电路板上的倒装芯片图案的方法。 该方法包括在芯片上形成焊料凸块，然后通过将芯片焊接到倒装芯片图案将焊料凸块转移到倒装芯片图案，然后在施加力以将芯片与电路板分离的同时逐渐加热焊料凸块 ，使得焊料凸块基本上保持粘附到倒装芯片图案。 为了在电路板的电子电路部件和微处理器模拟器之间建立电子通信，将焊料转移到倒装芯片图案，以便允许柔性电路互连件被焊接到倒装芯片图案。 然后可以评估和测试电子电路，而不在基板上存在微处理器芯片。