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    Electrical conductor having unique solder dam configuration
    153.
    发明授权
    Electrical conductor having unique solder dam configuration 失效
    电导体具有独特的焊接坝配置

    公开(公告)号：US4859808A

    公开(公告)日：1989-08-22

    申请号：US212446

    申请日：1988-06-28

    Applicant: Michael A. Jeter ,  Joseph S. Capurso

    Inventor： Michael A. Jeter ,  Joseph S. Capurso

    IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K3/34

    CPC classification number: H01L24/81 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/49883 ,  H05K3/3452 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10674

    Abstract: An electrical interconnection lead pattern for connecting an integrated circuit to an electrical circuit comprises a plurality of electrical conductors and a plurality of non-continuous dielectric regions. Each conductor has a contact region wherein the conductor is subsequently electrically connected to a predetermined region on the integrated circuit. In addition, each of the contact regions are substantially parallel with respect to each and every other contact region. The dielectric regions comprise a material not amenable to soldering and are substantially parallel with respect to each and every other dielectric region so that the non-continuous regions between the dielectric regions are also substantially parallel. Lastly, the contact regions are substantially perpendicular with respect to each and every dielectric region, and disposed such that a portion of each of the contact regions contacts a portion of the non-continuous region between the dielectric regions and a portion of the dielectric region. This conductor pattern provides a high tolerance for misalignment between the contact regions, the dielectric regions, and the contacted regions of the integrated circuit without detrimental effects to the integrity of the resulting electrical connection.

    Abstract translation: 用于将集成电路连接到电路的电互连引线图案包括多个电导体和多个非连续的电介质区域。 每个导体具有接触区域，其中导体随后电连接到集成电路上的预定区域。 此外，每个接触区域相对于每个其它接触区域基本平行。 电介质区域包括不易焊接的材料，并且相对于每个其它电介质区域基本平行，使得电介质区域之间的非连续区域也基本上平行。 最后，接触区域相对于每个电介质区域基本垂直，并且被布置为使得每个接触区域的一部分接触电介质区域和电介质区域的一部分之间的非连续区域的一部分。 该导体图案为接触区域，电介质区域和集成电路的接触区域之间的未对准提供了高公差，而对所得电连接的完整性没有不利影响。

    Electronic circuit assembly
    154.
    发明授权
    Electronic circuit assembly 失效
    电子电路组件

    公开(公告)号：US4833570A

    公开(公告)日：1989-05-23

    申请号：US116662

    申请日：1987-11-03

    Applicant: Tatsuo Teratani

    Inventor： Tatsuo Teratani

    IPC: H05K3/28 ,  H05K3/30 ,  H05K3/34

    CPC classification number: H05K3/306 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/09909 ,  H05K2201/09936 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/167 ,  H05K3/3447

    Abstract: An electronic circuit assembly includes a printed cirucit base plate, an electronic circuit element, a spacer and a coating resin. The electronic circuit element includes an IC housing and a plurality of lead pins. The plurality of lead pins are electrically connected and secured to the printed circuit base plate such that the IC housing is spaced apart from the printed circuit base plate. The spacer is located between the printed circuit base plate and the IC housing. The coating resin coats the printed circuit base plate, a portion of the spacer and a portion of the lead pins of the electronic circuit element.

    Abstract translation: 电子电路组件包括印刷的cirucit基板，电子电路元件，间隔物和涂层树脂。 电子电路元件包括IC壳体和多个引脚。 多个引脚被电连接并固定到印刷电路基板，使得IC壳体与印刷电路基板间隔开。 间隔件位于印刷电路基板和IC外壳之间。 涂布树脂涂覆印刷电路基板，间隔物的一部分和电子电路元件的引脚的一部分。

    Conformal coating for electrical circuit assemblies
    155.
    发明授权
    Conformal coating for electrical circuit assemblies 失效
    用于电路组件的保形涂层

    公开(公告)号：US4300184A

    公开(公告)日：1981-11-10

    申请号：US56505

    申请日：1979-07-11

    Applicant: Jeannine O. Colla

    Inventor： Jeannine O. Colla

    IPC: H01L23/29 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

    CPC classification number: H05K3/284 ,  H01L23/293 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10977 ,  H05K3/0091 ,  H05K3/3447

    Abstract: A printed circuit board with electronic components wired thereto has a conformal insulating coating consisting of a single component of essentially pure urethane formulation and a minor amount of fumed colloidal silica powder. The insulating coating covers asperities and protrusions as well as the conductors and circuit components while maintaining a transparent characteristic. The coating material is made by mixing of the small proportion of silica with essentially pure urethane formulation under controlled conditions to prevent moisture contamination of the materials. The mixture is thoroughly mixed, deaerated under reduced pressure with a pulsating pressure to break any air bubbles and remove essentially all air. The coating is applied in an environment having at least 30 percent relative humidity and within a confined area defined by an encircling dam masking compound. The coating is allowed to partially cure at room temperature and the confining dam compound removed. For maximum protection, a further period of curing of one week is provided.

    Abstract translation: 具有连接到其上的电子部件的印刷电路板具有由基本上纯的氨基甲酸酯制剂的单一组分和少量的热解胶体二氧化硅粉末组成的共形绝缘涂层。 绝缘涂层覆盖粗糙度和突起以及导体和电路部件，同时保持透明特性。 涂料通过在受控条件下将小比例的二氧化硅与基本上纯的氨基甲酸酯配方混合来制备，以防止材料的水分污染。 将混合物充分混合，在减压下以脉动压力进行脱气以破坏任何气泡并基本上除去所有空气。 将涂层施用于具有至少30％相对湿度并且在由环绕的坝掩蔽化合物限定的限制区域内的环境中。 使涂层在室温下部分固化，并将封闭的混合物除去。 为了最大程度的保护，提供了一周的固化时间。

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