公开(公告)号：US07009816B2

公开(公告)日：2006-03-07

申请号：US10733105

申请日：2003-12-10

Applicant: Shigeo Nakamura ,  Naoki Maeda ,  Shinobu Hagiya ,  Haruhide Takahashi ,  Kousaku Wakatsuki

Inventor： Shigeo Nakamura ,  Naoki Maeda ,  Shinobu Hagiya ,  Haruhide Takahashi ,  Kousaku Wakatsuki

IPC: G11B5/55

CPC classification number: H05K1/118 ,  G11B5/4813 ,  G11B5/4826 ,  G11B5/4846 ,  H05K1/0281 ,  H05K1/056 ,  H05K2201/0394 ,  H05K2201/053 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: To strengthen a flying lead portion of a long-tail flexible printed circuit (FPC) integrally formed with a flexure, stacked support portions of resin layers on both sides of a flying lead 7 of a long-tail FPC 6 are reinforced with metal frames 14. A fold-back portion 9 of the long-tail FPC 6 is folded back at 90 degrees so that flying lead 7 is disposed parallel with a turning shaft 21 of a carriage 20. The flying lead is then joined to a connection pad 26 on a main FPC board 24 using solder 18.

Abstract translation: 为了加强与挠曲件一体形成的长尾柔性印刷电路（FPC）的飞行引导部分，长尾翼FPC 6的飞行引线7的两侧的树脂层的堆叠支撑部分被金属框架14加强 长尾FPC6的折回部分9以90度折回，使得飞行引线7与托架20的转动轴21平行设置。 然后使用焊料18将飞铅与主FPC板24上的连接焊盘26接合。

公开(公告)号：US20050272276A1

公开(公告)日：2005-12-08

申请号：US11135511

申请日：2005-05-24

Applicant: Yasunari Ooyabu

Inventor： Yasunari Ooyabu

IPC: H05K1/11 ,  H01R33/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/142 ,  H01R12/61 ,  H05K3/0058 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: In order to provide a wired circuit board in which electrical continuity inspection can be omitted and a connection structure of the wired circuit board, in connection between a first wired circuit board 1 and a second wired circuit board 2, a first connection terminal 13 and a second connection terminal 14 are abutted against each other in the direction in which they are opposed along the respective longitudinal direction of the wired circuit boards, and are arranged in line with each other, and a solder bump 15 is provided so as to continuously extend over surfaces of the first connection terminal 13 and the second connection terminal 14. Consequently, the solder bump 15 is not interposed between opposed surfaces of the first connection terminal 13 and the second connection terminal 14, thereby allowing electrical connection by the solder bump 15 between the first connection terminal 13 and the second connection terminal 14 to be confirmed from the appearance by visual observation.

Abstract translation: 为了提供可以省略电连续性检查的布线电路板和布线电路板的连接结构，在第一布线电路板1和第二布线电路板2之间连接第一连接端子13和 第二连接端子14沿着与布线电路板的纵向方向相对的方向彼此抵接，并且彼此排成一列，并且设置焊料凸块15，以连续地延伸越过 第一连接端子13和第二连接端子14的表面。 因此，焊料凸块15不插入在第一连接端子13和第二连接端子14的相对的表面之间，从而允许由第一连接端子13和第二连接端子14之间的焊料凸块15进行电连接以从 通过目视观察外观。

公开(公告)号：US20050265008A1

公开(公告)日：2005-12-01

申请号：US10857743

申请日：2004-05-28

Applicant: Bruce Chamberlin ,  Erica Jasper Gant ,  Roger Krabbenhoft

Inventor： Bruce Chamberlin ,  Erica Jasper Gant ,  Roger Krabbenhoft

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

CPC classification number: H05K1/0263 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/325 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10492 ,  H05K2201/10719 ,  H05K2201/2009

Abstract: A method and structures are provided for implementing enhanced reliability for printed circuit board high power dissipation applications. An external return current member provides a return current path outside of the printed circuit board, thereby minimizing power dissipation within the printed circuit board. The external return current member can be implemented with an associated stiffener formed of electrically conductive material. Alternatively, the external return current member can be implemented with a sheet of electrically conductive material with an insulator provided between the sheet and the associated stiffener.

Abstract translation: 提供了一种用于实现印刷电路板高功率耗散应用的增强的可靠性的方法和结构。 外部返回电流构件在印刷电路板外提供返回电流路径，从而最小化印刷电路板内的功率耗散。 外部返回电流元件可以用由导电材料形成的相关联的加强件来实现。 或者，外部返回电流元件可以用一片导电材料来实现，其中绝缘体设置在片材和相关联的加强件之间。

公开(公告)号：US20050231848A1

公开(公告)日：2005-10-20

申请号：US10826022

申请日：2004-04-16

Applicant: Yiren Hong ,  PohLye Lim ,  Mo Xu ,  TakKoon Ooi

Inventor： Yiren Hong ,  PohLye Lim ,  Mo Xu ,  TakKoon Ooi

IPC: G11B17/00 ,  G11B25/04 ,  H05K1/02 ,  H05K1/18

CPC classification number: G11B25/043 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/0173

Abstract: A base plate for a disc drive incorporates a printed circuit board and connector assembly into an integral composite base that is bonded together to form a single composite structure. This structure provides the strength, stiffness and rigidity necessary to permit a reduction in overall thickness of a miniature disc drive to that substantially required for a Type I compact flash form factor data storage device.

Abstract translation: 用于盘驱动器的基板将印刷电路板和连接器组件结合成整体复合基底，其结合在一起以形成单个复合结构。 这种结构提供了所需的强度，刚度和刚度，以允许将小型盘驱动器的总体厚度减小到I型紧凑型闪存形状因数据存储装置基本上需要的厚度。

公开(公告)号：US20050167803A1

公开(公告)日：2005-08-04

申请号：US11043946

申请日：2005-01-28

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/34 ,  H01L23/498 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24 ,  H05K3/36

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/243 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0574 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract translation: 在薄膜基材（1）和形成在薄膜基材（1）上的导体布线（23）的薄膜基板（FB）中，导体布线（23）布置成使外部的导体布线厚度 连接另一面板或基板的薄膜基板上的连接部分比其他位置的导体布线部分（弯曲部分）（25）的导体布线厚度厚。

公开(公告)号：US06919513B2

公开(公告)日：2005-07-19

申请号：US10621376

申请日：2003-07-18

Applicant: Ye-Chung Chung ,  Si-Hoon Lee

Inventor： Ye-Chung Chung ,  Si-Hoon Lee

IPC: H01L21/60 ,  H01L23/495 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0097 ,  H01L23/49565 ,  H01L23/49572 ,  H01L2924/0002 ,  H05K3/0058 ,  H05K2201/09063 ,  H05K2201/2009 ,  H05K2203/1545 ,  Y10T428/24777 ,  H01L2924/00

Abstract: A film carrier tape and a method of forming a film carrier tape that incorporates a polymeric reinforcement film are provided for decreasing the deformation of and damage to film carrier tapes by forces resulting from contact with sprocket teeth during the semiconductor assembly process. The reinforcement film may include one or more synthetic resins and may increase the useable area of a base film used in forming film carrier tapes.

Abstract translation: 提供一种胶片载带和一种形成包含聚合物增强膜的胶片载带的方法，用于减少在半导体装配过程中与链轮齿接触所产生的力的胶片载带的变形和损坏。 增强膜可以包括一种或多种合成树脂，并且可以增加用于形成膜载带的基膜的可用面积。

公开(公告)号：US06908790B2

公开(公告)日：2005-06-21

申请号：US10698452

申请日：2003-11-03

Applicant: Kouki Nakahara ,  Hitoshi Morishita

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: G02F1/1345 ,  G02F1/13 ,  G09F9/00 ,  H01L21/60 ,  H01L23/498 ,  H05K1/00 ,  H05K3/28 ,  H05K3/36 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US20050087860A1

公开(公告)日：2005-04-28

申请号：US10995384

申请日：2004-11-24

Applicant: Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

Inventor： Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

IPC: H01L23/12 ,  H01L23/06 ,  H01L23/08 ,  H01L23/498 ,  H01L23/52 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/34 ,  H05K3/46 ,  H01L23/48

CPC classification number: H05K3/0061 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2203/1536

Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

Abstract translation: 一种用于半导体器件的多层衬底，其具有由多组导体层和绝缘层形成的多层衬底本体，并且具有用于安装半导体元件的面和用于外部连接端子的另一面，用于安装的面 半导体器件设置有衬底，衬底通过该焊盘连接到要安装在其上的半导体元件，并且用于外部连接端子的面设置有衬底，衬底通过该衬垫连接到外部电路，其中加强板是 分别连接到用于在其上安装半导体元件的面和多层基板主体的外部连接端子的表面。

公开(公告)号：US20050082086A1

公开(公告)日：2005-04-21

申请号：US10711795

申请日：2004-10-06

Applicant: Chun-Yang Lin ,  Shu-Chih Chen ,  Wen-Hsinung Shih

Inventor： Chun-Yang Lin ,  Shu-Chih Chen ,  Wen-Hsinung Shih

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/06

CPC classification number: H05K1/0271 ,  H05K1/0298 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A printed circuit board (PCB) includes a plastic substrate, and a layout formed on the plastic substrate. The layout comprises a first layout and a second layout, the second layout is less dense than the first layout. The second layout comprises a pseudo-layout to prevent the PCB from being bent when heated.

Abstract translation: 印刷电路板（PCB）包括塑料基板和在塑料基板上形成的布局。 布局包括第一布局和第二布局，第二布局不如第一布局密集。 第二布局包括伪布局以防止PCB在加热时弯曲。

公开(公告)号：US06882541B2

公开(公告)日：2005-04-19

申请号：US10795425

申请日：2004-03-09

Applicant: Terutaka Maruyama ,  Mitsuru Nakagawa

Inventor： Terutaka Maruyama ,  Mitsuru Nakagawa

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K1/14 ,  H05K5/02

CPC classification number: H05K3/284 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/2009

Abstract: Of an IC card, an IC is mounted on a surface of a circuit board (FPC) including a hard plate member that is attached on the other surface of the circuit board. Both surfaces of the circuit board having the IC and plate member are covered by a hard material member of electric insulating. Therefore, stress load applied to the IC can be restricted. Further, the circuit board along with the hard material member is divided into multiple portions that are connected using a flexible electric wiring. This can provide sufficient flexibility to the IC card, resulting in enhancement of a preventive effect in breakage or damage of the IC card.

Abstract translation: 在IC卡中，IC安装在包括安装在电路板的另一表面上的硬板构件的电路板（FPC）的表面上。 具有IC和板构件的电路板的两个表面被电绝缘的硬质材料构件覆盖。 因此，可以限制施加于IC的应力负荷。 此外，电路板与硬质材料构件一起分为多个使用柔性电线连接的部分。 这可以为IC卡提供足够的灵活性，从而提高IC卡的破损或损坏的预防效果。