公开(公告)号：US11982704B2

公开(公告)日：2024-05-14

申请号：US17216708

申请日：2021-03-30

Applicant: E Ink Holdings Inc.

Inventor： Ruei-Huan Rao ,  Te-Lung Cheng

IPC: G01R31/28 ,  H05K1/11

CPC classification number: G01R31/2812 ,  H05K1/111 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/10287

Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.

公开(公告)号：US20240145957A1

公开(公告)日：2024-05-02

申请号：US18372188

申请日：2023-09-25

Applicant: Japan Aviation Electronics Industry, Ltd.

Inventor： Osamu HASHIGUCHI

IPC: H01R12/71 ,  H01R12/73 ,  H05K1/14

CPC classification number: H01R12/716 ,  H01R12/73 ,  H05K1/141 ,  H05K2201/09409

Abstract: A connector according to the present disclosure includes a housing, and a plurality of contacts held in the housing. When a direction in which an input-output board and a CPU board are opposed to each other is called a board opposing direction, each contact includes a holding part, a connecting part, and a spring part. The holding part is extended in a board opposing direction and is held on a housing by press fitting. The spring part includes a contact part, an extended part, and a projection part. The projection part is extended in the board opposing direction and is opposed to the holding part. The connecting part connects an end part of the projection part on the side of the input-output board to an end part of the holding part on the side of the input-output board.

公开(公告)号：US20240032194A1

公开(公告)日：2024-01-25

申请号：US17871672

申请日：2022-07-22

Applicant: Dell Products L.P.

Inventor： EDUARDO ESCAMILLA ,  Matthew Dang ,  James Utz

IPC: H05K1/11 ,  H01R13/11 ,  H01R12/72

CPC classification number: H05K1/117 ,  H01R13/11 ,  H01R12/721 ,  H05K2201/09409 ,  H05K2201/09145

Abstract: Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, hardware resources available to data processing systems may be customized. The hardware resources may be customized through addition or replacement of interchangeable hardware components. The interchangeable hardware components may include features that may improve the likelihood of successfully adding or replacing the interchangeable hardware components.

公开(公告)号：US20230199952A1

公开(公告)日：2023-06-22

申请号：US18066473

申请日：2022-12-15

Applicant: Exro Technologies Inc.

Inventor： Eric HUSTEDT

IPC: H05K1/11 ,  H05K1/18 ,  H02M7/00

CPC classification number: H05K1/111 ,  H05K1/181 ,  H02M7/003 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: An article for a power inverter, includes a multilayer printed circuit board having a first and second electrically conductive wiring layer and at least a first dielectric layer interposed between the first and second electrically conductive wiring layers. Each conductive wiring layer includes a common input and output line, the common input and output lines at least partially overlapping one another in a projection along a thickness of the multilayer printed circuit board. A set of input mounting pads is carried by the first common input line and a set of input mounting pads is carried by the second common input line, the input mounting pads of the second set of input mounting pads are interleaved with the input mounting pads of the first set of input mounting pads along a first axis. The article further includes a set output mounting pads carried by the common output line.

公开(公告)号：US11650465B2

公开(公告)日：2023-05-16

申请号：US17137283

申请日：2020-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Sujeong Kim ,  Hanho Park ,  Sangwon Yeo ,  Daegeun Lee ,  Joonsam Kim

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/32 ,  H01L51/00 ,  H05K1/11 ,  G06F3/044

CPC classification number: G02F1/13458 ,  H01L24/06 ,  H01L27/323 ,  H01L27/3255 ,  H01L27/3276 ,  H01L51/0097 ,  G06F3/044 ,  H01L2224/0217 ,  H01L2224/0603 ,  H01L2224/0605 ,  H01L2224/06132 ,  H01L2251/5338 ,  H01L2924/12044 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10128

Abstract: A display device including a display panel including a base layer, a circuit layer disposed on the base layer, and a pad part having a plurality of pads disposed on the base layer; and a driving chip disposed on the pad part and including a plurality of chip pads. The plurality of pads include a first pad having a smaller area than a corresponding chip pad among the plurality of chip pads and a second pad electrically connected to the circuit layer.

公开(公告)号：US11646056B2

公开(公告)日：2023-05-09

申请号：US17527027

申请日：2021-11-15

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

Inventor： Yuki Sato

IPC: G11B5/48 ,  H05K1/11 ,  H01R12/61 ,  H01R4/04

CPC classification number: G11B5/4853 ,  G11B5/486 ,  H01R12/61 ,  H05K1/116 ,  H05K1/118 ,  H01R4/04 ,  H01R2201/06 ,  H05K2201/09227 ,  H05K2201/09409

Abstract: A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

公开(公告)号：US20190244887A1

公开(公告)日：2019-08-08

申请号：US16390701

申请日：2019-04-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hsien-Wei Chen

IPC: H01L23/498 ,  H05K3/40 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H01L25/065 ,  H01L25/10 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1144 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1712 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/181 ,  H05K3/40 ,  H05K2201/09409 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Packaging methods for semiconductor devices and methods of packaging thereof are disclosed. In some embodiments, a device includes a packaging apparatus and contact pads disposed on the packaging apparatus. The contact pads are arranged in an array of rows and columns. The contact pads include first contact pads proximate a perimeter region of the packaging apparatus and second contact pads disposed in an interior region of the packaging apparatus. A dam structure that is continuous is disposed around the second contact pads. The contact pads comprise a mounting region for a semiconductor device.

公开(公告)号：US20180277970A1

公开(公告)日：2018-09-27

申请号：US15923490

申请日：2018-03-16

Applicant: Verily Life Sciences LLC

Inventor： Kedar Shah

IPC: H01R12/52 ,  H01R13/24 ,  H01R13/52 ,  H01R43/20 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00 ,  H05K3/40 ,  H05K3/36 ,  A61B5/00 ,  A61B5/04 ,  A61B17/34 ,  A61N1/05

CPC classification number: H01R12/52 ,  A61B5/0031 ,  A61B5/04001 ,  A61B5/14503 ,  A61B5/14532 ,  A61B5/6846 ,  A61B5/686 ,  A61B17/3468 ,  A61B2560/063 ,  A61B2562/0209 ,  A61B2562/16 ,  A61B2562/227 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/3752 ,  A61N1/3754 ,  H01R12/7082 ,  H01R12/714 ,  H01R13/2414 ,  H01R13/2421 ,  H01R13/521 ,  H01R13/5219 ,  H01R43/205 ,  H01R2201/12 ,  H05K1/02 ,  H05K1/112 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4038 ,  H05K5/0056 ,  H05K5/006 ,  H05K5/0095 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/09163 ,  H05K2201/09409 ,  H05K2201/10265 ,  H05K2201/10371 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An implantable connector for connecting an electronics package and a neural interface is described. The connection between the electronics package and the neural interface is made by way of a set of compressible contacts (e.g., springs) that physical contact a set of corresponding exposed bond pads. The compressible contacts are held in compression with the exposed bond pads using a mechanical coupler. The compressible contacts are physically separated and electrically isolated from each other by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

公开(公告)号：US20180264519A1

公开(公告)日：2018-09-20

申请号：US15757170

申请日：2016-08-19

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Wojtek Sudol

IPC: B06B1/02 ,  A61B8/12 ,  B81C1/00 ,  H05K3/34 ,  A61B8/00 ,  H01L23/00 ,  H01R12/62 ,  H01R43/20 ,  H01R9/05

CPC classification number: B06B1/0292 ,  A61B8/12 ,  A61B8/4483 ,  B06B1/02 ,  B81C1/00349 ,  H01L24/46 ,  H01L2924/19105 ,  H01R9/0515 ,  H01R12/62 ,  H01R43/205 ,  H05K3/3421 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/613

Abstract: An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

公开(公告)号：US20180263109A1

公开(公告)日：2018-09-13

申请号：US15920413

申请日：2018-03-13

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： CHIN-YU CHEN ,  CHENG-WEN CHEN ,  SHUN-JUNG CHUANG ,  KE-HAO CHEN

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0225 ,  H01R12/707 ,  H01R12/716 ,  H01R12/78 ,  H01R13/20 ,  H05K1/0221 ,  H05K1/0222 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/10189

Abstract: A multi-layer circuit member includes: a first layer formed of a conductive material, the first layer including plural signal pads and a first reference plane spaced apart from the signal pads, the first reference plane including an outer region surrounding the signal pads and an inner region separating the plurality of signal pads; a second layer formed of a conductive material, the second layer including plural signal conductors and a second reference plane spaced apart from the signal conductors, the second reference plane including an outer region surrounding the signal conductors and an inner region separating the signal conductors; a ground layer disposed at a side of the second layer opposite from the first layer; plural dielectric layers separating the first layer, the second layer, and the ground layer.