公开(公告)号：US20110247874A1

公开(公告)日：2011-10-13

申请号：US13166577

申请日：2011-06-22

Applicant: Itsuo WATANABE ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

Inventor： Itsuo WATANABE ,  Kenzo Takemura ,  Akira Nagai ,  Kazuhiro Isaka ,  Osamu Watanabe ,  Kazuyoshi Kojima

IPC: H05K1/11 ,  H05K13/04 ,  B32B37/14 ,  B32B37/10 ,  B32B37/12

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

公开(公告)号：US20110247867A1

公开(公告)日：2011-10-13

申请号：US13166591

申请日：2011-06-22

Applicant: Itsuo WATANABE ,  Kenzo TAKEMURA ,  Akira NAGAI ,  Kazuhiro ISAKA ,  Osamu WATANABE ,  Kazuyoshi KOJIMA

Inventor： Itsuo WATANABE ,  Kenzo TAKEMURA ,  Akira NAGAI ,  Kazuhiro ISAKA ,  Osamu WATANABE ,  Kazuyoshi KOJIMA

IPC: H05K1/02 ,  B32B37/12

CPC classification number: H01L24/83 ,  C09J9/02 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0271 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0379 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T156/10 ,  Y10T156/109 ,  Y10T428/24942 ,  Y10T428/24959 ,  Y10T428/2852 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31855 ,  H01L2924/00

Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.

Abstract translation: 一种用于将半导体芯片接合并固定到电路板并电连接两个电极的粘合剂，并且包含粘合剂树脂组合物和无机填料，其含量为10至200重量份，100重量份的100重量份 粘合剂树脂组合物。

公开(公告)号：US20100230143A1

公开(公告)日：2010-09-16

申请号：US12787485

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20100219536A1

公开(公告)日：2010-09-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48 ,  H01B5/00 ,  H05K1/11

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US07786001B2

公开(公告)日：2010-08-31

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20100210042A1

公开(公告)日：2010-08-19

申请号：US12705729

申请日：2010-02-15

Applicant: Hyun-Jong OH ,  Seong-Chan HAN ,  Jae-Hoon CHOI ,  Chan-Hyung YUN

Inventor： Hyun-Jong OH ,  Seong-Chan HAN ,  Jae-Hoon CHOI ,  Chan-Hyung YUN

IPC: H01L21/66 ,  H01L21/50

CPC classification number: H05K3/303 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3511 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2203/302 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A method of manufacturing a semiconductor module is provided. A semiconductor package is formed, having one or more plate units which are bent by heat. The semiconductor package is aligned on a module substrate, and connection members are disposed between the semiconductor package and the module substrate. Heat is applied to the plate units and the connection members to extend a distance between the module substrate and the semiconductor package, and connection patterns are formed. The height of the connection patterns is larger than that of the connection members.

Abstract translation: 提供一种制造半导体模块的方法。 形成具有一个或多个通过加热弯曲的板单元的半导体封装。 半导体封装在模块衬底上对准，并且连接构件设置在半导体封装和模块衬底之间。 对板单元和连接构件施加热量以在模块基板和半导体封装之间延伸一定距离，并且形成连接图案。 连接图案的高度大于连接构件的高度。

公开(公告)号：US20100140796A1

公开(公告)日：2010-06-10

申请号：US12591364

申请日：2009-11-17

Applicant: Kiminori Ishido ,  Teruji Inomata

Inventor： Kiminori Ishido ,  Teruji Inomata

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L23/49811 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0379 ,  Y02P70/613 ,  H01L2924/00

Abstract: A manufacturing method of a semiconductor device includes a first to fourth steps. The first step includes a step of determining an UBM (Under Bump Metal) radius of an UBM of a chip. The second step includes a step of determining a first curvature radius of a solder bump formed on the UBM. The third step includes a step of determining a SRO (Solider Resist Opening) radius of a SRO of a substrate such that a ratio of the SRO radius to the UMB radius is in a range from 0.8 to 1.2. The fourth step includes a step of determining a second curvature radius of a spare solder formed on an electrode in the SRO such that the second curvature radius is equal to or more than the first curvature radius.

Abstract translation: 半导体器件的制造方法包括第一至第四步骤。 第一步包括确定芯片的UBM的UBM（低于凸点金属）半径的步骤。 第二步骤包括确定形成在UBM上的焊料凸块的第一曲率半径的步骤。 第三步骤包括确定基板的SRO的SRO（Solider Resist打开）半径的步骤，使得SRO半径与UMB半径的比率在0.8至1.2的范围内。 第四步骤包括确定形成在SRO中的电极上的备用焊料的第二曲率半径的步骤，使得第二曲率半径等于或大于第一曲率半径。

公开(公告)号：US07666777B2

公开(公告)日：2010-02-23

申请号：US11601540

申请日：2006-11-17

Applicant: Michael Bauer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Jens Pohl ,  Christian Stuempfl

Inventor： Michael Bauer ,  Markus Brunnbauer ,  Irmgard Escher-Poeppel ,  Jens Pohl ,  Christian Stuempfl

IPC: H01L21/00

CPC classification number: H05K3/4015 ,  H01L21/4853 ,  H01L23/49805 ,  H01L23/49816 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2203/0597 ,  Y02P70/613

Abstract: For the vertical electrical connection of a number of components, an electronic structure with at least two components has solderable connecting elements, which include at least one socket element and a solder ball stacked on the socket element. The socket element has a cylindrical core of an electrically conducting first material with a lateral surface, a bottom surface and a top surface. The core is surrounded with a cladding of an electrically insulating second material in such a way that the lateral surface of the core is covered by the cladding and the top surface and the bottom surface are kept free of the cladding.

Abstract translation: 对于多个部件的垂直电连接，具有至少两个部件的电子结构具有可焊接的连接元件，其包括堆叠在插座元件上的至少一个插座元件和焊球。 插座元件具有导电的第一材料的圆柱形芯，其具有侧表面，底表面和顶表面。 芯被电绝缘的第二材料的包层围绕，使得芯的侧表面被包层覆盖，并且顶表面和底表面保持没有包层。

公开(公告)号：US20100022105A1

公开(公告)日：2010-01-28

申请号：US12506974

申请日：2009-07-21

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H05K3/32 ,  H01R12/52 ,  H01R13/11 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10734 ,  Y02P70/613

Abstract: One embodiment is a connector for making electrical connection to a bulbous terminal, the connector including: a metal tube with a cylindrical wall extending from a mating end, wherein: (a) two or more slots perforate the wall and extend from the mating end along the tube; (b) two or more apertures perforate the wall and are disposed in a circumferential array disposed a distance from the mating end; and (c) each of the two or more slots transects one of the two or more apertures to divide the mating end of the tube into resilient prongs.

Abstract translation: 一个实施例是用于与球根端子进行电连接的连接器，该连接器包括：金属管，其具有从配合端延伸的圆柱形壁，其中：（a）两个或更多个狭缝在壁上穿孔并从配合端沿着 管子 （b）两个或更多个孔穿过该壁并设置在与配合端一定距离设置的圆周阵列中; 和（c）两个或更多个槽中的每一个横切两个或更多个孔中的一个，以将管的配合端分成弹性插脚。

公开(公告)号：US07615478B2

公开(公告)日：2009-11-10

申请号：US11769321

申请日：2007-06-27

Applicant: Peter C. Salmon

Inventor： Peter C. Salmon

IPC: H01L21/44

CPC classification number: H05K3/363 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05573 ,  H01L2224/11332 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3651 ,  H05K1/0289 ,  H05K1/115 ,  H05K3/007 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/4015 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0568 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599

Abstract: This specification describes techniques for manufacturing an electronic system module. The module includes flexible multi-layer interconnection circuits with trace widths as narrow as 5 microns or less. A glass panel manufacturing facility, similar to those employed for making liquid crystal display, LCD, panels is preferably used to fabricate the interconnection circuits. A multi-layer interconnection circuit is fabricated on the glass panel using a release layer. A special assembly layer is formed over the interconnection circuit comprising a thick dielectric layer with openings formed at input/output (I/O) pad locations. Solder paste is deposited in the openings using a squeegee to form wells filled with solder. IC chips are provided with gold stud bumps at I/O pad locations, and these bumps are inserted in the wells to form flip chip connections. The IC chips are tested and reworked. The same bump/well connections can be used to attach fine-pitch cables. Module packaging layers are provided for hermetic sealing and for electromagnetic shielding. A blade server or supercomputer embodiment is also described.

Abstract translation: 本说明书描述了用于制造电子系统模块的技术。 该模块包括具有窄至5微米或更小的迹线宽度的柔性多层互连电路。 与用于制造液晶显示器，LCD，面板的玻璃面板制造设备相似，优选地用于制造互连电路。 使用剥离层在玻璃面板上制造多层互连电路。 在互连电路上形成特殊的组装层，该电路包括在输入/输出（I / O）焊盘位置处形成有开口的厚电介质层。 使用刮刀将焊膏沉积在开口中以形成填充有焊料的孔。 IC芯片在I / O焊盘位置处设有金柱凸起，并且这些凸块插入孔中以形成倒装芯片连接。 IC芯片经过测试和返工。 相同的凹凸/连接可用于连接细间距电缆。 提供模块封装层用于密封和电磁屏蔽。 还描述了刀片服务器或超级计算机实施例。