Abstract:
A circuit board damping assembly provides a damping node for a circuit board coupled in spaced relationship to another circuit board or chassis. The circuit board damping assembly includes a chassis or circuit board forming a base member; a circuit board coupled in spaced relationship to the base member; a first attachment member coupled to the base member; a second attachment member coupled to the circuit board; and a connector coupled between the first and second attachment members. The connector may be a wire coupled to the first and second attachment members.
Abstract:
The invention relates to an electronic device for a motor vehicle, for example a car radio, an onboard computer or a vehicle navigation device. According to the invention, a printed circuit board (5) is connected to a housing (1) of the device by predetermined breaking points (17). Actuating elements (8, 9) with operating parts (10, 11) are located on said printed circuit board, these operating parts protruding out from a front panel (2) of the housing (1). In the event that the operating parts (10, 11) are subjected to excessive forces, the predetermined breaking points (17) enable the printed circuit board (5) to detach from the housing (1) and move further into said housing (1), whereby the operating parts (10, 11) move into the housing (1) accordingly.
Abstract:
The connection member has a conductor portion (13) and a dummy pattern portion (15) both formed of a metallic conductor and arranged on a base (11). The conductor portion (13) and the dummy pattern portion (15) are formed by etching. The dummy pattern portion (15) has a positioning portion (21) formed by etching away the metallic conductor. The base (11) has a positioning hole (21) formed by applying laser light having a wavelength of 1500 nm or more to the positioning portion.
Abstract:
There is described a multi-layer printed circuit board and a method of installing it. The circuit board includes a first signal layer formed on its obverse surface; a ground layer arranged at a position next to the first signal layer; an electronic power source layer arranged at a position next to the ground layer; and a second signal layer formed on its reverse surface. The first and second patterns are formed around peripheral areas of the first and second signal layers, respectively. The first ground pattern and the second ground pattern are electrically coupled to each other by plural through holes, and the multi-layer printed circuit board is installed on an electro-conductive housing in such a manner that a substantially whole area of the second ground pattern electrically contacts a mounting area of the electro-conductive housing, the mounting area being an electro-conductive area continuously coupled to the electro-conductive housing.
Abstract:
An illumination assembly including a thermally conductive substrate, a patterned conductive layer proximate a major surface of the thermally conductive substrate, a dielectric layer positioned between the patterned conductive layer and the major surface of the substrate, and at least one LED including a post that is attached to the thermally conductive substrate such that at least a portion of the post is embedded in the thermally conductive substrate is disclosed. The at least one LED can be thermally connected to the thermally conductive substrate through the post and electrically connected to the patterned conductive layer. The dielectric layer can be reflective.
Abstract:
Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening. The threaded device can be configured to engage a securing device for adjustably securing the at least one extended portion to the circuit board
Abstract:
A through hole 2 is formed in an end portion of a wiring board main body 1. A land 3 formed around the through hole 2 is in a shape having partially lacking portions symmetrically formed on an end portion side of the wiring board main body 1 and on an opposite side of the end portion side. A component 5 is fixed to the land 3 by solder 4.
Abstract:
A mounting element includes a main body made of metal and having opposite first and second ends, and a soldering portion disposed adjacent to the first end and adapted to be soldered onto a substrate. The second end is adapted for supporting a device thereon. The soldering portion has a roughened outer surface.
Abstract:
The invention concerns an assembly of at least one electrical or electronic power supply component on a printed circuit board (10) characterized in that said or at least one electrical or electronic power supply component (30) is directly mounted in close thermal contact on a thermally conductive conduction board (20) itself mounted in an opening (13) comprised in said printed circuit board (10), the lugs (32) of said or at least one electrical or electronic power supply component (30) being connected directly on the printed circuit (10).
Abstract:
A coupling and grounding structure of a plasma display device for grounding a circuit board effectively, and fixing the circuit board stably. The plasma display device includes a plasma display panel having a display area, on which images are displayed; a chassis base coupled to a back surface of the plasma display panel; at least one circuit board, on which at least one electronic element for driving the plasma display panel is mounted, the circuit board having a conductive portion and at least one coupling hole to be coupled to the chassis base by a bolt member penetrating the coupling hole; and at least a conductive member which contacts the conductive portion and the bolt member in the coupling hole.