公开(公告)号：US07710739B2

公开(公告)日：2010-05-04

申请号：US11405327

申请日：2006-04-17

Applicant: Hajime Kimura ,  Shunpei Yamazaki

Inventor： Hajime Kimura ,  Shunpei Yamazaki

IPC: H05K7/10 ,  H05K7/12

CPC classification number: G02F1/13452 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/133512 ,  G02F1/133514 ,  G02F1/1339 ,  G02F1/13394 ,  G02F1/1341 ,  G02F1/1368 ,  G09G3/20 ,  G09G3/2092 ,  G09G3/3614 ,  G09G2300/0408 ,  G09G2300/0426 ,  G09G2300/0439 ,  G09G2300/08 ,  G09G2310/0264 ,  G09G2320/043 ,  G09G2330/021 ,  G09G2330/08 ,  H01L27/1222 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/117 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/10136 ,  H05K2201/10166 ,  H01L2924/00

Abstract: If misalignment in a line width direction of an electrode (pad) of a connection terminal is caused in attachment of a substrate and an FPC, a connection area of the FPC terminal and the connection terminal becomes smaller and contact resistance is increased. In particular, an increase in contact resistance of the connection terminal to which a power supply potential serving as a power source is inputted is a cause of defective display. In view of the above, an object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Abstract translation: 如果在基板和FPC的安装中引起连接端子的电极（焊盘）的线宽方向的偏移，则FPC端子和连接端子的连接面积变小，接触电阻增加。 特别地，输入用作电源的电源电位的连接端子的接触电阻的增加是缺陷显示的原因。 鉴于上述，本发明的目的是降低电源线的电阻，以抑制电源线中的电压降，并且防止不良显示。 连接端子部分包括多个连接端子。 多个连接端子设置有作为连接端子的一部分的多个连接焊盘。 多个连接焊盘包括第一连接焊盘和具有不同于第一连接焊盘的线宽的第二连接焊盘。 多个连接垫之间的间距彼此相等。

公开(公告)号：US20100027228A1

公开(公告)日：2010-02-04

申请号：US12510028

申请日：2009-07-27

Applicant: Kiyotaka TSUKADA ,  Toshihiro NOMURA ,  Daisuke MINOURA

Inventor： Kiyotaka TSUKADA ,  Toshihiro NOMURA ,  Daisuke MINOURA

IPC: H01R9/00 ,  H05K3/30

CPC classification number: H05K1/145 ,  H01L24/01 ,  H01L24/25 ,  H01L2224/2518 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/284 ,  H05K3/306 ,  H05K2201/096 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10643 ,  H05K2201/10871 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49153 ,  H01L2924/00

Abstract: A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Abstract translation: 半导体器件包括各自具有绝缘板，导体电路和通孔的布线板，所述绝缘板具有顶表面和底表面，所述导体电路形成在顶表面和底表面上，所述通孔穿过绝缘板并电连接 顶表面和底表面的导体电路; 导体柱各自具有凸缘，头部和腿部，凸缘部分具有第一和第二表面，并且具有比通孔大的外径，头部从第一表面突出，腿部从第二表面突出 ; 以及各自具有形成在一个或多个表面上并连接到所述腿部的电极的电子部件。 插入头部直到凸缘部分的第一表面与布线板的底表面接触并且在通孔的内壁处电连接。

公开(公告)号：US07652358B2

公开(公告)日：2010-01-26

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

Inventor： Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

IPC: H01L23/495

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主衬底散热片，其中，辅助基板散热器和主衬底散热片彼此固定，使得在辅助衬底和主衬底之间存在预定的位置关系 。

公开(公告)号：US07632446B1

公开(公告)日：2009-12-15

申请号：US12128220

申请日：2008-05-28

Applicant: Michael A. Kindig

Inventor： Michael A. Kindig

IPC: B32B37/12 ,  B29C45/14

CPC classification number: H05K3/284 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10424 ,  H05K2201/2018 ,  H05K2203/1147

Abstract: Electrical components mounted onto a circuit board may be sealed within a frame tray upon the addition of a curable material that encapsulates the circuit board. The electrical components of the circuit board are positioned and sealed within the frame tray such that the cured material does not affect an airflow path which dissipates heat produced by the electrical components during use. The curing of the curable material shields the circuit board from moisture, dust and other environmental contaminates.

Abstract translation: 安装在电路板上的电气部件可以在加入封装电路板的可固化材料之后被密封在框架托盘内。 电路板的电气部件被定位和密封在框架托盘内，使得固化的材料不影响在使用期间散发由电气部件产生的热量的气流路径。 可固化材料的固化使电路板免受湿气，灰尘和其他环境污染。

公开(公告)号：US20090256161A1

公开(公告)日：2009-10-15

申请号：US12439451

申请日：2007-08-22

Applicant: Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

Inventor： Morimitsu Sekimoto ,  Hitoshi Haga ,  Kenichi Sakakibara ,  Reiji Kawashima ,  Abdallah Mechi ,  Toshiyuki Maeda

IPC: H01L29/24 ,  H01L23/34

CPC classification number: H01L25/16 ,  H01L23/647 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/4899 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/062 ,  H05K2201/09263 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2203/081 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion (20) including a chip (21) made of wide band gap semiconductor and a member (22, 23) having a heat resistant temperature equal to or higher than that of the chip (21); and a peripheral component (25) arranged in the vicinity of the chip portion (20) and having a heat resistant temperature lower than that of the chip (21). The chip (21) and the peripheral component (25) are thermally insulated from each other so that the temperature of the peripheral component (25) does not exceed the heat resistant temperature of the peripheral component (25).

Abstract translation: 在芯片由宽带隙半导体制成的情况下，可以获得能够防止耐热温度低的部件受到芯片产生的热量的热损伤的电力转换装置。 一种构造，包括：包括由宽带隙半导体制成的芯片（21）的芯片部分（20）和具有等于或高于芯片（21）的耐热温度的部件（22,23）; 以及布置在所述芯片部分（20）附近并且具有比所述芯片（21）的耐热温度低的耐热温度的外围部件（25）。 芯片（21）和周边部件（25）彼此绝热，使得周边部件（25）的温度不超过外围部件（25）的耐热温度。

公开(公告)号：US20090229957A1

公开(公告)日：2009-09-17

申请号：US12379796

申请日：2009-03-02

Applicant: Takeshi Nishimiya ,  Yutaka Matsunaga

Inventor： Takeshi Nishimiya ,  Yutaka Matsunaga

IPC: H01H9/02

CPC classification number: H02K7/145 ,  B25F5/008 ,  H01L2924/0002 ,  H02K11/33 ,  H05K1/0203 ,  H05K7/20463 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2924/00

Abstract: An electrical power tool may include a switching device capable of controlling output power of a motor, a circuit board supporting the switching device, and a metal case receiving the circuit board. The switching device includes a conductive part and an insulated portion that is covered by an insulating covering material. The conductive part of the switching device contacts the circuit board The insulated portion of the switching device contacts the metal case via the insulating covering material.

Abstract translation: 电动工具可以包括能够控制电动机的输出功率的开关装置，支撑开关装置的电路板以及接收电路板的金属壳体。 开关装置包括被绝缘覆盖材料覆盖的导电部分和绝缘部分。 开关装置的导电部分接触电路板开关装置的绝缘部分经由绝缘覆盖材料接触金属壳体。

公开(公告)号：US20090168368A1

公开(公告)日：2009-07-02

申请号：US12396108

申请日：2009-03-02

Applicant: Elio MARIONI

Inventor： Elio MARIONI

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract translation: 本发明涉及一种基本上包装状的分立电子部件，其类型包括主电源电路，主体或壳体，基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销，并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部，其具有至少一个从主体出来并放置在平面上的表面，而销从主体突出出来，第一部分最初平行于平面延伸。 有利的是，在第一部分平行于平面之后，一对销具有基本上U形的弯曲，以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

公开(公告)号：US20090122489A1

公开(公告)日：2009-05-14

申请号：US12153117

申请日：2008-05-14

Applicant: Tsutomu Tominaga ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Masaaki Tanigawa

Inventor： Tsutomu Tominaga ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Masaaki Tanigawa

IPC: H05K5/02 ,  H05K7/20

CPC classification number: B62D5/0406 ,  H05K3/32 ,  H05K7/142 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5). Accordingly, an electronic control device whose size and cost are reduced and whose electrical connection reliability is improved is obtained.

Abstract translation: 提供一种电子控制装置，包括：壳体（3），其在其两端部包括开口部分并由绝缘树脂制成; 附接到壳体（3）的一个端部的散热器（5）; 设置到所述散热器（5）的功率器件（2）; 电路板（4），其设置成与散热器（5）相对并形成有包括用于控制电力设备（2）的控制电路的电子电路; 以及保持在所述壳体（3）中的多个第一导电板（6），用于将所述电路板（4）与所述功率器件（2）电连接，其中所述多个第一导电板（6）中的每一个包括 压配合端子（6bp）压配合到形成在电路板（4）中的通孔（4a）中，以在与电路板（4）相对的表面上与电路板（4）接合，并与 在与散热器（5）相对的表面上的功率器件（2）的各个端子。 因此，获得了尺寸和成本降低并且电连接可靠性提高的电子控制装置。

公开(公告)号：US20090121342A1

公开(公告)日：2009-05-14

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

Inventor： Atsushi MINAKAWA ,  Mamoru SEKIYA ,  Norio UMEZU

IPC: H01L23/36 ,  H01L21/58

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主基板散热器，其中，辅助基板散热器和主基板散热器彼此固定，使得在子基板和主基板之间存在预定的位置关系 。

公开(公告)号：US20090108821A1

公开(公告)日：2009-04-30

申请号：US12044333

申请日：2008-03-07

Applicant: Martin Standing

Inventor： Martin Standing

IPC: G05F1/46

CPC classification number: H02M3/1584 ,  H01L2924/0002 ,  H02M3/00 ,  H05K1/0203 ,  H05K1/0231 ,  H05K1/056 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515 ,  H01L2924/00

Abstract: A voltage regulator module that includes components for a multi-phase converter, the converter including a plurality of power stage elements on one circuit board, a control element, driver elements, and elements for the output stages of the power stage elements on another circuit board.

Abstract translation: 一种电压调节器模块，其包括用于多相转换器的组件，所述转换器包括在一个电路板上的多个功率级元件，控制元件，驱动元件和用于另一电路板上的功率级元件的输出级的元件 。