公开(公告)号：US08592692B2

公开(公告)日：2013-11-26

申请号：US13189278

申请日：2011-07-22

Applicant: Alex Michael Sharf ,  Jie Qin

Inventor： Alex Michael Sharf ,  Jie Qin

IPC: H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/115 ,  H05K3/306 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

Abstract: A substrate is provided that includes a plurality of substrate layers and a plural diameter via having a first via portion and a second via portion. The first via portion is formed in a first substrate layer, has a first diameter, and extends along a first axis. The second via portion is formed in a second substrate layer, has a second diameter that is different than the first diameter of the first via portion, and extends along a second axis that is offset from the first axis of the first via portion. Optionally, the first via portion and the second via portion may have a common edge that is spaced the same distance from an edge of another via extending through the substrate.

Abstract translation: 提供一种衬底，其包括多个衬底层和具有第一通孔部分和第二通孔部分的多个直径通孔。 第一通孔部分形成在第一基底层中，具有第一直径并且沿着第一轴线延伸。 第二通孔部分形成在第二基底层中，具有不同于第一通孔部分的第一直径的第二直径，并且沿着与第一通孔部分的第一轴线偏移的第二轴线延伸。 可选地，第一通孔部分和第二通孔部分可以具有与延伸穿过基底的另一通路的边缘间隔相同距离的公共边缘。

公开(公告)号：US20130244490A1

公开(公告)日：2013-09-19

申请号：US13879883

申请日：2011-11-29

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R31/06 ,  H05K3/12 ,  H05K3/10

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US08528202B2

公开(公告)日：2013-09-10

申请号：US11513478

申请日：2005-02-17

Applicant: Tetsuo Yumoto

Inventor： Tetsuo Yumoto

IPC: H05K3/42

CPC classification number: G01R31/28 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49176

Abstract: A molding pin for a metal die is prevented from breaking, solder is surely deposited, and thus, a circuit pitch can be reduced to the limit. On the front plane of a circuit board, prescribed circuit patterns made of a conductive material are formed, and on the rear plane, prescribed circuit patterns are also formed. On the circuit board, a through hole is formed to carry electricity between the circuit patterns on both planes. The inner shape of the through hole is narrow in a direction between the adjacent circuit patterns and wide in a circuit extending direction.

Abstract translation: 防止金属模具的成型销断裂，确实沉积焊料，因此可以将电路间距减小到极限。 在电路板的正面上，形成由导电材料制成的规定的电路图案，在背面也形成规定的电路图形。 在电路板上，形成通孔，以在两个平面上的电路图案之间承载电力。 通孔的内部形状在相邻电路图案之间的方向上窄，并且在电路延伸方向上宽。

公开(公告)号：US20130130418A1

公开(公告)日：2013-05-23

申请号：US13512328

申请日：2010-11-04

Applicant: Young Seob Lee

Inventor： Young Seob Lee

IPC: H01L33/64

CPC classification number: H01L33/647 ,  F21K9/00 ,  F21V29/20 ,  F21V29/70 ,  F21V29/89 ,  F21W2131/103 ,  F21Y2115/10 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K3/0047 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/1572 ,  H01L2924/00014

Abstract: The present invention relates to a method for manufacturing large lighting which uses a power LED, such as for large LED lighting for street lamps, which incorporates a heat dissipation device that has the ability to dissipate heat with natural convection to maintain ambient temperature. The disclosed method is novel applied technology for producing a large LED lighting, such as for street lamps, which has a power LED device with a unique, rear heat dissipation capability. In addition to maximum thermal efficiency by heat dissipation, the present LED lighting system also increases luminous efficiency by providing high light emission with only a small quantity of LED power.

Abstract translation: 本发明涉及一种制造大型照明的方法，其使用功率LED，例如用于路灯的大型LED照明，其包括具有通过自然对流散热以维持环境温度的能力的散热装置。 所公开的方法是用于生产诸如路灯的大型LED照明的新颖应用技术，其具有具有独特的后部散热能力的功率LED装置。 除了通过散热的最大热效率之外，目前的LED照明系统还通过仅提供少量LED功率的高发光量来提高发光效率。

公开(公告)号：US20130104365A1

公开(公告)日：2013-05-02

申请号：US13477919

申请日：2012-05-22

Applicant: Bo-Shiung HUANG ,  Han-Ching SHIH ,  Tzu-Yuan FAN ,  Wei-Hsiung YANG ,  Kai-Hsiang CHEN

Inventor： Bo-Shiung HUANG ,  Han-Ching SHIH ,  Tzu-Yuan FAN ,  Wei-Hsiung YANG ,  Kai-Hsiang CHEN

IPC: B23P17/04

CPC classification number: H05K1/165 ,  H01F41/0253 ,  H01F41/14 ,  H05K2201/086 ,  H05K2201/09854 ,  Y10T29/4902 ,  Y10T29/49075 ,  Y10T29/49826 ,  Y10T29/49833

Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

Abstract translation: 公开了一种在基板中嵌入磁性部件的方法。 通过机械钻孔在基板中形成孔。 每个孔包括顶部开口，底部和侧壁，其中顶部开口的区域大于底部开口的面积。 侧壁从顶部开口垂直向下延伸到预定深度，然后向内倾斜到底部，以在孔的底部形成倾斜的侧壁。 沿着顶部开口的边缘的一部分限定预定区域，并且通过布线移除在该预定区域下方的基底材料的一部分，以形成部分容纳沟槽，其中倾斜侧壁的一部分位于底部。 然后，将磁性部件放置在部件容纳沟槽中。

公开(公告)号：US20130075146A1

公开(公告)日：2013-03-28

申请号：US13624448

申请日：2012-09-21

Applicant: Hoya Corporation

Inventor： Takashi FUSHIE ,  Hajime KIKUCHI

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  B32B3/24

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/381 ,  H05K3/423 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T428/24273

Abstract: There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.

Abstract translation: 提供了包括由包含氧化硅的玻璃构成的玻璃基板2的基板。 玻璃基板具有与玻璃基板的前表面和后表面连通并且填充有金属材料的通孔3。 通过在填充金属材料之前通过选择性地蚀刻围绕所述通孔3的内侧的侧壁上的氧化硅并且在形成所述金属材料之后用所述金属材料填充所述通孔3的内部来形成所述基板 主体部分。

公开(公告)号：US20120298413A1

公开(公告)日：2012-11-29

申请号：US13480985

申请日：2012-05-25

Applicant: Kenichi MORI

Inventor： Kenichi MORI

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/425 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0152 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A wiring substrate includes a body including first and second surfaces, a trench having an opening on the first surface and including, a bottom surface, a side surface, and a slope surface that connects a peripheral part of the bottom surface to a one end part of the side surface and widens from the peripheral part to the one end part, the one end part being an end part opposite from the first surface, a hole including an end communicating with the bottom surface and another end being open on the second surface, a first layer filling at least a portion of the hole and including a top surface toward the trench, a second layer covering the top surface and formed on at least a portion of the trench except for a part of the side surface, and a third layer covering the second layer and filling the trench.

Abstract translation: 布线基板包括：主体，其包括第一表面和第二表面;沟槽，其在第一表面上具有开口，并且包括底表面，侧表面以及将底表面的周边部分连接到一个端部的倾斜表面 并且从所述周边部向所述一个端部变宽，所述一端部为与所述第一面相反的端部，所述端部与所述底面相连通，所述另一端在所述第二面上开口， 填充所述孔的至少一部分并且包括朝向所述沟槽的顶表面的第一层，覆盖所述顶表面并形成在除了所述侧表面的一部分之外的所述沟槽的至少一部分上的第二层，以及第三层 覆盖第二层并填充沟槽。

公开(公告)号：US08253027B2

公开(公告)日：2012-08-28

申请号：US12712034

申请日：2010-02-24

Applicant: Kimihiro Yamanaka ,  Manabu Ichinose ,  Satoshi Nakamura

Inventor： Kimihiro Yamanaka ,  Manabu Ichinose ,  Satoshi Nakamura

IPC: H05K1/03

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H05K1/0263 ,  H05K1/113 ,  H05K3/4644 ,  H05K2201/09627 ,  H05K2201/09745 ,  H05K2201/09854 ,  H05K2201/10674 ,  Y10T29/49155 ,  Y10T428/24917 ,  H01L2224/05599

Abstract: According to one embodiment of the invention, a circuit board comprises a conductive layer including a land portion and a line portion connected to the land portion, and; a conductor connected to a surface of the land portion. A planar shape of the connected portion between the conductor and the land portion has a elongated shape along a width direction of the line portion. A part of the connected portion is located within an imaginary region formed by imaginarily extending the line portion toward the land portion.

Abstract translation: 根据本发明的一个实施例，电路板包括导电层，该导电层包括接地部分和连接到焊盘部分的线路部分， 连接到陆部的表面的导体。 导体与陆部之间的连接部分的平面形状沿着线部分的宽度方向具有细长形状。 连接部分的一部分位于通过将线部分向着陆部分的想象地延伸形成的虚拟区域内。

公开(公告)号：US20120213944A1

公开(公告)日：2012-08-23

申请号：US13325105

申请日：2011-12-14

Applicant: Tsutomu YAMAUCHI ,  Satoru Kawai

Inventor： Tsutomu YAMAUCHI ,  Satoru Kawai

IPC: H05K3/00 ,  B05D3/06

CPC classification number: H05K3/0032 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572

Abstract: A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.

Abstract translation: 一种制造印刷线路板的方法，包括在芯基板中形成贯通孔，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在该孔中填充导电材料 使得在孔中形成通孔导体，并且第一和第二导体经由通孔导体连接。 孔的形成包括在第一表面中形成第一开口，从第一开口的底部朝向第二表面形成第二开口，使得第二开口具有比第一开口更小的直径，在第二开口中形成第三开口 并且从第三开口的底部朝向第一表面形成第四开口，使得第四开口具有比第三开口小的直径。

公开(公告)号：US20120199386A1

公开(公告)日：2012-08-09

申请号：US13325414

申请日：2011-12-14

Applicant: Takema Adachi ,  Liyi Chen

Inventor： Takema Adachi ,  Liyi Chen

IPC: H05K1/02 ,  H05K3/02

CPC classification number: H05K3/445 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/056 ,  H05K3/0032 ,  H05K3/3478 ,  H05K3/4608 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/1572

Abstract: A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings.

Abstract translation: 一种印刷电路板，包括具有金属层的芯基板，在所述金属层的表面上的第一树脂绝缘层和在所述金属层的相对表面上的第二树脂绝缘层，形成在所述第一层上的第一导电电路， 形成在第二层上的第二导电电路，以及形成在穿过基板的穿透孔中并连接第一和第二电路的通孔导体。 金属层具有填充有填充树脂的开口，贯通孔在第一层中具有第一开口，在第二层中具有第二开口，在填充树脂中具有第三开口，第一开口朝着填充树脂逐渐变细， 第二开口朝向填充树脂逐渐变细，第三开口连接第一和第二开口。