公开(公告)号：US09650538B2

公开(公告)日：2017-05-16

申请号：US14305767

申请日：2014-06-16

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Hideto Kato ,  Hiroshi Kanbara ,  Tomoyoshi Furihata ,  Yoshinori Hirano

IPC: G03F7/023 ,  C09D163/04 ,  G03F7/022 ,  B81C1/00 ,  G03F7/40 ,  G03F7/30 ,  G03F7/20

CPC classification number: C09D163/04 ,  B81C1/00619 ,  B81C2201/0108 ,  G03F7/0226 ,  G03F7/0236 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70466

Abstract: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

公开(公告)号：US20170113925A1

公开(公告)日：2017-04-27

申请号：US15297662

申请日：2016-10-19

Applicant: Commissariat a L'Energie Atomique et aux Energies Alternatives

Inventor： Patrice REY

IPC: B81C1/00

CPC classification number: B81C1/0023 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2201/0109 ,  B81C2201/0126 ,  B81C2201/014 ,  B81C2201/056 ,  B81C2203/01 ,  B81C2203/0792

Abstract: Method for encapsulation of a microelectronic component, including making of a portion of sacrificial material on a front face of a first substrate in which the component is intended to be made, then making of a cover encapsulating the portion of sacrificial material, then making of the component by etching the first substrate from its back face, such that part of the component is arranged to face the portion of sacrificial material and such that the portion of sacrificial material is accessible from a back face of the component, then elimination of the portion of sacrificial material by etching from the back face of the component, then securing of the back face of the component to a second substrate.

公开(公告)号：US09567213B1

公开(公告)日：2017-02-14

申请号：US14827683

申请日：2015-08-17

Applicant: Texas Instruments Incorporated

Inventor： John Charles Ehmke ,  Virgil Cotoco Ararao

IPC: H01L21/00 ,  H01L21/44 ,  H01L21/31 ,  G02B6/12 ,  G02B5/124 ,  G09G3/34 ,  H01J5/00 ,  H01L23/02 ,  B81C1/00 ,  B81B7/00 ,  G02B26/08 ,  G02B6/42 ,  G02B26/00 ,  B82Y30/00

CPC classification number: B81B7/0038 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0188 ,  B81C2201/0198 ,  B81C2201/053 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/035 ,  B82Y30/00 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4248 ,  G02B26/001 ,  G02B26/0833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/039 ,  H01L2224/04026 ,  H01L2224/05083 ,  H01L2224/05109 ,  H01L2224/05123 ,  H01L2224/05138 ,  H01L2224/05163 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05562 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/279 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/29109 ,  H01L2224/29144 ,  H01L2224/32058 ,  H01L2224/32227 ,  H01L2224/83121 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01074 ,  H01L2924/1461 ,  H01L2924/164 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2224/03 ,  H01L2924/01042 ,  H01L2924/01072 ,  H01L2924/01004 ,  H01L2224/83 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03462

Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (101a), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom first metal seed film (131a) adhering to the substrate and a bottom second metal seed film (131b) adhering to the bottom first seed film, both seed films of a first width (131c) and a common sidewall (138); further a top first metal seed film (132a) adhering to the cap and a top second metal seed film (132b) adhering to the top first seed film, both seed films with a second width (132c) smaller than the first width and a common sidewall (139); the bottom and top metal seed films tied to a metal layer (135) including gold-indium intermetallic compounds, layer (135) having a second height (133a) greater than the first height and encasing the seed films and common sidewalls.

Abstract translation: 一种密封包装，其包括具有具有第一高度（101a）的MEMS结构（101）的表面的基底（110），所述基底被气密地密封到在所述MEMS结构上形成空腔的帽（120） 所述盖通过粘附到所述基板表面和所述盖的金属层的垂直堆叠（130）附接到所述基板表面，所述堆叠具有围绕所述MEMS结构的连续轮廓，同时与所述MEMS结构隔开距离（140）; 所述堆叠具有附着到所述基板的底部第一金属种子膜（131a）和粘附到所述底部第一种子膜的底部第二金属种子膜（131b），具有第一宽度（131c）和公共侧壁（138）的两种种子膜 ）; 另外，粘附到盖的顶部第一金属种子膜（132a）和粘附到顶部第一种子膜的顶部第二金属种子膜（132b），具有小于第一宽度的第二宽度（132c）的两种种子膜和共同的 侧壁（139）; 连接到包括金 - 铟金属间化合物的金属层（135）的底部和顶部金属种子膜，具有大于第一高度的第二高度（133a）的层（135）并且包围种子膜和共同侧壁。

公开(公告)号：US09550023B2

公开(公告)日：2017-01-24

申请号：US14317854

申请日：2014-06-27

Applicant: Changlin Pang ,  Jason Shih ,  Fukang Jiang ,  Changgeng Liu ,  Sean Caffey ,  Andrew Urazaki

Inventor： Changlin Pang ,  Jason Shih ,  Fukang Jiang ,  Changgeng Liu ,  Sean Caffey ,  Andrew Urazaki

IPC: B29C59/14 ,  A61M5/145 ,  B44C1/22 ,  F04B43/00 ,  F04B45/04 ,  B81C99/00 ,  A61M5/142 ,  B29K23/00 ,  F16K99/00

CPC classification number: A61M5/14586 ,  A61M5/14276 ,  A61M2005/14204 ,  B29C59/14 ,  B29C2791/004 ,  B29K2023/00 ,  B81B2203/0127 ,  B81C99/008 ,  B81C2201/0108 ,  F04B43/0054 ,  F04B45/04 ,  F16K2099/008

Abstract: A removable material is deposited or otherwise applied to a flat substrate surface in a pattern corresponding to desired corrugations in a membrane, e.g., a deflection diaphragm. The applied material serves as a scaffold for a polymeric material, which is applied thereover, and following cure or hardening, the polymeric material is removed to form a finished corrugated membrane.

Abstract translation: 将可移除材料沉积或以其它方式施加到平坦的基底表面上，图案对应于膜（例如偏转膜片）中的期望波纹。 施加的材料用作聚合材料的支架，其被施加到其上，并且在固化或硬化之后，去除聚合物材料以形成成品波纹膜。

公开(公告)号：US09446947B2

公开(公告)日：2016-09-20

申请号：US14467521

申请日：2014-08-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Earl Vedere Atnip ,  Raul Enrique Barreto ,  Kelly J. Taylor

IPC: B81C1/00

CPC classification number: B81C1/00666 ,  B81B3/0072 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81C1/00365 ,  B81C2201/0108 ,  B81C2201/0132 ,  B81C2201/0167 ,  B81C2201/0178

Abstract: A MEMS device is formed by forming a sacrificial layer over a substrate and forming a first metal layer over the sacrificial layer. Subsequently, the first metal layer is exposed to an oxidizing ambient which oxidizes a surface layer of the first metal layer where exposed to the oxidizing ambient, to form a native oxide layer of the first metal layer. A second metal layer is subsequently formed over the native oxide layer of the first metal layer. The sacrificial layer is subsequently removed, forming a released metal structure.

Abstract translation: 通过在衬底上形成牺牲层并在牺牲层上形成第一金属层来形成MEMS器件。 随后，将第一金属层暴露于氧化环境中，氧化暴露于氧化环境的第一金属层的表面层，以形成第一金属层的天然氧化物层。 随后在第一金属层的自然氧化物层上形成第二金属层。 随后去除牺牲层，形成释放的金属结构。

公开(公告)号：US20160161193A1

公开(公告)日：2016-06-09

申请号：US14925787

申请日：2015-10-28

Applicant: KELVIN THERMAL TECHNOLOGIES, INC.

Inventor： Ryan John Lewis ,  Yung-Cheng Lee ,  Li-Anne Liew ,  Yunda Wang

IPC: F28D15/04 ,  C23F4/00 ,  B23P15/26

CPC classification number: F28D15/046 ,  B23P15/26 ,  B81C1/00388 ,  B81C2201/0108 ,  C23F4/00 ,  F28D15/0233 ,  F28F13/187

Abstract: Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.

Abstract translation: 本文描述的实施例涉及基于聚合物的热接地平面的概念和设计。 根据一个实施例，使用聚合物作为制造热接地平面的材料。 其他实施方案包括使用两个微柱阵列的优化芯吸结构设计，使用铜/聚合物处理的TGP的基于光刻的微加工，微柱，嵌入微柱中的节流释放孔，原子层沉积（ALD）亲水 涂层，节流流体充填结构和密封方法，无缺陷ALD气密涂层，符合结构设计。

公开(公告)号：US08999629B2

公开(公告)日：2015-04-07

申请号：US14250455

申请日：2014-04-11

Applicant: Georgia Tech Research Corporation

Inventor： Paul Kohl ,  Yu-Chun Chen

IPC: G03F7/095 ,  G03F7/004 ,  G03F7/039 ,  G03F7/16 ,  G03F7/36 ,  G03F7/38 ,  G03F7/40 ,  B81C1/00 ,  H01L21/768

CPC classification number: G03F7/095 ,  B81B2203/0315 ,  B81C1/00476 ,  B81C2201/0108 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/168 ,  G03F7/36 ,  G03F7/38 ,  G03F7/40 ,  H01L21/7682

Abstract: Embodiments according to the present invention relate generally to PAG bilayer and PAG-doped unilayer structures using sacrificial polymer layers that incorporate a photoacid generator having a concentration gradient therein. Said PAG concentration being higher in a upper portion of such structures than in a lower portion thereof. Embodiments according to the present invention also relate to a method of using such bilayers and unilayers to form microelectronic structures having a three-dimensional space, and methods of decomposition of the sacrificial polymer within the aforementioned layers.

Abstract translation: 根据本发明的实施方案一般涉及使用掺入其中具有浓度梯度的光致酸发生器的牺牲聚合物层的PAG双层和PAG掺杂的单层结构。 所述PAG浓度在这种结构的上部比在其下部更高。 根据本发明的实施方案还涉及使用这种双层和单层以形成具有三维空间的微电子结构的方法，以及在上述层内分解牺牲聚合物的方法。

公开(公告)号：US20140272708A1

公开(公告)日：2014-09-18

申请号：US14250455

申请日：2014-04-11

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： PAUL KOHL ,  YU-CHUN CHEN

IPC: G03F7/095

CPC classification number: G03F7/095 ,  B81B2203/0315 ,  B81C1/00476 ,  B81C2201/0108 ,  G03F7/0045 ,  G03F7/039 ,  G03F7/168 ,  G03F7/36 ,  G03F7/38 ,  G03F7/40 ,  H01L21/7682

Abstract: Embodiments according to the present invention relate generally to PAG bilayer and PAG-doped unilayer structures using sacrificial polymer layers that incorporate a photoacid generator having a concentration gradient therein. Said PAG concentration being higher in a upper portion of such structures than in a lower portion thereof. Embodiments according to the present invention also relate to a method of using such bilayers and unilayers to form microelectronic structures having a three-dimensional space, and methods of decomposition of the sacrificial polymer within the aforementioned layers.

Abstract translation: 根据本发明的实施方案一般涉及使用掺入其中具有浓度梯度的光致酸发生器的牺牲聚合物层的PAG双层和PAG掺杂的单层结构。 所述PAG浓度在这种结构的上部比在其下部更高。 根据本发明的实施方案还涉及使用这种双层和单层以形成具有三维空间的微电子结构的方法，以及在上述层内分解牺牲聚合物的方法。

公开(公告)号：US20140268274A1

公开(公告)日：2014-09-18

申请号：US13842882

申请日：2013-03-15

Applicant: PIXTRONIX, INC.

Inventor： Timothy Brosnihan ,  Javier Villarreal ,  Michael Andrew Gingras

IPC: G02B5/00 ,  B29D11/00 ,  G02B26/02

CPC classification number: G02B5/005 ,  B29D11/0074 ,  B81C1/00317 ,  B81C2201/0108 ,  G02B26/023

Abstract: This disclosure provides systems, methods and apparatus for displaying images. Some such apparatus include an array of display elements coupled to a substrate and an elevated aperture layer (EAL) suspended over the array of display elements. The EAL is coupled to the substrate, and includes, for each of the display elements, at least one aperture for allowing passage of light therethrough. Methods for manufacturing such apparatus include at least one of forming etch holes through the EAL, employing an at least partially sublimatable sacrificial mold, employing a two phase release process, and releasing the apparatus such that a portion of a sacrificial mold remains surrounding portions of the apparatus.

Abstract translation: 本公开提供了用于显示图像的系统，方法和装置。 一些这样的设备包括耦合到基板的显示元件阵列和悬挂在显示元件阵列上的升高的孔径层（EAL）。 所述EAL耦合到所述基板，并且对于每个所述显示元件包括用于允许光通过的至少一个孔。 用于制造这种设备的方法包括至少一个通过EAL形成蚀刻孔，使用至少部分可升华的牺牲模具，采用两相释放过程，并且释放该设备使得牺牲模具的一部分保持围绕 仪器。

公开(公告)号：US08765512B2

公开(公告)日：2014-07-01

申请号：US13706488

申请日：2012-12-06

Applicant: Georgia Tech Research Corporation

Inventor： Paul A Kohl ,  Rajarshi Saha ,  Nathan Fritz

IPC: H01L29/84 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00261 ,  B81B3/0018 ,  B81C1/00333 ,  B81C2201/0108 ,  B81C2203/0154

Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 μm×400 μm to 300 μm×400 μm have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques. Capacitive resonators packaged using this protocol have shown clean sensing electrodes and good functionality.

Abstract translation: 本发明公开并要求用于微机电装置（MEMS）的成本有效的晶片级封装工艺。 具体来说，MEMS器件的可移动部件以晶片形式被封装和保护，从而可以使用商品的引线框架封装。 已经使用外涂聚合物，例如环氧环己基多面体低聚倍半硅氧烷（EPOSS）作为掩模材料来模制牺牲聚合物以及覆盖空气腔。 所产生的空气腔是干净，无碎片和坚固的。 空腔具有相当大的强度以承受MEMS器件的引线框架封装期间的成型压力。 已经制造了从20μm×400μm到300μm×400μm的宽范围的空腔，并且被证明是机械稳定的。 这些可能会在各种尺寸范围内容纳MEMS器件。 已经使用纳米压痕研究了腔的强度，并使用分析和有限元技术进行了建模。 使用该协议封装的电容谐振器已经显示出清洁的感测电极和良好的功能。