公开(公告)号：US20120052695A1

公开(公告)日：2012-03-01

申请号：US12868370

申请日：2010-08-25

Applicant: MYOUNGSOO JEON ,  ATTALEE SNARR TAYLOR ,  JOHN JOSEPH CONSOLI

Inventor： MYOUNGSOO JEON ,  ATTALEE SNARR TAYLOR ,  JOHN JOSEPH CONSOLI

IPC: H01R12/14 ,  H05K1/11

CPC classification number: H05K3/308 ,  H01R12/585 ,  H05K1/116 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: An electrical connector assembly includes a circuit board and an electrical connector mounted on the circuit board. The circuit board has a circuit board body having first and second surfaces and through-holes bored between the first and second surfaces. The circuit board has signal traces on internal layers of the circuit board that are generally parallel to the first and second surfaces. Portions of the circuit board body within the through-holes are etched away to expose portions of the signal traces beyond the circuit board body within the corresponding through-hole. The electrical connector includes a housing and signal terminals held by the housing. The signal terminals are received in respective through-holes of the circuit board and engage the corresponding signal traces.

Abstract translation: 电连接器组件包括电路板和安装在电路板上的电连接器。 电路板具有电路板主体，其具有在第一表面和第二表面之间钻孔的第一表面和第二表面以及通孔。 电路板在电路板的内层上具有通常平行于第一和第二表面的信号迹线。 蚀刻掉通孔内的电路板主体的部分，以将信号迹线的部分暴露在对应的通孔内的电路板主体之外。 电连接器包括壳体和由壳体保持的信号端子。 信号端子被接收在电路板的相应通孔中并与相应的信号迹线接合。

公开(公告)号：US20120051688A1

公开(公告)日：2012-03-01

申请号：US12874011

申请日：2010-09-01

Applicant: Richard C.A. Pitwon

Inventor： Richard C.A. Pitwon

IPC: G02B6/12 ,  H01S3/091 ,  H01S3/0933 ,  H01S3/063

CPC classification number: H01S3/091 ,  G02B6/12004 ,  G02B6/1221 ,  H01S3/0637 ,  H01S3/0933 ,  H01S3/094049 ,  H01S3/0941 ,  H01S3/1603 ,  H01S3/1605 ,  H01S3/1606 ,  H01S3/168 ,  H01S3/178 ,  H01S3/2308 ,  H01S3/2383 ,  H01S5/4031 ,  H05K1/0274 ,  H05K1/142 ,  H05K2201/044

Abstract: The invention provides an amplification module for an optical printed circuit board, the optical printed circuit board comprising plural polymer waveguide sections from independent waveguides, each of the sections being doped with an amplifying dopant, wherein the plural waveguide sections are routed so as to pass through an amplification zone in which the plural polymer waveguide sections are arranged close or adjacent to one another, the amplification module comprising: a pump source comprising plural light sources arranged to provide independently controllable levels of pump radiation to each of the plural waveguide sections. In an embodiment, the amplification module also includes plural polymer waveguide sections corresponding to the plural polymer waveguides of the printed circuit board on which in use the amplification module is to be arranged, each of the sections being doped with an amplifying dopant.

Abstract translation: 本发明提供了一种用于光学印刷电路板的放大模块，该光学印刷电路板包括来自独立波导的多个聚合物波导部分，每个部分掺杂有放大掺杂剂，其中多个波导部分被路由以便通过 其中所述多个聚合物波导部分彼此靠近或相邻地布置的放大区域，所述放大模块包括：泵浦源，包括多个光源，所述泵浦源布置成向所述多个波导段中的每一个提供独立可控的泵浦辐射水平。 在一个实施例中，放大模块还包括对应于印刷电路板的多个聚合物波导的多个聚合物波导部分，在其上使用放大模块来布置每个部分，每个部分掺杂有放大掺杂剂。

公开(公告)号：US08050043B2

公开(公告)日：2011-11-01

申请号：US11560763

申请日：2006-11-16

Applicant: Hyun-Jin Choi ,  Young-Chan Cho

Inventor： Hyun-Jin Choi ,  Young-Chan Cho

IPC: H05K7/00

CPC classification number: H05K7/1459 ,  G06F13/409 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0296 ,  H05K2201/044 ,  H05K2201/09236

Abstract: Disclosed herein is a printed circuit board facilitating expansion of number of memory modules and memory system including the same. The printed circuit board of the present invention includes a plurality of slots and a plurality of controller terminals. Each of slots disposed in locations ranging from a 2n−1+1th location to a 2nth location with respect to the controller terminals includes 2k−n module terminals connected to the module terminals of slots ranging from the slot disposed in the first location to a slot disposed in a 2n−1th location; wherein, in the printed circuit board and memory system including the printed circuit board according to the present invention, dummy modules are not required to expand the number of memory modules. Further, according to the printed circuit board of the present invention, the expansion of the number of memory modules is facilitated.

Abstract translation: 这里公开了一种便于扩展存储器模块数量和包括其的存储器系统的印刷电路板。 本发明的印刷电路板包括多个槽和多个控制器端子。 设置在相对于控制器端子的从2n-1 + 1位置到第2n位置的位置中的每个槽包括连接到从设置在第一位置的槽到槽的槽的模块端子的2k-n模块端子 放置在第2n位; 其中，在包括根据本发明的印刷电路板的印刷电路板和存储器系统中，不需要虚拟模块来扩展存储器模块的数量。 此外，根据本发明的印刷电路板，容易扩大存储器模块的数量。

公开(公告)号：US08009438B2

公开(公告)日：2011-08-30

申请号：US11729470

申请日：2007-03-29

Applicant: Kevin B. Leigh ,  Jonathan E. James Ou ,  David W. Sherrod ,  Kurt A. Manweiler ,  Miles B. Reyes ,  Gregory L. Gibson ,  Stephen A. Kay ,  Vincent W. Michna

Inventor： Kevin B. Leigh ,  Jonathan E. James Ou ,  David W. Sherrod ,  Kurt A. Manweiler ,  Miles B. Reyes ,  Gregory L. Gibson ,  Stephen A. Kay ,  Vincent W. Michna

IPC: H05K1/11

CPC classification number: H05K1/144 ,  H05K7/1457 ,  H05K2201/044 ,  H05K2201/09309 ,  H05K2201/10303 ,  H05K2203/167

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract translation: 本技术的实施例涉及背板基础设施。 背板基础设施可以包括配置成分配功率并且包括第一组对准孔的无源功率背板，被配置为布线接口信号并包括第二组对准孔和一组公共对准引脚的信号背板，每个对准引脚具有 轴，其中所述一组公共对准销插入到第一组对准孔和第二组对准孔中，以使无源功率背板和信号背板绕轴线对准。

公开(公告)号：US20110124231A1

公开(公告)日：2011-05-26

申请号：US12625315

申请日：2009-11-24

Applicant: RICHARD ELOF HAMNER ,  SCOTT STEPHEN DUESTERHOEFT ,  ROBERT NEIL MULFINGER ,  JASON M'CHEYNE REISINGER ,  ATTALEE SNARR TAYLOR

Inventor： RICHARD ELOF HAMNER ,  SCOTT STEPHEN DUESTERHOEFT ,  ROBERT NEIL MULFINGER ,  JASON M'CHEYNE REISINGER ,  ATTALEE SNARR TAYLOR

IPC: H01R24/00

CPC classification number: H05K1/141 ,  H01R12/724 ,  H05K2201/044 ,  H05K2201/10189

Abstract: An electrical connector assembly includes a connector having a connector housing and contacts held by the connector housing, where the contacts defining a separable mating interface for mating with a mating component. An actuator engages the contacts and is movable between an actuated position and an unactuated position. The contacts are deflected relative to the connector housing when the actuator is moved to the actuated position. An actuation device is configured to move the actuator between the actuated position and the unactuated position.

Abstract translation: 电连接器组件包括具有连接器壳体和由连接器壳体保持的触头的连接器，其中触点限定用于与配合部件配合的可分离配合接口。 致动器接合触头并且可在致动位置和未致动位置之间移动。 当致动器移动到致动位置时，触头相对于连接器壳体偏转。 致动装置构造成在致动位置和未致动位置之间移动致动器。

公开(公告)号：US20110119425A1

公开(公告)日：2011-05-19

申请号：US12675105

申请日：2008-06-30

Applicant: Ravindranath Kollipara ,  Xingchao Yuan ,  Frank Lambrecht ,  Ming Li ,  Richard E. Perego ,  Qi Lin ,  David Nguyen ,  Kyung Suk Oh

Inventor： Ravindranath Kollipara ,  Xingchao Yuan ,  Frank Lambrecht ,  Ming Li ,  Richard E. Perego ,  Qi Lin ,  David Nguyen ,  Kyung Suk Oh

IPC: G06F13/40 ,  G06F13/20

CPC classification number: G06F13/1668 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0237 ,  H05K1/0295 ,  H05K1/14 ,  H05K1/141 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10356

Abstract: The disclosure relates to a detachable signalling interconnect apparatus that provides connectivity between two or more components of a memory system in conjunction with different modes of operation of the components. The memory system comprises: a first socket to receive a first memory module; a second socket to receive a second memory module; a detachable signal-interconnect; and a memory controller coupled to the detachable signal-interconnect and configured to define a first mode of operation and a second mode of operation, wherein in the first mode of operation the detachable signal-interconnect is to couple the memory-controller to the first memory module and in the second mode of operation the detachable signal-interconnect is to couple the memory controller to the first memory module and the second memory module.

Abstract translation: 本公开涉及一种可拆卸信令互连装置，其提供存储器系统的两个或更多个组件与组件的不同操作模式之间的连接。 存储器系统包括：第一插座，用于接收第一存储器模块; 用于接收第二存储器模块的第二插座; 可拆卸的信号互连; 以及存储器控制器，其耦合到所述可拆卸信号互连并且被配置为限定第一操作模式和第二操作模式，其中在所述第一操作模式中，所述可拆卸信号互连将所述存储器控制器耦合到所述第一存储器 模块，并且在第二操作模式中，可拆卸信号互连将存储器控制器耦合到第一存储器模块和第二存储器模块。

公开(公告)号：US07927149B2

公开(公告)日：2011-04-19

申请号：US12646817

申请日：2009-12-23

Applicant: Timothy A. Lemke

Inventor： Timothy A. Lemke

IPC: H01R24/00

CPC classification number: H05K1/14 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/116 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0187 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: An apparatus electrically interconnects pins that project from the rear side of a backplane in separate arrays corresponding to respective circuit boards at the front side of the backplane. The apparatus comprises a connector board assembly extending across the rear side of the backplane between separate arrays of pins. The connector board assembly has signal routing circuitry that electrically interconnects those separate arrays of pins. This enables the respective printed circuit boards to be electrically interconnected independently of any signal routing circuitry within the structure of the backplane. Accordingly, the apparatus preferably includes a backplane that is free of signal routing circuitry for interconnecting pins that extend through the backplane.

Abstract translation: 一种装置将相应于背板前侧各个电路板的独立阵列从背板的后侧突出的引线互连。 该装置包括连接器板组件，该连接器板组件在分开的销阵列之间跨越背板的后侧延伸。 连接器板组件具有将这些单独的引脚阵列电互连的信号路由电路。 这使得各个印刷电路板能够独立于底板结构内的任何信号路由电路而电互连。 因此，该装置优选地包括一个背板，该背板没有用于互连延伸穿过背板的引脚的信号路由电路。

公开(公告)号：US07813208B2

公开(公告)日：2010-10-12

申请号：US11965753

申请日：2007-12-28

Applicant: Shou-Kuo Hsu ,  Duen-Yi Ho ,  Cheng-Shien Li

Inventor： Shou-Kuo Hsu ,  Duen-Yi Ho ,  Cheng-Shien Li

IPC: G11C5/14

CPC classification number: G06F13/4072 ,  G06F13/4239 ,  H05K1/0262 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159

Abstract: An exemplary motherboard includes a driving module, at least two first slots arranged for mounting two first type of memories, at least two second slots arranged for mounting two second type of memories, and a voltage regulator. The driving module is electronically connected to the at least two first slots, the at least two second slots, and the voltage regulator in turn via a channel. The first type of memories and the second type of memories are alternatively mounted on the motherboard, the voltage regulator detects which type memory is currently mounted on the motherboard and outputs voltages suitable for the type of memory mounted on the motherboard accordingly.

Abstract translation: 示例性主板包括驱动模块，布置成用于安装两个第一类型存储器的至少两个第一槽，布置成安装两个第二类型存储器的至少两个第二槽和电压调节器。 驱动模块通过通道电连接到至少两个第一插槽，至少两个第二插槽和电压调节器。 第一类型的存储器和第二类型的存储器交替地安装在母板上，电压调节器检测当前安装在母板上的哪种类型的存储器，并相应地输出适合于安装在母板上的存储器类型的电压。

公开(公告)号：US07794233B1

公开(公告)日：2010-09-14

申请号：US12481210

申请日：2009-06-09

Applicant: Steven J. Millard ,  Jason M'Cheyne Reisinger ,  Richard Elof Hamner

Inventor： Steven J. Millard ,  Jason M'Cheyne Reisinger ,  Richard Elof Hamner

IPC: H01R9/09

CPC classification number: G06F1/185 ,  H01R12/62 ,  H01R12/79 ,  H01R12/82 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/044 ,  H05K2201/10189

Abstract: An electrical connector assembly couples a circuit board with at least one of a motherboard and a backplane board. The connector assembly includes a connector and a flexible circuit member. The connector has a mating interface and a mounting interface. The mating interface electrically couples the connector with the circuit board. The mounting interface secures the connector to the motherboard. The flexible circuit member electrically interconnects the mating and mounting interfaces with one another and with at least one of the motherboard and the backplane board. The flexible circuit member electrically interconnects the circuit board with the backplane board via a conductive pathway that bypasses the motherboard.

Abstract translation: 电连接器组件将电路板与主板和背板中的至少一个耦合。 连接器组件包括连接器和柔性电路部件。 连接器具有配合接口和安装接口。 配合接口将连接器与电路板电耦合。 安装接口将连接器固定在主板上。 柔性电路构件将配合和安装接口彼此电连接并且与主板和底板中的至少一个电互连。 柔性电路部件经由绕过主板的导电路径将电路板与背板电互连。

公开(公告)号：US20100214755A1

公开(公告)日：2010-08-26

申请号：US12293777

申请日：2007-03-21

Applicant: Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

Inventor： Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

IPC: H05K1/14 ,  H05K1/00

CPC classification number: H05K7/1439 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10409

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract translation: 为具有带有多个接触条的基底板的电子安装架提供背板装置，其中可在其上插入有至少一个附加背板的自由空间设置在基底板上。