公开(公告)号：US12058808B2

公开(公告)日：2024-08-06

申请号：US17689318

申请日：2022-03-08

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wenliang Li ,  Zewen Wang ,  Xusheng Liu ,  Ertang Xie ,  Zhong Yan ,  Wang Xiong

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0222 ,  H05K1/115 ,  H05K2201/0338

Abstract: A printed circuit board includes a connector insertion area including many rows of crimping holes, each row of crimping holes includes at least two pairs of signal crimping holes (SCHs), and each pair of SCHs includes two SCHs. In a row arrangement direction of the crimping holes, at least one ground crimping hole (GCH) is arranged on either side of each pair of SCHs. A depth of the GCH is greater than or equal to a depth of the SCH, the GCH includes a main hole and a shielding component on at least one side of the main hole, a part of a side wall of the main hole is a part of a side wall of the shielding component, and a sum of lengths of the main hole and the shielding component in a first direction is greater than a length of the SCHs in the first direction.

公开(公告)号：US11917755B2

公开(公告)日：2024-02-27

申请号：US16477653

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T428/12431

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A3) having peeling properties, and a second metal (B3) and third metal (C3) facilitating the plating of the first metal (A3).

公开(公告)号：US11877402B2

公开(公告)日：2024-01-16

申请号：US18086848

申请日：2022-12-22

Applicant: LUMET TECHNOLOGIES LTD.

Inventor： Benzion Landa ,  Naomi Elfassy ,  Stanislav Thygelbaum

IPC: H05K3/20 ,  H05K3/38 ,  B41M1/12 ,  H01L31/0224 ,  H05K3/34 ,  H05K1/03 ,  H05K1/09 ,  H01L31/0216 ,  H01L31/0392 ,  H01L31/20 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).

公开(公告)号：US20230337370A1

公开(公告)日：2023-10-19

申请号：US18337706

申请日：2023-06-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Mi BAE ,  Soon Gyu KWON ,  Sang Hwa KIM ,  Sang Young LEE ,  Jin Hak LEE ,  Han Su LEE ,  Dong Hun JEONG ,  In Ho JEONG ,  Dae Young CHOI ,  Jung Ho HWANG

IPC: H05K3/24 ,  H05K3/10 ,  C25D5/48 ,  H05K3/18 ,  H05K1/09 ,  C25D7/12 ,  H05K1/02 ,  C25D3/48 ,  C25D5/02 ,  H05K1/11 ,  C25D3/38

CPC classification number: H05K3/244 ,  H05K3/108 ,  C25D5/48 ,  H05K3/181 ,  H05K1/09 ,  C25D7/123 ,  H05K1/0296 ,  C25D3/48 ,  H05K3/188 ,  C25D5/022 ,  H05K1/11 ,  H05K2201/0989 ,  C25D3/38 ,  H05K2201/0338 ,  H05K2201/099 ,  H05K2201/098 ,  H05K2203/1184

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

公开(公告)号：US11744014B2

公开(公告)日：2023-08-29

申请号：US17523421

申请日：2021-11-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young Lim ,  Woong Sik Kim ,  Hyung Kyu Yoon

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/28 ,  H05K1/03 ,  H05K3/24

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/28 ,  H05K3/3452 ,  H05K1/111 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20230262891A1

公开(公告)日：2023-08-17

申请号：US18138901

申请日：2023-04-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong Min ,  Ho Hyung Ham ,  Yong Soon Jang ,  Ki Suk Kim ,  Hyung Ki Lee ,  Chi Won Hwang

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H05K2201/041 ,  H05K2201/0338 ,  G06F1/189

Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.

公开(公告)号：US11696401B2

公开(公告)日：2023-07-04

申请号：US17126306

申请日：2020-12-18

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Koji Nitta ,  Yasushi Mochida ,  Yoshio Oka ,  Shoichiro Sakai ,  Tadahiro Kaibuki ,  Junichi Okaue

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H05K3/24

CPC classification number: H05K1/118 ,  H05K1/0265 ,  H05K1/0298 ,  H05K3/241 ,  H05K3/361 ,  H05K2201/0338 ,  H05K2201/094 ,  H05K2201/09236 ,  H05K2201/09736 ,  H05K2203/0723

Abstract: A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

公开(公告)号：US20230189439A1

公开(公告)日：2023-06-15

申请号：US16477653

申请日：2018-01-15

Applicant: Iljin Materials Co., Ltd.

Inventor： Won Jin Beom ,  Sun Hyung Lee ,  Eun Sil Choi ,  Ki Deok Song ,  Hyung Cheol Kim

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K2201/0338 ,  H05K2201/0355

Abstract: The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A3) having peeling properties, and a second metal (B3) and third metal (C3) facilitating the plating of the first metal (A3).

公开(公告)号：US20190191544A1

公开(公告)日：2019-06-20

申请号：US16326275

申请日：2017-07-19

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Toshio SUZUKI ,  Masami KANAYAMA ,  Akiyoshi HATTORI ,  Masanori KITO

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H01L21/48 ,  H01L23/498 ,  H01L23/13 ,  H01L23/552 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H01L21/4857 ,  H01L23/12 ,  H01L23/13 ,  H01L23/367 ,  H01L23/49822 ,  H01L23/49866 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/09 ,  H05K1/181 ,  H05K3/18 ,  H05K3/24 ,  H05K3/4644 ,  H05K9/0075 ,  H05K2201/0338 ,  H01L2924/00014

Abstract: The present invention provides a wiring board having a conductor portion on which mounting is suitably possible and a method for manufacturing the wiring board. Since an initial Cu plated layer is formed by plating so as to cover the surface of a metallized layer and then the initial Cu plated layer is heated to be softened or melted, copper in the softened or melted initial Cu plated layer enters into open pore portions of the metallized layer. In addition, during the heating, components of the metallized layer and components of the initial Cu plated layer are mutually thermally diffused. Consequently, when solidified later (that is, when the initial Cu plated layer becomes a lower Cu plated layer), the adhesiveness between the metallized layer and the lower Cu plated layer is improved due to, for example, an anchoring effect and a mutual thermal diffusion effect, and therefore mountability is improved.

公开(公告)号：US20180366518A1

公开(公告)日：2018-12-20

申请号：US16111155

申请日：2018-08-23

Applicant: E Ink Holdings Inc.

Inventor： Kuan-Yi LIN ,  Yu-Wen CHEN ,  Yu-Chieh HUNG ,  Chun-Yu LU ,  Wen-Chung TANG ,  Po-Wei CHEN ,  Yu-Lin HSU

IPC: H01L27/28 ,  H01L51/05 ,  H01L51/10 ,  H01L27/12 ,  H01L51/00 ,  H01L51/52 ,  H05K1/00

CPC classification number: H01L27/283 ,  H01L27/124 ,  H01L51/0097 ,  H01L51/0533 ,  H01L51/0541 ,  H01L51/107 ,  H01L51/5253 ,  H05K1/00 ,  H05K1/036 ,  H05K1/113 ,  H05K1/189 ,  H05K3/423 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/10128 ,  Y02E10/549

Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.