公开(公告)号：US20080225508A1

公开(公告)日：2008-09-18

申请号：US12071422

申请日：2008-02-21

Applicant: Yu-Nan Liu ,  Ching-Ching Chen

Inventor： Yu-Nan Liu ,  Ching-Ching Chen

IPC: H04M1/22 ,  F21V7/04

CPC classification number: H04M1/22 ,  H01H13/83 ,  H01H2219/056 ,  H01H2219/06 ,  H01H2219/062 ,  H05K1/0274 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10477 ,  H05K2201/2054

Abstract: A light-emitting device and an electronic device using the same are provided. The light-emitting device includes a light-guiding plate, a circuit board, at lease one light source unit and a reflective layer. The circuit board is disposed under the light-guiding plate. The reflective layer is disposed above the light-guiding plate. The light-guiding plate has at lease one hole. The light source unit is disposed on the circuit board and within the hole. The reflective layer is disposed above the hole. The light-emitting device is disposed on one side of a part, such as a keypad, of the electronic device for providing light to the keypad.

Abstract translation: 提供了一种发光装置和使用其的电子装置。 发光装置包括导光板，电路板，至少一个光源单元和反射层。 电路板设置在导光板的下方。 反射层设置在导光板的上方。 导光板至少有一个孔。 光源单元设置在电路板上和孔内。 反射层设置在孔的上方。 发光装置设置在用于向键盘提供光的电子装置的诸如键盘的部件的一侧上。

公开(公告)号：US20080174972A1

公开(公告)日：2008-07-24

申请号：US11625426

申请日：2007-01-22

Applicant: Hakan Bygdo ,  Per Holmberg

Inventor： Hakan Bygdo ,  Per Holmberg

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: An electronic device is provided that includes a main printed circuit board (PCB) having a top surface, a bottom surface, and a hole extending between the top surface and the bottom surface. The electronic device further includes a module PCB having at least one electrical component mounted on a top surface of the module PCB, wherein the module PCB is inverted and assembled adjacent the main PCB such that the top surface of the module PCB faces the top surface of the main PCB, and the at least one electrical component extends into the hole. In addition, the electronic device includes a cover on the bottom surface of the main PCB that substantially covers the hole.

Abstract translation: 提供了一种电子设备，其包括具有顶表面，底表面和在顶表面和底表面之间延伸的孔的主印刷电路板（PCB）。 电子设备还包括具有安装在模块PCB的顶表面上的至少一个电气部件的模块PCB，其中模块PCB被倒置并组装在主PCB附近，使得模块PCB的顶表面面向 主PCB，并且至少一个电气部件延伸到孔中。 此外，电子设备包括基本上覆盖孔的主PCB底面上的盖。

公开(公告)号：US20080158834A1

公开(公告)日：2008-07-03

申请号：US11952406

申请日：2007-12-07

Applicant: Tomohide Ogura ,  Motoyoshi Kitagawa

Inventor： Tomohide Ogura ,  Motoyoshi Kitagawa

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K3/3463 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10371 ,  H05K2201/10477 ,  H05K2203/1572

Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

Abstract translation: 模块包括：具有设置在其中的通孔的板，设置在板的下表面上的辅助板，安装在板的上表面上的第一电子部件，覆盖第一电子部件的导电盖， 电子部件安装在辅助板的上表面上。 辅助板包括密封通孔的密封部分。 第二电子部件定位在设置在板中的通孔中和辅助板的上表面上。 第二电子部件比第一电子部件高。 这个模块很薄。

公开(公告)号：US20070128893A1

公开(公告)日：2007-06-07

申请号：US11474432

申请日：2006-06-26

Applicant: Chia-Jung Wu ,  Che-Chih Chang

Inventor： Chia-Jung Wu ,  Che-Chih Chang

IPC: H01R12/00

CPC classification number: H05K3/363 ,  H05K2201/048 ,  H05K2201/09081 ,  H05K2201/10477 ,  Y10T29/49126

Abstract: A circuit board module and a forming method thereof are provided. The circuit board module includes a first circuit board, a second circuit board and a conductive structure. The first circuit board has a first surface, a second surface and an opening. The opening passes through the first surface and the second surface. The first surface has a first solder pad. The second circuit board has a second solder pad. Part of the second circuit board passes through the opening from the first surface to the second surface, so that part of the second solder pad is exposed on the first surface. The conductive structure is electrically connected to the first solder pad and the second solder pad, so that the first circuit board is electrically connected to the second circuit board.

Abstract translation: 提供一种电路板模块及其形成方法。 电路板模块包括第一电路板，第二电路板和导电结构。 第一电路板具有第一表面，第二表面和开口。 开口穿过第一表面和第二表面。 第一表面具有第一焊盘。 第二电路板具有第二焊盘。 第二电路板的一部分从第一表面穿过开口到第二表面，使得第二焊盘的一部分暴露在第一表面上。 导电结构电连接到第一焊盘和第二焊盘，使得第一电路板电连接到第二电路板。

公开(公告)号：US20070098910A1

公开(公告)日：2007-05-03

申请号：US11580683

申请日：2006-10-13

Applicant: Makoto Yamagata ,  Hiroaki Kurihara ,  Naoya Yasui ,  Noriaki Iwata

Inventor： Makoto Yamagata ,  Hiroaki Kurihara ,  Naoya Yasui ,  Noriaki Iwata

IPC: B05D7/00 ,  B05D1/36 ,  B32B3/00 ,  B32B7/00 ,  B32B15/00

CPC classification number: H05K1/09 ,  C25D1/04 ,  H05K1/0393 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/10477 ,  H05K2203/0307 ,  Y10T428/24917

Abstract: An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 μm and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 μm.

Abstract translation: 本发明的目的是提供一种使用电镀铜箔的柔性覆铜层压板等，其具有比市面上提供的常规小型电沉积铜箔更低的轮廓和更高的机械强度。 为了实现该目的，通过将电解铜箔层压到树脂膜上制造的柔性覆铜层压板，其特征在于，电沉积铜箔的沉积表面包括具有表面粗糙度（Rzjis）的低轮廓光泽表面， 采用不大于1.5μm，亮度（Gs（60°））不小于400，沉积表面和树脂膜粘合在一起。 并且，使用柔性覆铜层叠体，可以容易地制造作为COF带等的薄膜载带的柔性印刷布线板，其中所形成的布线具有间距不大于35的细间距布线 妈妈

公开(公告)号：US20070095471A1

公开(公告)日：2007-05-03

申请号：US11580165

申请日：2006-10-13

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: B32B37/00

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。

公开(公告)号：US20070000970A1

公开(公告)日：2007-01-04

申请号：US11475876

申请日：2006-06-28

Applicant: Hiroto Sugahara

Inventor： Hiroto Sugahara

IPC: A47J36/02

CPC classification number: H05K3/361 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/81 ,  H01L24/82 ,  H01L2224/1624 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/811 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/0032 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/013 ,  H01L2924/00

Abstract: For electrically connecting a wiring formed on one surface of an insulating substrate such as an FPC to an individual electrode arranged facing the other surface of the substrate, firstly, a through hole and a notch are formed by irradiating a laser beam from above onto the FPC. Next, the FPC is arranged to be positioned such that the individual electrode, the through hole and the notch are overlapped in a plan view. Next, an electroconductive liquid droplet having a diameter greater than a width of the notch is jetted, toward an area formed with the notch, from the one surface side of the FPC. The landed electroconductive liquid droplet flows along the notch in a thickness direction of the substrate due to an action of a capillary force and reaches assuredly to the individual electrode, thereby electrically connecting the wiring and electrode arranged sandwiching the insulating substrate assuredly.

Abstract translation: 为了将形成在诸如FPC的绝缘基板的一个表面上的布线电连接到与基板的另一表面相对布置的单独电极，首先通过从上方将激光束照射到FPC上而形成通孔和凹口 。 接下来，将FPC布置成使得各个电极，通孔和凹口在平面图中重叠。 接下来，从FPC的一个表面侧向具有凹口的区域喷射直径大于凹口宽度的导电液滴。 着陆的导电液滴由于毛细管力的作用而沿着基板的厚度方向沿着切口流动，并且确实地到达各个电极，从而可靠地将布线和电极布置在绝缘基板上。

公开(公告)号：US20060138648A1

公开(公告)日：2006-06-29

申请号：US11305282

申请日：2005-12-16

Applicant: Seung-Duk Baek ,  Sun-Won Kang ,  Dong-Ho Lee ,  Jong-Joo Lee ,  Sang-Wook Park

Inventor： Seung-Duk Baek ,  Sun-Won Kang ,  Dong-Ho Lee ,  Jong-Joo Lee ,  Sang-Wook Park

IPC: H01L23/34

CPC classification number: H01L25/105 ,  H01L23/3107 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1005 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19107 ,  H05K1/181 ,  H05K3/284 ,  H05K3/305 ,  H05K3/328 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package module having no solder balls and a method of manufacturing the semiconductor package module are provided. The semiconductor package module includes a module board on which a plurality of semiconductor devices are able to be mounted, a semiconductor package bonded on the module board using an adhesive, being wire-bondable to the module board, and having already undergone an electrical final test, second wires electrically connecting second bond pads of the semiconductor package to bond pads of the module board; and a third sealing resin enclosing the second wires and the semiconductor package. Because the semiconductor package module does not use solder balls, degradation of solder joint reliability (SJR) can be prevented. Further, the use of a semiconductor package that has already undergone an electrical test can reduce degradation of the yield of a completed semiconductor package module.

Abstract translation: 提供一种不具有焊球的半导体封装模块和制造该半导体封装模块的方法。 该半导体封装模块包括：模块板，多个半导体器件能够安装在该模块板上;半导体封装，使用粘合剂结合在模块板上，可与模块板接合，并且已经经过电气最终测试 ，将所述半导体封装的第二接合焊盘与所述模块板的焊盘电连接的第二布线; 以及封装第二导线和半导体封装的第三密封树脂。 由于半导体封装模块不使用焊球，因此可以防止焊点可靠性（SJR）的劣化。 此外，使用已经经历电测试的半导体封装可以降低完成的半导体封装模块的产量的劣化。

公开(公告)号：US20060126294A1

公开(公告)日：2006-06-15

申请号：US11009173

申请日：2004-12-10

Applicant: Barrett Faneuf ,  Tomm Aldridge

Inventor： Barrett Faneuf ,  Tomm Aldridge

IPC: H05K7/20

CPC classification number: G06Q30/0601 ,  F28D15/0266 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/141 ,  H05K7/1092 ,  H05K7/20309 ,  H05K2201/064 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/00

Abstract: According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first contact surface and a second electrical component coupled to transmit heat to the second contact surface.

Abstract translation: 根据一些实施例，冷却装置可以包括将热量传递到冷却介质的第一和第二接触表面。 在一些实施例中，冷却装置还可以包括耦合以将热传递到第一接触表面的第一电气部件和耦合以将热传递到第二接触表面的第二电气部件。

公开(公告)号：US07007833B2

公开(公告)日：2006-03-07

申请号：US10643766

申请日：2003-08-18

Applicant: John Mackay ,  Tom Molinaro

Inventor： John Mackay ,  Tom Molinaro

IPC: B23K37/02

CPC classification number: B23K35/22 ,  B23K1/0016 ,  B23K3/0623 ,  B23K3/0638 ,  B23K3/087 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/224 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13011 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/1613 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/3484 ,  H05K2201/10477 ,  H05K2203/0113 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/085 ,  H05K2203/1581 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.