公开(公告)号：US20060216860A1

公开(公告)日：2006-09-28

申请号：US11388755

申请日：2006-03-24

Applicant: Rajendra Pendse

Inventor： Rajendra Pendse

IPC: H01L21/00 ,  H01L23/02

CPC classification number: H01L23/49838 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/8121 ,  H01L2224/81211 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow interconnect pad is less than a base diameter of bumps on the die to be attached. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having narrow interconnect pads on electrically conductive traces in a die attach surface, in which the bumps are mated onto the narrow pads on the traces.

公开(公告)号：US07087844B2

公开(公告)日：2006-08-08

申请号：US11014399

申请日：2004-12-16

Applicant: Yasuto Ishimaru ,  Kensuke Nishi ,  Hiroshi Yamazaki

Inventor： Yasuto Ishimaru ,  Kensuke Nishi ,  Hiroshi Yamazaki

IPC: H05K1/00

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/323 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: The width of a particular part (A) of a strip conductor 2 of a wiring circuit board for mounting is reduced, wherein the strip conductor is exposed to form a stripe pattern, so that individual conductor can be connected to electrode E of an electronic component. The particular part (A) is one section in the longitudinal direction of a strip conductor having a long end, which part includes an area overlapping an electrode which is connected to a short end and transferred in parallel in the strip width direction up to the position on the strip conductor having a long end. Due to this constitution, a structure capable of suppressing a short circuit between an electrode and a wiring pattern can be afforded to a wiring circuit board, even to an electronic component having an electrode formed in high-density and in a zigzag arrangement pattern, which comprises an area overlapping an electrode.

Abstract translation: 用于安装的布线电路板的带状导体2的特定部分（A）的宽度减小，其中，带状导体暴露以形成条纹图案，使得各个导体可以连接到电子部件的电极 。 特定部分（A）是具有长端的带状导体的纵向方向上的一个部分，该部分包括与电极连接的区域，该电极连接到短端并沿带宽度方向平行转移直到位置 在具有长端的带状导体上。 由于这种结构，即使是具有以高密度和锯齿形排列图案形成的电极的电子部件，也可以向布线电路板提供能够抑制电极和布线图案之间的短路的结构， 包括与电极重叠的区域。

公开(公告)号：US20060140283A1

公开(公告)日：2006-06-29

申请号：US10543433

申请日：2004-01-26

Applicant: Willebrordus Traa

Inventor： Willebrordus Traa

IPC: H04B3/00

CPC classification number: H04L25/0272 ,  H04L5/20 ,  H04L25/028 ,  H04L25/0292 ,  H04L25/085 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09727

Abstract: A data processing circuit has four signal conductors between a driver and a receiver, and first and second, mutually conducting shield planes. First and second signal conductors form a symmetrical stack in a column between the first and the second plane. Third and fourth signal conductors are arranged substantially midway between the first and the second plane, on mutually opposite sides of the stack. The first, second, third and fourth signal conductors have respective widths so that respective transmission line impedances of transmission lines between each particular one of the first, second, third and fourth conductors and the first and second planes are substantially mutually equal.

公开(公告)号：US07041920B1

公开(公告)日：2006-05-09

申请号：US11055501

申请日：2005-02-08

Applicant: Steven R. Young ,  Fredrick V. Hayen ,  Joshua J. Harmala

Inventor： Steven R. Young ,  Fredrick V. Hayen ,  Joshua J. Harmala

IPC: H01H3/16

CPC classification number: G11B5/455 ,  G11B5/40 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0393 ,  H05K1/056 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/175

Abstract: Structure and method for forming a switchable shunt for a suspension assembly having conductive, insulating and metal base layers. The shunt includes a bridge in the conductive layer with either a continuous connection or small gap between ends of the bridge. The continuous connection of the bridge is severed either by temporarily moving the lands out of their original plane by stretching and rupturing the bridge or by shearing the continuous connection of the bridge. For the sheared or gapped bridge, at least one end of the bridge is moved out of plane, compressed and elongated. When released, the separated ends of the bridge overlap and contact each other to form a normally-closed switch. To subsequently open the switchable shunt, at least one of the lands is moved out of plane to physically and electrically open the connection between the separated and overlapped ends of the bridge.

Abstract translation: 用于形成具有导电，绝缘和金属基底层的悬架组件的可切换分路的结构和方法。 分流器包括在导电层中的桥，其中桥与连接端之间具有连续连接或小间隙。 桥的连续连接通过暂时地将平台从其原始平面移动，通过拉伸和破裂桥梁或者通过剪切桥的连续连接来切断。 对于剪切或有间隙的桥梁，桥梁的至少一端移出平面，压缩并伸长。 当释放时，桥的分离端重叠并彼此接触以形成常闭开关。 为了随后打开可切换分路，至少一个平台被移出平面以物理上和电气地打开桥的分离和重叠的端部之间的连接。

公开(公告)号：US20060076158A1

公开(公告)日：2006-04-13

申请号：US11248695

申请日：2005-10-12

Applicant: Mikiya Umeyama ,  Yutaka Koizumi ,  Yukuo Yamaguchi ,  Akira Goto ,  Masaru Iketani ,  Yuichiro Akama

Inventor： Mikiya Umeyama ,  Yutaka Koizumi ,  Yukuo Yamaguchi ,  Akira Goto ,  Masaru Iketani ,  Yuichiro Akama

IPC: H05K1/11

CPC classification number: H05K1/028 ,  B41J2/17526 ,  H05K3/281 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: In a flexible wiring board for use in, for example, a liquid discharge head, wires disposed on a substrate in parallel are covered with a film material. The flexible wiring board is bendable towards one of a front surface side and a back surface side of the substrate and includes a bending line. The bending line is formed by bending the flexible wiring board along a bending direction crossing a longitudinal direction of the wires. The bending line contains the wires. Both ends of the flexible wiring board in the bending direction are located on the bending line. A distance between one of the wires located closest to one end of the flexible wiring board and the one end is larger on the bending line than in another part of the flexible wiring board. Accordingly, even if the flexible wiring board is bent at a small bend radius, peeling does not easily occur between a base film and a cover film.

Abstract translation: 在用于例如液体排出头的柔性布线板中，平行地设置在基板上的布被薄膜材料覆盖。 柔性布线板可以朝向基板的前表面侧和背面侧之一弯曲，并且包括弯曲线。 弯曲线通过沿着与电线的纵向交叉的弯曲方向弯曲柔性布线板而形成。 弯曲线包含电线。 柔性布线板的弯曲方向的两端位于弯曲线上。 位于最靠近柔性线路板的一端的一条电线与一端之间的距离在弯曲线上大于柔性电路板的另一部分。 因此，即使柔性布线板以小的弯曲半径弯曲，也不容易在基膜和覆盖膜之间发生剥离。

公开(公告)号：US20060065437A1

公开(公告)日：2006-03-30

申请号：US11227018

申请日：2005-09-15

Applicant: Masanori Yumoto ,  Yoshihisa Hirano

Inventor： Masanori Yumoto ,  Yoshihisa Hirano

IPC: H05K7/06

CPC classification number: G02F1/13452 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09727

Abstract: A mounting structure includes a first substrate that has a first surface and a second surface, a plurality of first connection terminals that are disposed on the first surface in a first direction, a plurality of second connection terminals that are disposed on the first surface in a second direction perpendicular to the first direction and that are disposed at predetermined gaps from the first connection terminals, a plurality of connection wiring lines that are disposed on the second surface, each having first portions that overlap the first and second connection terminals in plan view and a second portion that is formed to have a width narrower than those of the first and second connection terminals in the first direction, a plurality of through holes that pass through the first substrate so as to correspondingly connect the second connection terminals to the connection wiring lines, and a second substrate that has a plurality of third connection terminals correspondingly connected to the first and second connection terminals and correspondingly overlap the first and second connection terminals in plan view.

Abstract translation: 安装结构包括具有第一表面和第二表面的第一基板，在第一方向上设置在第一表面上的多个第一连接端子，多个第一连接端子，其设置在第一表面上 第二方向垂直于第一方向并且设置在距第一连接端子的预定间隙处;多个连接布线，其布置在第二表面上，每个连接布线具有在俯视图中与第一和第二连接端子重叠的第一部分， 第二部分形成为具有比第一和第二连接端子在第一方向的宽度窄的宽度;多个通孔，其穿过第一基板，以将第二连接端子相应地连接到连接布线 以及具有相应连接的多个第三连接端子的第二基板 到第一和第二连接端子，并且在平面图中相应地重叠第一和第二连接端子。

公开(公告)号：US20060055021A1

公开(公告)日：2006-03-16

申请号：US11084805

申请日：2005-03-18

Applicant: Mitsuhiko Yamamoto

Inventor： Mitsuhiko Yamamoto

IPC: H01L23/48

CPC classification number: H05K1/0265 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/205 ,  H05K3/244 ,  H05K3/245 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/098 ,  H05K2201/09881 ,  H01L2924/00 ,  H01L2224/0401

Abstract: According to this invention, a wiring board includes a conductive pattern formed from leads each of which is formed on an organic layer and has a thickness t larger than a width W.

Abstract translation: 根据本发明，布线基板包括由引线形成的导电图案，每个引线形成在有机层上并且具有大于宽度W的厚度t

公开(公告)号：US07002432B2

公开(公告)日：2006-02-21

申请号：US10767900

申请日：2004-01-28

Applicant: Jimmy Hsu

Inventor： Jimmy Hsu

IPC: H03H7/38

CPC classification number: H05K1/0253 ,  H01P3/08 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/09727

Abstract: A signal transmission structure includes at least one reference plane with a non-reference area, and a signal line with a salient protruding over the edge of the signal line and the salient is corresponding to the position of the non-reference area. When a signal passes through the signal line, the effect of the parasitic capacitance between the salient and the reference plane can improve the characteristic impedance mismatch. Therefore, the signal transmission structure can reduce the insertion loss and increase the reduction of the return loss in order to locally compensate the impedance mismatch.

Abstract translation: 信号传输结构包括具有非参考区域的至少一个参考平面以及在信号线的边缘上突出的突出信号线，并且显着对应于非参考区域的位置。 当信号通过信号线时，突出和参考平面之间的寄生电容的影响可以改善特性阻抗失配。 因此，为了局部地补偿阻抗失配，信号传输结构可以减小插入损耗并增加返回损耗的降低。

公开(公告)号：US06927992B1

公开(公告)日：2005-08-09

申请号：US10707249

申请日：2003-12-01

Applicant: Yao Tung Yen

Inventor： Yao Tung Yen

IPC: G11C5/06 ,  G11C7/10 ,  H05K1/02

CPC classification number: H05K1/025 ,  G11C5/04 ,  G11C5/063 ,  G11C7/1072 ,  H05K1/0245 ,  H05K2201/09254 ,  H05K2201/09727

Abstract: A module board has trace impedances that are matched at trace junctions. An input line that drives a signal to a junction has its impedance adjusted to match the equivalent impedance of branch traces output from the junction. Since input and output impedances match, reflections caused by the junction are minimized or eliminated. The input impedance can match by being within 20% of the equivalent impedance of the branch lines. The equivalent impedance of branches is the reciprocal of the sum of the individual branch lines' reciprocal impedance. Termination can be eliminated when such junctions are impedance-matched. Secondary junctions can also be impedance-matched, allowing for a variety of trace topologies. Such trace-impedance matching is especially useful for memory modules.

Abstract translation: 模块板具有跟踪结点匹配的迹线阻抗。 将信号驱动到接点的输入线的阻抗被调整为匹配从接点输出的分支走线的等效阻抗。 由于输入和输出阻抗匹配，结点引起的反射被最小化或消除。 输入阻抗可以匹配在分支线的等效阻抗的20％以内。 分支的等效阻抗是各个分支线的倒数阻抗之和的倒数。 当这种结点阻抗匹配时，可以消除终止。 二次结也可以是阻抗匹配的，允许各种迹线拓扑。 这种跟踪阻抗匹配对于存储器模块特别有用。

公开(公告)号：US20050158553A1

公开(公告)日：2005-07-21

申请号：US11078342

申请日：2005-03-14

Applicant: Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

Inventor： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  B05D5/12

CPC classification number: H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Abstract translation: 在布线图案58b，58c和58d的交叉部分X中，将构图F添加到构成等于或小于90°的拐角部分C的部分，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。