公开(公告)号：US08897032B2

公开(公告)日：2014-11-25

申请号：US13114875

申请日：2011-05-24

Applicant: Abraham Hartenstein

Inventor： Abraham Hartenstein

IPC: H05K7/14 ,  H01R12/73 ,  H05K3/36 ,  H01R13/02 ,  H05K1/11

CPC classification number: H01Q9/045 ,  H01R12/737 ,  H01R13/02 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10098 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49018 ,  Y10T29/49126

Abstract: A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

Abstract translation: 一种用于将垂直印刷电路板与水平印刷电路板连接的方法和系统，其中当垂直印刷电路连接到垂直印刷电路时，接触装置在不接触垂直印刷电路板时被偏置在第一位置并被偏置在第二位置 水平印刷电路板。

公开(公告)号：US20140328036A1

公开(公告)日：2014-11-06

申请号：US13875062

申请日：2013-05-01

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： David Bruce Sarraf ,  Charles Randall Malstrom

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K1/092 ,  H01Q1/243 ,  H01Q1/38 ,  H01R12/728 ,  H05K1/11 ,  H05K3/12 ,  H05K3/32 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/0999 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  Y10T29/4913

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract translation: 电子器件包括具有第一表面的电介质衬底，沉积在第一表面上的导电电路，并且在第一表面上具有印刷的导电油墨迹线，以及机械耦合到衬底的导电插入器。 导电插入器电耦合到导电电路。 导电插入器具有可分离的接触界面，其被配置为机械地和电连接到可移除触点。 可选地，导电插入件可以包括主体和在主体和导电电路之间延伸的柔性元件。 柔性元件将导电电路与主体电连接。

公开(公告)号：US08851356B1

公开(公告)日：2014-10-07

申请号：US13158149

申请日：2011-06-10

Applicant: Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: B23K31/02

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。

公开(公告)号：US20140284091A1

公开(公告)日：2014-09-25

申请号：US14202457

申请日：2014-03-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuo FUJII

IPC: H01G2/02 ,  H01G4/12

CPC classification number: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/0311 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611

Abstract: A laminated electronic component includes a laminate including internal electrodes and dielectric layers laminated alternately and a first main surface, an external electrode that continuously covers at least one end surface of the laminate in a longitudinal direction and a portion of the first main surface adjacent to the one end surface, and a conductive elastic structure connected to the external electrode at at least corner portions of the first main surface in a portion where the external electrode covers the first main surface. The elastic structure includes a base portion connected to the external electrode to extend along the first main surface, and a branch portion branched from the base portion and extending at a position spaced from the first main surface to connect to another electrode, and having elasticity.

Abstract translation: 层叠电子部件包括层叠体，其包括交替层叠的内部电极和电介质层，以及第一主面，连续地覆盖层叠体的长度方向的至少一个端面的外部电极和与第一主表面相邻的部分的外部电极 一个端面，以及在外部电极覆盖第一主表面的部分中的至少在第一主表面的角部处连接到外部电极的导电弹性结构。 所述弹性结构包括与所述外部电极连接的基部，沿着所述第一主表面延伸，以及从所述基部分支并在与所述第一主表面间隔开的位置延伸以连接到另一电极并具有弹性的分支部。

公开(公告)号：US20140198471A1

公开(公告)日：2014-07-17

申请号：US14149864

申请日：2014-01-08

Applicant: FUJITSU LIMITED

Inventor： Naohiko Kajio ,  NAOFUMI KOSUGI ,  Yoshio Matsumoto

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract translation: 第一和第二锥形孔设置在第一和第二电路板的相对位置处。 包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。 第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。 弹簧插入两个间隔件之间。 第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。 第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

公开(公告)号：US08625297B2

公开(公告)日：2014-01-07

申请号：US13206532

申请日：2011-08-10

Applicant: Jun-Yi Xiao

Inventor： Jun-Yi Xiao

IPC: H05K7/00

CPC classification number: H01L25/50 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/0311 ,  H05K2201/0715 ,  H05K2203/1316 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract translation: 封装结构包括基板，在基板上构造和构造的多个电子部件，电连接到基板的多个金属弹性单元以及将多个电子部件和多个弹性单元一起封装的封装体，以及 基质。 离开基板的多个金属弹性单元中的每一个的一部分从包封体的外表面露出。

公开(公告)号：US20140001897A1

公开(公告)日：2014-01-02

申请号：US14004086

申请日：2012-03-07

Applicant: Werner Wallrafen

Inventor： Werner Wallrafen

IPC: H02K11/00

CPC classification number: H02K11/0094 ,  H01G2/06 ,  H01G4/248 ,  H02K5/225 ,  H05K1/183 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/1006 ,  H05K2201/10636 ,  Y02P70/611

Abstract: The invention relates to an assembly, comprising a substrate made of an electrically insulating material, an SMD component, which has lateral contact surfaces, and a lead frame part made of metal, which is fastened to the substrate and is used to establish electrical connections between the lateral contact surfaces of the SMD component and further functional elements of the assembly, wherein the lead frame part has contact tongues, which resiliently lie against the lateral contact surfaces and are connected to the lateral contact surfaces in a bonded manner.

Abstract translation: 本发明涉及一种组件，其包括由电绝缘材料制成的衬底，具有侧面接触表面的SMD部件和由金属制成的引线框架部件，所述引线框架部件被固定到衬底上，并用于建立电连接 SMD部件的横向接触表面和组件的另外的功能元件，其中引线框架部分具有接触舌片，弹性地抵靠侧向接触表面并且以接合的方式连接到侧面接触表面。

公开(公告)号：US08575745B2

公开(公告)日：2013-11-05

申请号：US13223600

申请日：2011-09-01

Applicant: Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

Inventor： Seiji Oka ,  Shiori Idaka ,  Hiroshi Yoshida

IPC: H01L23/48 ,  H01L23/04

CPC classification number: H05K3/325 ,  H01L2924/0002 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/1059 ,  Y02P70/611 ,  H01L2924/00

Abstract: A power semiconductor device includes a conductive insertion member as an external terminal projecting from a surface of the power semiconductor device facing a printed wiring board. The printed wiring board includes a conductive fitting member mounted on a pad part of the printed wiring board. The fitting member receives the insertion member therein when the power semiconductor device is connected to the printed wiring board. The insertion member has a recessed portion formed on a side surface of the insertion member. The fitting member has a projecting portion with elasticity formed on an inner side surface of the fitting member. The elasticity causes the projecting portion of the fitting member to contact the recessed portion of the insertion member under pressure when the insertion member is inserted into the fitting member.

Abstract translation: 功率半导体器件包括作为外部端子的导电插入构件，其从面向印刷线路板的功率半导体器件的表面突出。 印刷线路板包括安装在印刷线路板的焊盘部分上的导电配件。 当功率半导体器件连接到印刷线路板时，配件构件在其中容纳插入构件。 插入构件具有形成在插入构件的侧表面上的凹部。 装配构件具有形成在装配构件的内侧表面上的弹性的突出部分。 当插入构件插入到装配构件中时，弹性使得装配构件的突出部分在压力下接触插入构件的凹部。

公开(公告)号：US20130201637A1

公开(公告)日：2013-08-08

申请号：US13574789

申请日：2011-01-31

Applicant: Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

Inventor： Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

IPC: H05K1/02 ,  H05K13/04 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件，其中瓦片（1）包括具有电 - 物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 瓦片机械地和电耦合到载体上，并且瓦片根据鱼鳞图案覆盖。

公开(公告)号：US20130148322A1

公开(公告)日：2013-06-13

申请号：US13492895

申请日：2012-06-10

Applicant: Greg Fosnes ,  Aaron Miletich ,  Chris Ligtenberg ,  Jay Anastas ,  Erik James Shahoian ,  Eric Knopf ,  Peter Arnold

Inventor： Greg Fosnes ,  Aaron Miletich ,  Chris Ligtenberg ,  Jay Anastas ,  Erik James Shahoian ,  Eric Knopf ,  Peter Arnold

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H01R12/73 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49147

Abstract: Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract translation: 非矩形或矩形内插器，用于空间高效，可靠地制造，两个印刷电路板（如主板和配对板）之间的高速互连。 一个示例使用非矩形插入器提供空间效率，其中插入件可以至少近似为圆形。 可以通过包括一个或多个开口来接受一个或多个对准特征来提供可靠的制造。 在一个示例中，提供第一开口以接纳螺纹凸台，其可用于将两个印刷电路板和插入件紧固在一起。 在另一示例中，可以提供第二开口以接受对准柱，其中柱将插入件对准到两个印刷电路板。 可以在每一侧设置触点以与两个印刷电路板中的每一个上的触点配合。