公开(公告)号：US20150351256A1

公开(公告)日：2015-12-03

申请号：US14745526

申请日：2015-06-22

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K3/36 ,  H01R43/26

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

公开(公告)号：US09184521B2

公开(公告)日：2015-11-10

申请号：US14017318

申请日：2013-09-04

Applicant: HTC Corporation

Inventor： I-Cheng Chuang ,  Yu-Jing Liao ,  Ying-Yen Cheng ,  Chih-Wei Tu

IPC: H01R13/516 ,  H01R12/77 ,  H01R12/72 ,  G06F1/16 ,  H01R4/28 ,  H01R4/48 ,  H01R12/59 ,  H01R12/62 ,  H01R43/00 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01R12/778 ,  G06F1/16 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1658 ,  H01R4/28 ,  H01R4/4809 ,  H01R12/592 ,  H01R12/62 ,  H01R12/722 ,  H01R13/516 ,  H01R43/002 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10265

Abstract: A connector assembly adapted to be disposed in a casing of an electronic device is provided. The connector assembly includes a connector and a locking member. The locking member includes a supporting portion and a holding portion connected to the supporting portion. The connector is disposed on the supporting portion. The locking member is adapted to clamp at an end of a substrate disposed in the casing, and the supporting portion and the holding portion lean against an upper side and a lower side of the end of the substrate respectively. An electronic device including the connector assembly aforementioned is also provided.

Abstract translation: 提供一种适于设置在电子设备的壳体中的连接器组件。 连接器组件包括连接器和锁定构件。 锁定构件包括支撑部分和连接到支撑部分的保持部分。 连接器设置在支撑部分上。 锁定构件适于夹持在设置在壳体中的基板的端部，并且支撑部分和保持部分分别靠在基板的端部的上侧和下侧。 还提供了包括上述连接器组件的电子设备。

公开(公告)号：US08665057B2

公开(公告)日：2014-03-04

申请号：US12899941

申请日：2010-10-07

Applicant: Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

Inventor： Roberto Schlenker ,  Michael Nagel ,  Juergen Martin

IPC: H01H85/36 ,  H01H37/76

CPC classification number: H01H37/761 ,  H05K1/0201 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/341 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/10265

Abstract: An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

Abstract translation: 电子电路包括电路板上的导体路径和安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载或应力弹性接触桥建立电路连接，提供保险丝保护。 在功耗过高或温度过高的情况下，焊接接头熔化或软化，接触桥弹簧打开以中断电路。

公开(公告)号：US08619420B2

公开(公告)日：2013-12-31

申请号：US13223224

申请日：2011-08-31

Applicant: Brett W. Degner ,  Gregory Tice

Inventor： Brett W. Degner ,  Gregory Tice

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

公开(公告)号：US20130072073A1

公开(公告)日：2013-03-21

申请号：US13588585

申请日：2012-08-17

Applicant: Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC: H01R13/02

CPC classification number: H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.

Abstract translation: 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有第一和第二部分的螺旋形接触件彼此具有小的图像关系。

公开(公告)号：US08241057B2

公开(公告)日：2012-08-14

申请号：US13002473

申请日：2009-05-04

Applicant: Jun-Ho Lee

Inventor： Jun-Ho Lee

IPC: H01R12/24

CPC classification number: H01R12/79 ,  H01R12/613 ,  H01R12/62 ,  H01R12/85 ,  H01R12/88 ,  H05K3/365 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10393 ,  Y10T29/49124

Abstract: The present invention relates to an FPC connector for electrically connecting an FPC to contact portion of a wirings printed on a PCB, and to an FPC connection method using the same, wherein an FPC (10) is inserted into a housing (110) so that the contact portion of the FPC (10) may come in direct contact with a contact portion (2a) of the PCB, and an pressing member pressing the FPC (10) on the PCB so as to directly contact the FPC (10) to the PCB (1).

Abstract translation: 本发明涉及一种用于将FPC电连接到印刷在PCB上的布线的接触部分的FPC连接器以及使用其的FPC连接方法，其中FPC（10）插入到壳体（110）中，使得 FPC（10）的接触部分可以与PCB的接触部分（2a）直接接触，并且将印刷电路板上的FPC（10）按压到与FPC（10）直接接触的按压部件 PCB（1）。

公开(公告)号：US08227706B2

公开(公告)日：2012-07-24

申请号：US12347600

申请日：2008-12-31

Applicant: Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

Inventor： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC: H05K1/11

CPC classification number: H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开并要求保护其他实施例。

公开(公告)号：US08138924B2

公开(公告)日：2012-03-20

申请号：US11792906

申请日：2005-03-09

Applicant: Jay C. Sinnett ,  Cameron E. Smith ,  John David Adamson

Inventor： Jay C. Sinnett ,  Cameron E. Smith ,  John David Adamson

IPC: G08B13/14 ,  H01Q1/50

CPC classification number: B60C23/0493 ,  B60C23/0452 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  Y02P70/613

Abstract: A strain-resistant electrical connection and a method of making the same is provided. An antenna (36, 38) or other conductive lead is connected to a circuit (32) in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the antenna (36, 38) or conductive lead relative to the circuit (32). The antenna (36, 38) or conductive lead is at least partially coiled to provide additional ability to withstand mechanical stresses. The antenna (36, 38) or conductive lead may be encase along with is connected circuit in an elastomeric material.

Abstract translation: 提供耐应变电气连接及其制造方法。 天线（36,38）或其他导电引线以使得连接更能抵抗诸如天线（36,38）或导电引线相对于所述天线（36,38）或其他导电引线的机械应力例如天线（36,38）或导电引线的移动或旋转的方式连接到电路 电路（32）。 天线（36,38）或导电引线至少部分盘绕，以提供额外的承受机械应力的能力。 天线（36,38）或导电引线可以与壳体一起被连接在弹性体材料中。

公开(公告)号：US20110214914A1

公开(公告)日：2011-09-08

申请号：US13111822

申请日：2011-05-19

Applicant: Harold B. Kent ,  Steven T. Kent

Inventor： Harold B. Kent ,  Steven T. Kent

IPC: H05K1/16 ,  F03B11/02 ,  H01R43/00 ,  H01R4/00

CPC classification number: H05K7/06 ,  A61M25/0021 ,  A61M25/0023 ,  A61M25/0043 ,  A61M25/0045 ,  A61M25/005 ,  A61M2025/0037 ,  A61M2025/004 ,  B01L3/5027 ,  B81B2201/058 ,  B81C3/008 ,  H05K1/0272 ,  H05K1/182 ,  H05K1/183 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/10265 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T137/0318 ,  Y10T137/8593

Abstract: A method and system for transporting a fluid, gas, semi-solid, cryogen, or particulate matter, or combination thereof, between a three-dimensional structure and a substantially two-dimensional structure is disclosed. A system and method for electrically coupling a three-dimensional structure to a substantially two dimensional structure is also disclosed.

Abstract translation: 公开了一种用于在三维结构和基本上二维结构之间输送流体，气体，半固体，低温或颗粒物质或其组合的方法和系统。 还公开了一种将三维结构电耦合到基本二维结构的系统和方法。

公开(公告)号：US20110127071A1

公开(公告)日：2011-06-02

申请号：US12692422

申请日：2010-01-22

Applicant: Jun Sup SHIN ,  Bum Cho Kim

Inventor： Jun Sup SHIN ,  Bum Cho Kim

IPC: H05K1/02

CPC classification number: H05K1/118 ,  G11B33/122 ,  H02K3/521 ,  H02K5/225 ,  H02K2211/03 ,  H05K3/3447 ,  H05K2201/09081 ,  H05K2201/10265 ,  H05K2201/2009

Abstract: Disclosed herein is a flexible printed circuit board (PCB) of a spindle motor. The flexible PCB includes a solder part, an upper reinforcing plate, a lower reinforcing plate, and a soldering part. The solder part has a through hole so that a coil extending from a stator core passes through the solder part, and has a separation part which is open or closed only in one direction along with the through hole. The upper reinforcing plate supports the upper portion of the separation part. The lower reinforcing plate supports the lower portion of the solder part, and has an elliptical through hole which partially overlaps with the through hole so that the coil passes through the lower reinforcing plate. The soldering part is formed to enable the coil to be secured to the solder part.

Abstract translation: 这里公开了一种主轴电动机的柔性印刷电路板（PCB）。 柔性PCB包括焊接部，上加强板，下加强板和焊接部。 焊接部具有通孔，使得从定子芯延伸的线圈通过焊料部，并且具有与通孔一起在一个方向上打开或闭合的分离部。 上加强板支撑分离部分的上部。 下加强板支撑焊料部分的下部，并且具有与通孔部分重叠的椭圆形通孔，使得线圈通过下加强板。 焊接部件形成为使得线圈能够固定到焊接部件。