公开(公告)号：US09826639B2

公开(公告)日：2017-11-21

申请号：US15351814

申请日：2016-11-15

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tatsuaki Denda ,  Osamu Hoshino

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H01L23/49534 ,  H05K1/181 ,  H05K3/005 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/427 ,  H05K3/428 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10234 ,  H05K2201/10545 ,  H05K2203/0733

Abstract: A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion projecting from a first surface of the first wiring layer facing away from the insulating layer. A surface of the end portion facing in the same direction as the first surface of the first wiring layer is depressed to be deeper in the center than in the periphery.

公开(公告)号：US20170318679A1

公开(公告)日：2017-11-02

申请号：US15523472

申请日：2015-10-29

Applicant: KAWASAKI JUKOGYO KABUSHIKI KAISHA

Inventor： Yoshiki SANTO

IPC: H05K1/18 ,  B25J9/16

CPC classification number: H05K1/181 ,  B25J9/16 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/09372 ,  H05K2201/09436 ,  H05K2201/09445 ,  H05K2201/10212 ,  H05K2201/10545 ,  H05K2201/10704

Abstract: A control circuit board includes first and second elements on each surface of a board member. The first and the second elements respectively have first and third edge portions, which are opposite to each other and second and fourth edge portions which are opposite to each other. A plurality of signal input pins are provided to the first edge portion, a plurality of signal output pins are provided to the third edge portion, a plurality of between-element communication input pins are provided to the second edge portion, and a plurality of between-element communication output pins are provided to the fourth edge portion, respectively. A common signal is input to the first and second elements and a communication is performed between the first element and the second element. Loss of control function can be surely prevented while suppressing enlargement of the board and increase of development/production cost.

公开(公告)号：US09788411B2

公开(公告)日：2017-10-10

申请号：US15090207

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

公开(公告)号：US09741702B2

公开(公告)日：2017-08-22

申请号：US14950411

申请日：2015-11-24

Applicant: Transphorm Inc.

Inventor： Yifeng Wu

IPC: H01L25/00 ,  H01L25/07 ,  H05K1/02 ,  H03K17/16 ,  H01L23/12 ,  H01L23/367 ,  H01L27/088 ,  H01L29/20 ,  H01L29/78 ,  H01L23/498 ,  H01L25/11 ,  H05K1/16 ,  H01L23/552 ,  H01L23/64 ,  H01L25/16

CPC classification number: H01L25/50 ,  H01L23/12 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/552 ,  H01L23/642 ,  H01L25/074 ,  H01L25/117 ,  H01L25/16 ,  H01L25/165 ,  H01L27/0883 ,  H01L29/2003 ,  H01L29/7827 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/30107 ,  H03K17/164 ,  H03K2217/0045 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/162 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

公开(公告)号：US20170164474A1

公开(公告)日：2017-06-08

申请号：US15367070

申请日：2016-12-01

Applicant: Samsung Display Co., Ltd.

Inventor： Byoungyong KIM ,  Inseok YEO ,  Euiyun JANG ,  Sangjun LEE ,  Jeongho HWANG

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/113 ,  H05K1/111 ,  H05K1/118 ,  H05K1/147 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10545 ,  Y02P70/611

Abstract: Provided is a printed circuit board including a base substrate, first row pads, and second row pads. The base substrate has two sides, that can be adjacent, respectively extending in first and second directions. A plurality of pad group areas successively positioned along the first direction are defined on the base substrate. The first row pads are respectively disposed within the pad group areas and successively positioned along a third direction. The second row pads are respectively disposed within the pad group areas, successively positioned along the third direction, and spaced apart from the first row pads. Each of the second row pads is a predetermined distance from a corresponding one of the first row pads in the second direction.

公开(公告)号：US09659127B2

公开(公告)日：2017-05-23

申请号：US14613855

申请日：2015-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-yeol Jung ,  Sang-ho Lee ,  Jeong-nam Cheon ,  Seung-hun Park

IPC: G06F17/50 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H01L23/50 ,  H01L25/16 ,  H05K1/11

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  G06F17/5063 ,  G06F17/5081 ,  G06F2217/82 ,  H01L23/50 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic apparatus includes a user interface to receive an input selecting a plurality of circuit devices, a storage to store electrical current information and a Scattering parameter regarding input/output ports of the plurality of circuit devices, respectively, a calculator to calculate impedance per number of de-coupling capacitors based on the stared S-parameters and to calculate an accumulated noise value per number of the decoupling capacitors based on the calculated impedance and the electrical current information, and a controller to determine a number of the de-coupling capacitors based on the calculated accumulated noise values and to control the user interface to display the determined number of the de-coupling capacitors.

公开(公告)号：US20170094771A1

公开(公告)日：2017-03-30

申请号：US15272201

申请日：2016-09-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Koji Noguchi

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10545

Abstract: A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

公开(公告)号：US09588312B2

公开(公告)日：2017-03-07

申请号：US14884772

申请日：2015-10-16

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Chun-Yi Chang ,  Jia-Hau Liu

IPC: G02B6/42 ,  H05K1/02

CPC classification number: G02B6/428 ,  G02B6/4206 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10545 ,  H05K2203/167

Abstract: An optoelectronic assembly includes a printed circuit board (PCB) defining opposite upper and lower surfaces, and equipped, on the upper surface, with an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, a lens module located on the side of the lower surface and communicating with the active component through via holes in the PCB, and a fiber assembly located in the lens module to be optically coupled to the active component via said lens module.

Abstract translation: 光电组件包括限定相对的上表面和下表面的印刷电路板（PCB），并且在上表面上配备有通过倒装芯片技术相互连接的有源部件和集成电路（IC），透镜模块 位于下表面的侧面并通过PCB中的通孔与有源部件连通，以及位于透镜模块中的光纤组件，以通过所述透镜模块光学耦合到有源部件。

公开(公告)号：US09561657B2

公开(公告)日：2017-02-07

申请号：US15138997

申请日：2016-04-26

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/16 ,  B05B15/00 ,  B05B1/14 ,  H01L23/00 ,  H05K3/30 ,  H01L41/113 ,  H05K1/02 ,  H05K1/09 ,  B05B11/00 ,  H05K1/18

CPC classification number: B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。

公开(公告)号：US09560758B2

公开(公告)日：2017-01-31

申请号：US14250211

申请日：2014-04-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shoji Matsumoto ,  Seiji Hayashi ,  Takuya Kondo

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/10545

Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.

Abstract translation: 印刷布线板包括：第一导电层，与第一导电层相对配置的间隙的第二导电层，第三导电层，第一通孔导体和第二通孔导体以及第三信号布线图案。 第一信号布线图案布置在第一导电层上，第二信号布线图案布置在第二导电层上，第三信号布线图案布置在第三导电层上。 第三导电层通过绝缘层布置在第一导电层和第二导电层之间。 布置成相互相邻的第一通孔导体和第二通孔导体将第一信号布线图案连接到第二信号布线图案。 第三信号布线图案将第一通孔导体连接到第二通孔导体。