公开(公告)号：US09735509B2

公开(公告)日：2017-08-15

申请号：US14799046

申请日：2015-07-14

Applicant: ADC Telecommunications, Inc. ,  Tyco Electronics Corporation

Inventor： Joseph C. Coffey ,  Christine Anne Dooley

IPC: H01R13/6466 ,  H05K1/11 ,  H05K1/18 ,  H01R24/64

CPC classification number: H01R13/6466 ,  H01R24/64 ,  H05K1/0216 ,  H05K1/0245 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10212

Abstract: A capacitive coupling system includes a plurality of conductive pads situated on a dielectric layer. A plurality of switches are connected between pairs of the conductive pads via conductive linkages. The switches are operable to selectively connect selected pairs of the conductive pads to selectively adjust capacitances between conductor pairs of an electrical connector.

公开(公告)号：US09730316B2

公开(公告)日：2017-08-08

申请号：US14621061

申请日：2015-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang-Kee Kim

IPC: H05K7/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K1/16 ,  H01H13/702

CPC classification number: H05K1/0278 ,  H01H13/702 ,  H01H2205/016 ,  H01H2225/028 ,  H05K1/16 ,  H05K1/184 ,  H05K3/46 ,  H05K3/4697 ,  H05K2201/10053

Abstract: A mobile device and a method of manufacturing a mobile device are disclosed. An aspect of the present invention provides a mobile device, which includes: a multi-layer circuit board including a plurality of circuit pattern layers and a plurality of dielectric layers and having a cavity formed on a lateral surface thereof toward an inside thereof; an electrode pad laminated in the cavity and configured to be electrically connected with the circuit pattern layers; and a conductive switch formed on an external peripheral portion of the cavity of the multi-layer circuit board in such a way that the conductive switch is separated from the electrode pad and is contactable with the electrode pad by an external force.

公开(公告)号：US20170164465A1

公开(公告)日：2017-06-08

申请号：US15325550

申请日：2015-06-17

Applicant: Siemens Aktiengesellschaft

Inventor： Ruediger Knofe ,  Bernd Mueller ,  Andrey Prihodovsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/0212 ,  H05K1/095 ,  H05K1/11 ,  H05K1/167 ,  H05K3/30 ,  H05K3/321 ,  H05K3/325 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/06 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10689 ,  H05K2203/1115 ,  H05K2203/165

Abstract: A method for producing or disassembling an electronic assembly are provided. The assembly may have a heating device integrated into a substrate. The heating device can be heated via an external power supply during the assembly process so that, for example, solder connections of an electric component can be melted. The heating device can also be used when operating the electronic assembly, and the heating device can then be directly actuated by the component. For this purpose, an electric connection is then established between the component and the heating device, the connection not yet being provided during the thermal assembly process in order to protect the electronic components of the circuit from being damaged.

公开(公告)号：US09659127B2

公开(公告)日：2017-05-23

申请号：US14613855

申请日：2015-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-yeol Jung ,  Sang-ho Lee ,  Jeong-nam Cheon ,  Seung-hun Park

IPC: G06F17/50 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L23/50 ,  H01L25/16 ,  H05K1/11

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  G06F17/5063 ,  G06F17/5081 ,  G06F2217/82 ,  H01L23/50 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic apparatus includes a user interface to receive an input selecting a plurality of circuit devices, a storage to store electrical current information and a Scattering parameter regarding input/output ports of the plurality of circuit devices, respectively, a calculator to calculate impedance per number of de-coupling capacitors based on the stared S-parameters and to calculate an accumulated noise value per number of the decoupling capacitors based on the calculated impedance and the electrical current information, and a controller to determine a number of the de-coupling capacitors based on the calculated accumulated noise values and to control the user interface to display the determined number of the de-coupling capacitors.

公开(公告)号：US09652049B2

公开(公告)日：2017-05-16

申请号：US14640313

申请日：2015-03-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon Song ,  Jungje Bang ,  Kicheol Bae ,  Kwangsub Lee ,  Seyoung Jang

IPC: H01R24/00 ,  G06F3/02 ,  H01H13/48 ,  H01R13/703 ,  H05K1/18 ,  H01R24/62

CPC classification number: G06F3/0202 ,  H01H13/48 ,  H01H2215/004 ,  H01H2215/036 ,  H01H2221/05 ,  H01R13/703 ,  H01R24/62 ,  H05K1/184 ,  H05K2201/09163 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537

Abstract: An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.

公开(公告)号：US09564272B2

公开(公告)日：2017-02-07

申请号：US14574903

申请日：2014-12-18

Applicant: Lexmark International, Inc.

Inventor： Keith Bryan Hardin ,  Zachary Charles Nathan Kratzer ,  Qing Zhang

IPC: H05K3/30 ,  H01G4/33 ,  H05K1/18 ,  H01G4/35 ,  H05K1/02 ,  H05K3/40

CPC classification number: B29C47/0066 ,  B28B3/20 ,  B28B11/16 ,  B29C47/0004 ,  B29C47/0035 ,  B29K2995/0005 ,  B29K2995/0007 ,  B29L2031/3425 ,  H01G4/33 ,  H01G4/35 ,  H05K1/0221 ,  H05K1/0231 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/30 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/10015 ,  H05K2201/10053 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

Abstract translation: 根据一个示例性实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括根据Z定向部件的结构同时挤压多种材料以形成挤出物体并形成 来自挤压物体的Z向分量。 在一个实施例中，将挤出的物体分成单独的Z向分量。 在一个实施例中，改变其中一个材料的预定部分之间的挤压定时，以便交错挤出物体中的部分。

公开(公告)号：US09515652B2

公开(公告)日：2016-12-06

申请号：US14606447

申请日：2015-01-27

Applicant: Anden Co., Ltd.

Inventor： Hideyuki Ohtani ,  Naoyuki Yasuda

IPC: H03K17/693 ,  H03K17/687 ,  H05K3/34

CPC classification number: H03K17/693 ,  H03K17/6874 ,  H03K17/6877 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2201/10803 ,  H05K2201/1081 ,  H05K2201/10833 ,  H05K2201/10871 ,  Y02P70/613

Abstract: In a relay module device, a signal converting section transmits driving signals of switching elements when receiving input signals from an external device and sets a relationship between the input signals and the driving signals. The relationship includes a first mode in which the signal converting section transmits the driving signals to separately control one of the switching elements with respect to one of the input signals, and a second mode in which the signal converting section transmits the driving signals to concurrently control two or more of the switching elements with respect to one of the input signals.

Abstract translation: 在继电器模块装置中，当从外部装置接收输入信号时，信号转换部分传输开关元件的驱动信号，并设定输入信号与驱动信号之间的关系。 该关系包括第一模式，其中信号转换部分发送驱动信号以相对于输入信号之一单独控制开关元件之一;以及第二模式，其中信号转换部分将驱动信号传输到同时控制 相对于输入信号之一的两个或多个开关元件。

公开(公告)号：US09480145B2

公开(公告)日：2016-10-25

申请号：US14024867

申请日：2013-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Wook Yoon ,  Sang Wook Kwon ,  Nam Yun Kim ,  Dong Zo Kim ,  Yun Kwon Park

IPC: H01F27/42 ,  H01F37/00 ,  H01F38/00 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/0262 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10196

Abstract: Provided is an apparatus and method to control a resonance frequency of a device subject to wireless power transmission interference. The apparatus and method include supplying power from a printed circuit board (PCB) to an integrated circuit (IC) during exposure to a wireless power transmission environment experiencing mutual resonance. The apparatus and method also include a resonance frequency of the PCB based on a change in the supply of power.

Abstract translation: 提供了一种控制受无线电力传输干扰的设备的谐振频率的装置和方法。 该装置和方法包括在暴露于经历相互共鸣的无线电力传输环境下从印刷电路板（PCB）向集成电路（IC）供电。 该装置和方法还包括基于电力供应变化的PCB的共振频率。

公开(公告)号：US20160295682A1

公开(公告)日：2016-10-06

申请号：US15090207

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

Abstract translation: 电子控制单元包括基板，电子元件，散热器，盖子，蓄热器和螺钉。 在基板上形成布线图形。 电子部件安装在基板上，并在其通电时产生热量。 散热器沿其厚度方向设置在基板的一侧。 盖由树脂制成，并且在其厚度方向上设置在基板的另一侧。 蓄热器固定在基板侧的盖的一部分上，并且与盖侧的基板的表面接触。 螺钉的一端连接到散热器。 螺杆的中心部分沿其厚度方向穿过穿过基底的孔插入。 螺杆的另一端连接到蓄热器。

公开(公告)号：US20160286639A1

公开(公告)日：2016-09-29

申请号：US15037266

申请日：2014-10-21

Applicant: ZF FRIEDRICHSHAFEN AG

Inventor： Wilfried LASSMANN ,  Michael SPERBER

IPC: H05K1/02 ,  H01L23/552 ,  H05K1/09 ,  H01L23/498

CPC classification number: H05K1/0265 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/09 ,  H05K2201/0723 ,  H05K2201/09254 ,  H05K2201/09327 ,  H05K2201/09736 ,  H05K2201/10053 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.

Abstract translation: 多功能高电流电路板包括具有用于传导电流的多个层的导电层，包括用于切换电负载的至少一个电源断路器的开关层，包括至少一个控制元件的控制层，以控制 至少一个电源断路器，用于屏蔽电流传导层与控制层和开关层的至少一个屏蔽元件。