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    Methods and apparatuses for thermal dissipation
    171.
    发明授权
    Methods and apparatuses for thermal dissipation 有权
    散热方法和装置

    公开(公告)号：US07388753B2

    公开(公告)日：2008-06-17

    申请号：US11403562

    申请日：2006-04-12

    Applicant: Ping Liu ,  Min Li

    Inventor： Ping Liu ,  Min Li

    IPC: H05K7/20 ,  H01L23/36

    CPC classification number: H05K1/0209 ,  G06F1/203 ,  H05K2201/066 ,  H05K2201/09309 ,  H05K2201/09318 ,  H05K2201/10446

    Abstract: A method and apparatus for providing thermal dissipation from a PC card is disclosed. For one embodiment of the invention, an extension portion, having a heat sink implemented thereon, is provided for a PC card. The extension portion extends beyond the PC card slot allowing thermal dissipation from the card due to air flow over the heat sink. For one embodiment of the invention, heat producing components of the PC card are identified and a thermally conductive path is provided from the components to the extension portion of the PC card.

    Abstract translation: 公开了一种用于从PC卡提供散热的方法和装置。 对于本发明的一个实施例，为PC卡提供了具有其上实现的散热器的延伸部分。 延伸部分延伸超出PC卡槽，由于空气流过散热器，可以从卡散热。 对于本发明的一个实施例，识别出PC卡的发热部件，并且从部件到PC卡的延伸部分提供导热路径。

    MULTI-LAYER FLEXIBLE FILM PACKAGE AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME
    174.
    发明申请
    MULTI-LAYER FLEXIBLE FILM PACKAGE AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME 有权
    多层柔性膜片和液晶显示装置，包括它们

    公开(公告)号：US20080024714A1

    公开(公告)日：2008-01-31

    申请号：US11779369

    申请日：2007-07-18

    Applicant: Joo-hwan Park

    Inventor： Joo-hwan Park

    IPC: G02F1/1343 ,  H01L23/50

    CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L23/552 ,  H01L23/60 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/189 ,  H05K2201/0715 ,  H05K2201/09318 ,  H05K2201/10681 ,  H01L2924/00

    Abstract: A multi-layer flexible film package which shields electromagnetic waves, prevents electrostatic discharge, and at the same time, performs a heat radiation function, and a liquid crystal display device having the same, include an insulating film having circuit patterns and internal ground wiring lines at a first side thereof, an insulating layer formed on the circuit patterns and the internal ground wiring lines, a driver integrated circuit (“IC”) electrically connected to the circuit patterns and the internal ground wiring lines, a ground layer formed on a second side opposite the first side of the insulating film and connected to the internal ground wiring lines, and via holes formed through the insulating film and electrically connecting the internal ground wiring lines and the ground layer.

    Abstract translation: 一种屏蔽电磁波的多层柔性膜封装，防止静电放电，同时进行放热功能，具有这种功能的液晶显示装置包括具有电路图案和内部接地布线的绝缘膜 在其第一侧上形成在电路图案和内部接地布线上的绝缘层，电连接到电路图案和内部接地布线的驱动器集成电路（“IC”），形成在第二侧上的接地层 与绝缘膜的第一侧相对并连接到内部接地布线，以及通过绝缘膜形成的通孔，并电连接内部接地布线和接地层。

    Magnetic disk drive having a suspension mounted transmission line including read and write conductors and a lower conductor
    175.
    发明授权
    Magnetic disk drive having a suspension mounted transmission line including read and write conductors and a lower conductor 失效
    磁盘驱动器具有悬挂安装的传输线，包括读写导体和下导体

    公开(公告)号：US07319573B2

    公开(公告)日：2008-01-15

    申请号：US10870573

    申请日：2004-06-16

    Applicant: Nobumasa Nishiyama

    Inventor： Nobumasa Nishiyama

    IPC: G11B5/48

    CPC classification number: H05K1/0253 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B33/08 ,  H05K1/0245 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09318

    Abstract: Embodiments of the invention provide a magnetic disk drive which has improved electrical properties owing to a reduction in the loss of transmission line, improved vibration properties owing to a reduction in the stiffness of wiring around the head, and a flat impedance in the transmission line. In one embodiment, a magnetic disk drive comprises a suspension; a magnetic head coupled with the suspension and configured to write and read information to and from a magnetic recording medium; and a transmission line disposed on the suspension to transmit writing and reading information to and from the magnetic head. The transmission line includes a writing line and a reading line, a lower conductor disposed underneath the writing line and the reading line, and an insulating layer interposed between the lower conductor and the writing and reading lines. The lower conductor comprises copper or copper-based alloy and has a thickness of substantially less than 25 μm, desirably about 2-12 μm, and more desirably about 5 μm.

    Abstract translation: 本发明的实施例提供了一种磁盘驱动器，其由于传输线损耗的减少，由于头部周围的布线刚度的降低以及传输线中的平坦阻抗而导致的改善的振动特性而具有改善的电性能。 在一个实施例中，磁盘驱动器包括悬架; 磁头与所述悬架耦合并被配置为向磁记录介质写入和读取信息; 以及设置在所述悬架上的传输线，用于向所述磁头发送写入信息和从所述磁头读取信息。 传输线包括写入线和读取线，设置在写入线和读取线下方的下部导体以及插入在下部导体和写入和读取线之间的绝缘层。 下导体包括铜或铜基合金，其厚度基本上小于25μm，理想的是约2-12μm，更理想的是约5μm。

    Circuit board
    176.
    发明申请
    Circuit board 审中-公开
    电路板

    公开(公告)号：US20070217173A1

    公开(公告)日：2007-09-20

    申请号：US11447866

    申请日：2006-06-07

    Applicant: Daisuke Mizutani ,  Tatsuhiko Tajima

    Inventor： Daisuke Mizutani ,  Tatsuhiko Tajima

    IPC: H05K7/00

    CPC classification number: H05K9/0016 ,  H05K1/116 ,  H05K1/162 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/09672

    Abstract: The circuit board comprises a through-hole via which is formed in a through-hole passed through a substrate and includes a via portion electrically connected to a part of a plurality of interconnection layers at the inside wall of the through-hole and a pad portion formed on a surface of the substrate in a region surrounding the through-hole and is connected to the via portion. In the circuit board, an opening is formed for passing through the through-hole via out of connection with a constant-voltage interconnection layer in the region where the through-holes is formed. The constant-voltage interconnection layer is the interconnection layer nearest to the pad portion, and an outer diameter of the pad portion is larger than a diameter of the opening formed in the constant-voltage interconnection layer, whereby a capacitor including the pad portion and the constant-voltage interconnection layer as a pair of electrodes is formed.

    Abstract translation: 电路板包括通孔，该通孔形成在通过基板的通孔中，并且包括通孔部分，电连接到通孔内壁上的多个互连层的一部分，以及焊盘部分 在围绕通孔的区域中形成在基板的表面上并连接到通孔部分。 在电路板中，形成有用于在形成通孔的区域中通过与恒压互连层连接的通孔的开口。 恒压互连层是最靠近焊盘部分的互连层，并且焊盘部分的外径大于形成在恒压互连层中的开口的直径，由此，包括焊盘部分和 形成作为一对电极的恒压互连层。

    Circuit structure of package substrate
    179.
    发明授权
    Circuit structure of package substrate 有权
    封装衬底的电路结构

    公开(公告)号：US07193324B2

    公开(公告)日：2007-03-20

    申请号：US10905803

    申请日：2005-01-21

    Applicant: Chi-Hsing Hsu

    Inventor： Chi-Hsing Hsu

    IPC: H01L23/48

    CPC classification number: H05K1/0265 ,  H01L23/49822 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K3/107 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09736 ,  H01L2924/00

    Abstract: A circuit structure for a package substrate or a circuit board is provided. The circuit structure has a dielectric layer with an upper surface and a lower surface, at least a first line and at least a second line. The first line is disposed on the dielectric layer on which a base of the first line is aligned with the upper surface. In addition, the second line is disposed on the dielectric layer on which a base of the second line is embedded below the upper surface. Since the second line is embedded into the dielectric layer, the distance with a reference plane is reduced and the crosstalk between the signals is further effectively reduced.

    Abstract translation: 提供了一种用于封装基板或电路板的电路结构。 电路结构具有具有上表面和下表面的电介质层，至少第一线和至少第二线。 第一线设置在第一线的基底与上表面对准的电介质层上。 此外，第二线设置在第二线的基底嵌入其上表面的电介质层上。 由于第二行被嵌入到介电层中，所以与参考平面的距离减小，并且信号之间的串扰被进一步有效地降低。

    WIRELESS DEVICE WITH DISTRIBUTED LOAD
    180.
    发明申请
    WIRELESS DEVICE WITH DISTRIBUTED LOAD 有权
    具有分布负载的无线设备

    公开(公告)号：US20070052596A1

    公开(公告)日：2007-03-08

    申请号：US11210324

    申请日：2005-08-24

    Applicant: Hongwei Liu ,  Adrian Napoles ,  Benjamin White

    Inventor： Hongwei Liu ,  Adrian Napoles ,  Benjamin White

    IPC: H01Q1/24

    CPC classification number: H01Q1/243 ,  H01Q9/42 ,  H04M1/0214 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/14 ,  H05K1/148 ,  H05K2201/09318

    Abstract: A wireless device (100) includes a first circuit board (102), a second circuit board (104), and a distributed load (106) having an inductive coupling (112) and a capacitive coupling (114). The inductive coupling (112) and the capacitive coupling (114) form a parallel resonance at predefined frequencies of interest. The second circuit board (104) includes an antenna (116) for receiving and transmitting radio waves.

    Abstract translation: 无线设备（100）包括第一电路板（102），第二电路板（104）和具有电感耦合（112）和电容耦合（114）的分布式负载（106）。 电感耦合（112）和电容耦合（114）在感兴趣的预定频率处形成并联谐振。 第二电路板（104）包括用于接收和发送无线电波的天线（116）。

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