公开(公告)号：US20130285263A1

公开(公告)日：2013-10-31

申请号：US13632145

申请日：2012-09-30

Applicant: APPLE INC.

Inventor： Shawn X. ARNOLD ,  Terry L. GILTON ,  Matthew LAST

IPC: H01L23/498 ,  H01L21/308

CPC classification number: H05K1/183 ,  G06F1/16 ,  G06F3/041 ,  G06K9/00053 ,  H01L23/24 ,  H01L24/11 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L29/0657 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48479 ,  H01L2224/85 ,  H01L2224/85051 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10253 ,  H05K1/111 ,  H05K2201/09036 ,  H05K2201/10151 ,  H01L2924/20752 ,  H01L2224/48471 ,  H01L2224/4554

Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.

公开(公告)号：US08549743B2

公开(公告)日：2013-10-08

申请号：US12733487

申请日：2008-07-08

Applicant: Ricardo Ehrenpfordt ,  Johanna May

Inventor： Ricardo Ehrenpfordt ,  Johanna May

IPC: H05K3/02

CPC classification number: H05K3/041 ,  H05K1/0272 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108

Abstract: In a method for hot embossing at least one conductor track onto a substrate, a film having at least one electrically conductive layer is pressed against the substrate in a die direction using an embossing die having a structured die surface. The film remains on the substrate after ending the embossing process in at least two structure planes, which are spaced apart in the die direction.

Abstract translation: 在用于将至少一个导体轨迹热压到衬底上的方法中，具有至少一个导电层的膜使用具有结构化模具表面的压花模具在模具方向上压靠衬底。 在沿着模具方向间隔开的至少两个结构平面中结束压花处理之后，膜保留在基板上。

公开(公告)号：US20130261262A1

公开(公告)日：2013-10-03

申请号：US13648805

申请日：2012-10-10

Applicant: X-CARD HOLDINGS, LLC

Inventor： Mark A. Cox

IPC: C08L33/14

CPC classification number: C08L33/14 ,  B32B3/08 ,  B32B3/26 ,  B32B27/08 ,  B32B27/20 ,  B32B37/06 ,  B32B37/08 ,  B32B37/10 ,  B32B2250/40 ,  B32B2264/02 ,  B32B2307/748 ,  B32B2307/75 ,  B32B2425/00 ,  B32B2457/00 ,  B32B2457/08 ,  C08L27/06 ,  C08L75/04 ,  C08L75/06 ,  C08L75/14 ,  C08L75/16 ,  C08L2203/206 ,  G06K19/07722 ,  G06K19/07745 ,  H01L2924/0002 ,  H05K1/0313 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/10037 ,  Y10T29/49126 ,  Y10T428/24612 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31598 ,  Y10T428/31605 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31692 ,  Y10T428/31699 ,  H01L2924/00

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

公开(公告)号：US08514581B2

公开(公告)日：2013-08-20

申请号：US12857463

申请日：2010-08-16

Applicant: Kenji Hasegawa

Inventor： Kenji Hasegawa

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H05K3/0064 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: According to one embodiment, a flexible printed wiring board includes a component mounting portion to which a component is mounted and to which a reinforcing sheet is bonded. The component mounting portion includes an inner layer comprising a wiring pattern, and an outermost film layer disposed to cover the wiring pattern. The outermost film layer, to which the reinforcing sheet is bonded, is formed with a groove such that, when the reinforcing sheet is bonded, the groove extends in a region between the outermost film layer and the reinforcing sheet and communicates with an outside of the region.

Abstract translation: 根据一个实施例，柔性印刷线路板包括部件安装部分，部件安装到该部件安装部分上，并且加强板被粘合到该部件安装部分。 部件安装部分包括包括布线图案的内层和设置成覆盖布线图案的最外面的薄膜层。 形成加强片的最外层膜形成有槽，使得当加强板粘合时，槽在最外膜层和加强板之间的区域中延伸，并与 地区。

公开(公告)号：US20130182400A1

公开(公告)日：2013-07-18

申请号：US13670746

申请日：2012-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungwon HONG

IPC: H05K7/02 ,  H05K3/00

CPC classification number: H05K3/368 ,  H05K1/144 ,  H05K3/403 ,  H05K2201/041 ,  H05K2201/09036 ,  H05K2201/09645 ,  H05K2201/10189 ,  H05K2201/1059 ,  Y10T29/49124

Abstract: A circuit board having a board-to-board connector and a method of manufacturing the same are provided. The circuit board includes at least one of a recess and a hole having a connection portion exposed to be electrically connected to a connection portion of a connector header of another circuit board, a terminal on the circuit board, and a conduction line for connecting the terminal and the connection portion. Thereby, a cost and required space for a board-to-board connection can be reduced.

Abstract translation: 提供一种具有板对板连接器的电路板及其制造方法。 电路板包括凹部和孔中的至少一个，其具有暴露于电连接到另一电路板的连接器插头的连接部分的连接部分，电路板上的端子和用于连接端子的导线 和连接部。 因此，可以降低板对板连接的成本和所需的空间。

公开(公告)号：US20130181238A1

公开(公告)日：2013-07-18

申请号：US13751563

申请日：2013-01-28

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/60

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US20130069180A1

公开(公告)日：2013-03-21

申请号：US13700940

申请日：2011-05-18

Applicant: Shuji Umeda ,  Ryusuke Horibe ,  Fuminori Tanaka ,  Takeshi Inoda

Inventor： Shuji Umeda ,  Ryusuke Horibe ,  Fuminori Tanaka ,  Takeshi Inoda

IPC: H01L29/84 ,  H01L21/50

CPC classification number: H01L29/84 ,  H01L21/50 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H05K1/181 ,  H05K1/182 ,  H05K3/427 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10083 ,  Y02P70/611

Abstract: The disclosed substrate (12) has an electro-acoustic conversion element (11), which converts sound signals into electric signals, mounted thereon. Furthermore, the substrate is provided with: a mounting surface (12a) in which an opening (121) covered by the electro-acoustic conversion element (11) is formed; an intra-substrate space (122) connected to the opening (121); and a coating layer (CL) that covers at least part of the wall surface (122a) of the intra-substrate space (122).

Abstract translation: 所公开的基板（12）具有电声转换元件（11），其将声音信号转换成电信号，安装在其上。 此外，基板设置有：形成有由电声转换元件（11）覆盖的开口（121）的安装面（12a） 连接到所述开口（121）的衬底内空间（122）; 以及覆盖所述基板内空间（122）的壁表面（122a）的至少一部分的涂层（CL）。

公开(公告)号：US08400580B2

公开(公告)日：2013-03-19

申请号：US12591899

申请日：2009-12-03

Applicant: Jae Sung Park

Inventor： Jae Sung Park

IPC: G02F1/1335

CPC classification number: H05K1/189 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0083 ,  G02F1/133615 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09045

Abstract: A backlight unit capable of preventing a light leakage phenomenon caused by using a light guide plate of wedge type is disclosed. The backlight unit includes: at least one light source; a light guide plate configured to include a first portion with a first thickness disposed adjacent to the at least one light source, a second portion of plate shape having a second thickness thinner than the first thickness, and a wedge portion formed to connect the first and second portions and become gradually thinner from the first portion to the second portion; and a flexible printed circuit board loaded with the at least one light source and extended to cover the wedge portion of the light guide plate. The flexible printed circuit board is provided with a groove formed opposite a boundary area between the first portion and the wedge portion.

Abstract translation: 公开了能够防止使用楔形导光板引起的漏光现象的背光单元。 背光单元包括：至少一个光源; 导光板，其构造成包括具有邻近所述至少一个光源设置的第一厚度的第一部分，具有比所述第一厚度更薄的第二厚度的板形状的第二部分，以及楔形部分，其形成为将所述第一和 第二部分并且从第一部分逐渐变薄到第二部分; 以及装载有所述至少一个光源并延伸以覆盖所述导光板的所述楔形部分的柔性印刷电路板。 柔性印刷电路板设置有与第一部分和楔形部分之间的边界区域相对的槽。

公开(公告)号：US08384121B2

公开(公告)日：2013-02-26

申请号：US13171973

申请日：2011-06-29

Applicant: Michael Tischler ,  Philippe Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael Tischler ,  Philippe Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/00 ,  H01L21/00

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

公开(公告)号：US08378227B2

公开(公告)日：2013-02-19

申请号：US12585754

申请日：2009-09-24

Applicant: Seiichi Inoue

Inventor： Seiichi Inoue

IPC: H05K1/11

CPC classification number: H05K3/246 ,  H05K1/0256 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1147 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.

Abstract translation: 形成布线板的方法包括：在基板上形成具有多孔结构的接收层的步骤; 基于导电图案的图像日期，通过喷射通过喷墨系统进行拉伸的胶体金属溶液，在接收层的表面上形成所需导电图案中的布线部分的步骤; 以及对相互相邻的布线部之间露出的接受层的至少一部分进行防迁移处理的步骤。