公开(公告)号：US20190246492A1

公开(公告)日：2019-08-08

申请号：US16358769

申请日：2019-03-20

Applicant: Avago Technologies International Sales Pte.Limited

Inventor： Deog-Soon Choi ,  Chang-Yul Cheon ,  Sang-Hwa Jung ,  Sung-Phyo Lim ,  Ah Ron Lee

IPC: H05K1/02 ,  H01F27/36

CPC classification number: H05K1/0216 ,  H01F27/362 ,  H05K1/023 ,  H05K2201/09972 ,  H05K2201/10287 ,  H05K2201/1056

Abstract: A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.

公开(公告)号：US20180098418A1

公开(公告)日：2018-04-05

申请号：US15796592

申请日：2017-10-27

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd

Inventor： Ah Ron Lee ,  Deog Soon Choi ,  Young Ho Lee ,  Boon Keat Tan ,  Jin Ho Choi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/023 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/09972 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/1056

Abstract: A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package and a substantially horizontal conductive structure that is coupled to the conductive fence. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.

公开(公告)号：US09814166B2

公开(公告)日：2017-11-07

申请号：US13955149

申请日：2013-07-31

Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI) CO., LTD.

Inventor： Jen-Chun Chen ,  Tsung-Jung Cheng ,  Chia-Cheng Liu

IPC: H01L21/56 ,  H05K9/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L27/146 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K9/0024 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/02 ,  H01L27/14618 ,  H01L2924/0002 ,  H05K1/0224 ,  H05K3/288 ,  H05K2201/0707 ,  H05K2201/1056 ,  H05K2203/0191 ,  H05K2203/107 ,  H05K2203/1105 ,  H01L2924/00

Abstract: A method of manufacturing electronic package module is provided. The method provides selective molding by attaching tapes on the circuit substrate on which electric components are mounted thereon, forming molding compound to cover the circuit substrate, and removing tapes along with the molding compound thereon.

公开(公告)号：US20170290187A1

公开(公告)日：2017-10-05

申请号：US15507364

申请日：2015-09-17

Applicant: DENSO CORPORATION

Inventor： Takashi YOSHIMIZU ,  Yuuki SANADA

IPC: H05K7/14 ,  H01L23/31 ,  H01L23/053 ,  H05K1/18 ,  H05K1/02 ,  H01G2/06 ,  H01G2/10 ,  H05K1/11 ,  H01L23/367 ,  H01G2/08 ,  H01L23/498 ,  H01L23/10

CPC classification number: H05K7/1427 ,  H01G2/065 ,  H01G2/08 ,  H01G2/103 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09609 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2201/1059 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.

公开(公告)号：US09609740B2

公开(公告)日：2017-03-28

申请号：US14897615

申请日：2014-06-10

Applicant: THALES

Inventor： Sebastien Bonnet ,  Serge Verdeyme ,  Michel Campovecchio ,  Alain Dravet ,  Marc-Yves Lienhart

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0203 ,  H05K1/0204 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/183 ,  H05K3/0011 ,  H05K3/40 ,  H05K3/4623 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2201/1056

Abstract: The printed circuit with a multi-layer structure comprises: a first layer machined to form a spotface passing through the layer, a second layer comprising a first cavity passing through the layer, a third layer comprising, on one face, an electronic component that is in the first cavity, a fourth layer comprising a second cavity, a heat-conducting element with two parts: one made of metal, called a thermal cover, inserted into the spotface of the first layer so as to close, mechanically and electrically, the first cavity, the other made of a dielectric material with heat conduction >30 W/(m·K), placed in the first cavity so as to be in contact with the electronic component.

公开(公告)号：US20170062373A1

公开(公告)日：2017-03-02

申请号：US15351992

申请日：2016-11-15

Applicant: FUJITSU LIMITED

Inventor： Kozo Shimizu ,  Seiki Sakuyama

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160247776A1

公开(公告)日：2016-08-25

申请号：US15142690

申请日：2016-04-29

Applicant: FUJITSU LIMITED

Inventor： KOZO SHIMIZU ,  Seiki Sakuyama

IPC: H01L23/00

CPC classification number: H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

Abstract: An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160120039A1

公开(公告)日：2016-04-28

申请号：US14920513

申请日：2015-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-Je BANG ,  Mi-Jin Kim ,  Sae-Bom Lee ,  Hyun-Joo Han ,  Kun-Tak Kim

IPC: H05K3/32 ,  H05K3/34

CPC classification number: H05K3/321 ,  H01L21/563 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29194 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2924/1421 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/023 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/1056 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract translation: 提供了制造印刷电路板组件的方法。 一种方法包括在安装在印刷电路板上的加热部件上施加液化辐射热材料; 将屏蔽单元安装在与液化辐射热材料接触的印刷电路板上; 同时固化液化的辐射热材料并粘合屏蔽单元。

公开(公告)号：US09265144B2

公开(公告)日：2016-02-16

申请号：US13994253

申请日：2012-10-18

Applicant: Panasonic Corporation

Inventor： Masanori Minamio ,  Hiroki Ikeuchi

IPC: H05K1/00 ,  H05K1/03 ,  H01L23/29 ,  H01L23/427 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H05K3/46 ,  H01L23/31 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0306 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/4275 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49861 ,  H01L23/49894 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0224 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/186 ,  H05K3/284 ,  H05K3/285 ,  H05K3/4676 ,  H05K2201/0227 ,  H05K2201/0376 ,  H05K2201/0723 ,  H05K2201/1056 ,  H05K2201/10969 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

Abstract translation: 半导体器件是包括用第一树脂6模制的半导体元件T1的树脂封装结构。第一树脂6包含填充物7，填充物7包括用相变材料包围的电绝缘胶囊，其吸收周围热量和相变 以提高介电强度。 填料7的效果达到具有令人满意的散热和高耐受电压的结构。

公开(公告)号：US20160029481A1

公开(公告)日：2016-01-28

申请号：US14809195

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: H05K1/03 ,  F21V29/85 ,  H05K1/02 ,  F21V29/83 ,  H05B33/06 ,  H05B33/12 ,  F21V29/70

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A display device is provided. The display device includes a light engine having light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the light emitting components for improved cooling of the heat generated by the light emitting component and surrounding devices.

Abstract translation: 提供显示装置。 显示装置包括具有安装到具有柔性石墨基板的柔性电路板的发光部件的光引擎。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高的平面内导热石墨衬底提供增强的传热能力以有效地将热量从发光部件移开，以改善由发光部件和周围器件产生的热量的冷却。