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    Electronic Device or Circuit and Method for Fabricating the Same
    161.
    发明申请
    Electronic Device or Circuit and Method for Fabricating the Same 审中-公开
    电子设备或电路及其制造方法

    公开(公告)号：US20080259576A1

    公开(公告)日：2008-10-23

    申请号：US12089255

    申请日：2006-09-29

    Applicant: Mark Thomas Johnson ,  Adrianus Sempel ,  Franciscus Petrus Widdershoven

    Inventor： Mark Thomas Johnson ,  Adrianus Sempel ,  Franciscus Petrus Widdershoven

    IPC: H01L21/58 ,  H05K1/00

    CPC classification number: H05K1/189 ,  H05K1/028 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/052 ,  H05K2201/055

    Abstract: A method for fabricating an electronic device or circuit, respectively, comprises providing a flexible substrate (1), defining onto the flexible substrate (1) electric components (2, 3, 3′, 3″, 3′″, 7, 11, 12) and interconnects (8), introducing out breaks (4, 4′, 4″, 4a-4s) in the flexible substrate (1) between the electric components and/or interconnects, and forming the flexible substrate (1) into a deformed configuration by deforming, particularly folding, parts of the flexible substrate as determined by the breaks (4, 4′, 4″, 4a-4s).

    Abstract translation: 一种分别制造电子设备或电路的方法，包括提供柔性基板（1），其限定在柔性基板（1）上，电气部件（2,3,3'，3“，3”，7“ 11）和互连（8），在电气部件和/或互连之间引入柔性基板（1）中的断裂（4,4'，4“，4a-4s），并形成柔性基板 （4,4'，4“，4a-4s）确定的柔性基板的部分变形（特别是折叠）变形为变形构型。

    Probe device
    162.
    发明授权
    Probe device 失效
    探头设备

    公开(公告)号：US06731123B2

    公开(公告)日：2004-05-04

    申请号：US10233957

    申请日：2002-09-03

    Applicant: Gunsei Kimoto

    Inventor： Gunsei Kimoto

    IPC: G01R3102

    CPC classification number: G01R1/0408 ,  G01R1/07314 ,  H05K1/147 ,  H05K2201/052

    Abstract: A probe device is provided which solves a problem of connection between vertical probes assembled at a narrow pitch and connection terminals formed on a printed circuit board at a coarse pitch. For this purpose, the probe device comprises: a probe assembly made up of a plurality of regularly arrayed vertical probes; a flexible flat cable having metal lines formed and bonded to a surface of a non-conductive flexible film; and a fixing device for fixing one end of the flexible flat cable; wherein metal line terminals formed at the one end of the flexible flat cable secured to the fixing device are put in contact with the probe assembly, metal line terminals formed at the other end of the flexible flat cable are connected to a printed circuit board, and the semiconductor chip to be inspected and the printed circuit board are electrically connected together through the probe assembly and the flexible flat cable.

    Abstract translation: 提供一种探针装置，其解决了以窄间距组装的垂直探针与以粗间距形成在印刷电路板上的连接端子之间的连接问题。 为此，探针装置包括：由多个规则排列的垂直探针构成的探针组件; 柔性扁平电缆，其具有金属线，并形成并粘合到非导电性柔性膜的表面上; 以及用于固定柔性扁平电缆的一端的固定装置; 其中形成在固定于固定装置的柔性扁平电缆的一端的金属线端子与探针组件接触，形成在柔性扁平电缆的另一端的金属线端子连接到印刷电路板，并且 待检查的半导体芯片和印刷电路板通过探针组件和柔性扁平电缆电连接在一起。

    Method of making a wire harness
    164.
    发明授权
    Method of making a wire harness 失效
    制作线束的方法

    公开(公告)号：US5598627A

    公开(公告)日：1997-02-04

    申请号：US471168

    申请日：1995-06-06

    Applicant: Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

    Inventor： Kazuhito Saka ,  Masayoshi Hashimoto ,  Kou Furuta ,  Takahiro Okamura

    IPC: H01R12/62 ,  H05K1/11 ,  H05K3/10 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40 ,  H05K7/00 ,  H01R43/04

    CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/363 ,  H05K7/005 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/052 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10977 ,  H05K3/103 ,  H05K3/281 ,  H05K3/4092 ,  Y10T29/49117 ,  Y10T29/49181

    Abstract: A wire harness includes a main circuit part 1 including an insulated conductor wiring circuit plate 3 in which conductors 8 are arranged on a base insulation film 9 to form a wiring circuit by turning, bowing, crossing, or branching the conductors and covered with a flexible insulation film 12. Further, a branched connection part 2 is provided including a printed circuit plate 4 connected to a connecting area 14A in the main circuit part 1 through a connecting area 14B formed thereon and adapted to receive leading electrical wires 5. The conductor wiring circuit plate 30 is a flexible circuit plate which has an insulation base film 33, conductors 31 juxtaposed on the base film, an upper coverlet film 32, and a connecting area 36 for the conductors 31 having an adhesive layer 37 on the back side of the film 32. The connecting area 36 is formed by removing a predetermined width 38 of the base film 33 along the lateral direction of the coverlet film 32.

    Abstract translation: 线束包括主电路部分1，其包括绝缘导体布线电路板3，其中导体8布置在基底绝缘膜9上，以通过转动，弯曲，交叉或分支导体形成布线电路并且被覆盖有柔性 此外，分支连接部件2设置有印刷电路板4，印刷电路板4通过形成在其上的连接区域14B连接到主电路部分1中的连接区域14A，并且适于接收引导电线5.导体布线 电路板30是柔性电路板，其具有绝缘基膜33，并置在基膜上的导体31，上覆盖膜32和用于导体31的连接区域36，导体31在背面侧具有粘合层37 通过沿着覆盖膜32的横向除去基膜33的预定宽度38形成连接区域36。

    Stacked configuration for integrated circuit devices
    167.
    发明授权
    Stacked configuration for integrated circuit devices 失效
    集成电路设备的堆叠配置

    公开(公告)号：US5117282A

    公开(公告)日：1992-05-26

    申请号：US604883

    申请日：1990-10-29

    Applicant: Matthew M. Salatino

    Inventor： Matthew M. Salatino

    IPC: H01L23/40 ,  H05K1/00 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K7/02 ,  H05K7/20

    CPC classification number: H05K7/20509 ,  H05K1/189 ,  H05K7/023 ,  H01L2924/1627 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/052 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/3421

    Abstract: A stacked packaging assembly for a plurality of integrated circuit devices employs a web of flexible interconnect material folded into a `layered` arrangement of parallel web fingers onto which a plurality of integrated circuit devices are surface-mounted. The leads of the integrated circuit devices are attached to interconnect links of the flexible interconnect web. A plurality of heat sink plates are interleaved with the folded web fingers of the stack, so as to engage the integrated circuit devices mounted on the web fingers. The heat sink plates are retained by thermally conductive spacer blocks along their edges. The spacer blocks are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers.

    Abstract translation: 用于多个集成电路器件的堆叠式封装组件使用折叠成平行网状指状物的“分层”布置的柔性互连材料的腹板，多个集成电路器件被表面安装在该布置上。 集成电路器件的引线连接到柔性互连网的互连链路。 多个散热板与堆叠的折叠腹板指状物交错，以便与安装在腹板指状物上的集成电路装置接合。 散热板沿着其边缘由导热间隔块保持。 间隔块以紧凑的层叠结构夹紧在一起，以便形成刚性支撑件，其减轻了卷筒纸指状物折叠处的机械应力。

    Wiring module
    168.
    发明授权
    Wiring module 失效
    接线模块

    公开(公告)号：US4974121A

    公开(公告)日：1990-11-27

    申请号：US199878

    申请日：1988-05-27

    Applicant: Kazuhisa Masuko ,  Yosuke Ishiguro

    Inventor： Kazuhisa Masuko ,  Yosuke Ishiguro

    IPC: H02G3/00 ,  H05K1/09 ,  H05K1/11 ,  H05K3/36 ,  H05K3/46

    CPC classification number: H05K3/363 ,  H02G3/00 ,  H05K1/118 ,  H05K1/095 ,  H05K1/117 ,  H05K2201/048 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/2009 ,  H05K3/4644

    Abstract: A wiring module for electrically connecting a plurality of electric parts disposed on an equipment frame to a source of electric power, the module comprising an elongated insulating substrate formed to extend along a path adjacent to electric parts disposed on the frame. A pattern of wiring conductors extends along and integral with the insulating substrate for conducting electric current from the source of electric power to each of the electric parts to be connected. The insulating substrate has one or more edge portions provided with protrusions integrally formed with the substrate and extending laterally therefrom. The protrusions each are positioned on the insulating substrate at a location adjacent an electric part to be connected and at least a portion of the wiring conductors are integral with the protrusions to provide a contact on the protrusions for connection to corresponding electric parts.

    Abstract translation: 一种用于将设置在设备框架上的多个电气部件电连接到电力源的布线模块，所述模块包括细长绝缘基板，所述细长绝缘基板沿着邻近设置在所述框架上的电气部件的路径延伸。 布线导体的图案沿绝缘基板延伸并与绝缘基板一体化，以将电流从电源传导到要连接的每个电气部件。 所述绝缘基板具有设置有与所述基板一体形成并从其横向延伸的突起的一个或多个边缘部分。 突起各自位于绝缘基板上邻近要连接的电气部件的位置，并且布线导体的至少一部分与凸起成一体，以在突出部上提供与相应的电气部件连接的接触。

    Membrane type circuit having improved tail
    169.
    发明授权
    Membrane type circuit having improved tail 失效
    膜式电路具有改进的尾部

    公开(公告)号：US4561709A

    公开(公告)日：1985-12-31

    申请号：US559656

    申请日：1983-12-09

    Applicant: Kazutoyo Fukukura

    Inventor： Kazutoyo Fukukura

    IPC: H01R12/69 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K1/00 ,  H01R4/02

    CPC classification number: H01R12/69 ,  H05K1/118 ,  H01H2203/042 ,  H01H2207/004 ,  H05K1/095 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10363 ,  H05K2201/10946 ,  H05K3/326

    Abstract: Membrane type circuit comprises an insulating support having terminal sites thereon and circuit conductors extending between and among the terminal sites. A tail extends from the support and the conductors extend onto the tail and have output terminals on the tail. The tail is folded so that the output terminals on each side of the fold line are against each other and are connected to each other. Each pair of conductors which extends from two opposed output terminals are therefore a dual conductor. This arrangement simplifies circuit design and avoids the need for crossovers in many circumstances.

    Abstract translation: 膜式电路包括其上具有端子位置的绝缘支撑件和在端子之间和之间延伸的电路导体。 尾部从支撑件延伸出来，导体延伸到尾部并在尾部具有输出端子。 尾部被折叠，使得折叠线的每一侧的输出端子彼此相对并且彼此连接。 因此，从两个相对的输出端子延伸的每对导体因此是双导体。 这种布置简化了电路设计，并且在许多情况下避免了对交叉点的需要。

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