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    Peripherally Mounted Components in Embedded Circuits
    183.
    发明申请
    Peripherally Mounted Components in Embedded Circuits 审中-公开
    嵌入式电路中的外围组件

    公开(公告)号：US20150366067A1

    公开(公告)日：2015-12-17

    申请号：US14717829

    申请日：2015-05-20

    Applicant: Edward Herbert

    Inventor： Edward Herbert

    IPC: H05K1/18

    CPC classification number: H05K1/185 ,  H01L23/4822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/2518 ,  H05K1/0271 ,  H05K3/007 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/1056 ,  H05K2201/10901 ,  H05K2201/10946

    Abstract: Semiconductor die and other components can be mounted in printed circuit boards with a binding agent at their periphery. This leaves both surfaces exposed for subsequent processing, usually over-plating with copper that is then etched to define a conductor pattern, just as in printed circuit manufacture. Methods using the surface tension of liquids for precise component placement in three dimensions (3-D) are shown. Optionally, micro-conductors can be used for the connections to the die, for reduced apparent resistance at high frequencies. The micro-channels between the micro-conductors can be a wick for liquid for evaporative cooling at the semiconductor surface as part of a heat pipe circuit.

    Abstract translation: 半导体管芯等组件可以在其周围装有粘合剂的印刷电路板。 这使得两个表面暴露以用于随后的处理，通常用铜进行镀覆，然后被蚀刻以限定导体图案，就像在印刷电路制造中一样。 示出了使用液体的表面张力在三维（3-D）中精确组分放置的方法。 可选地，微导体可用于与管芯的连接，以降低高频下的视在电阻。 微导体之间的微通道可以是作为热管回路的一部分的半导体表面处的用于蒸发冷却的液体的芯。

    Wiring substrate
    184.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号：US09210807B2

    公开(公告)日：2015-12-08

    申请号：US14084038

    申请日：2013-11-19

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Kei Imafuji ,  Jun Yoshiike

    IPC: H05K1/11 ,  H05K1/03 ,  H05K3/40 ,  H05K3/34 ,  H05K3/46

    CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/11 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0373 ,  H05K2201/0769 ,  H05K2201/099 ,  H05K2201/2072 ,  H05K2203/0594 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.

    Abstract translation: 布线基板包括：具有第一表面的连接垫; 保护绝缘层，形成在连接焊盘的第一表面上并且在其中具有开口部分，其中连接焊盘的第一表面的一部分从开口部露出; 具有面向连接焊盘的第一表面的下表面的金属层和与下表面相对的上表面，并且形成在从开口部暴露的连接焊盘的第一表面上，金属层包括凸起部分， 从金属层的上表面在其周边部分向上延伸; 以及形成在金属层的上表面上的凸块电极。

    Printed circuit board providing heat dissipation
    185.
    发明授权
    Printed circuit board providing heat dissipation 失效
    印刷电路板提供散热

    公开(公告)号：US08759686B2

    公开(公告)日：2014-06-24

    申请号：US13197912

    申请日：2011-08-04

    Applicant: Ming-Chun Cheng

    Inventor： Ming-Chun Cheng

    IPC: H05K1/02

    CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2203/043

    Abstract: A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements.

    Abstract translation: 印刷电路板包括绝缘基片，导热层，绝缘层，多个导热块和多个接合焊盘。 导热层设置在绝缘基片上。 绝缘层部分涂覆在导热层上，留下多个暴露区域。 导热块相应地形成在暴露的区域上。 接合焊盘位于导热层上，用于焊接电路元件。

    ELECTRONIC SYSTEM FOR REFLOW SOLDERING
    189.
    发明申请
    ELECTRONIC SYSTEM FOR REFLOW SOLDERING 有权
    用于反射焊接的电子系统

    公开(公告)号：US20130083489A1

    公开(公告)日：2013-04-04

    申请号：US13626322

    申请日：2012-09-25

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Matteo Sebastiano Dimauro ,  Sebastiano Russo ,  Rosalba Cacciola ,  Cristiano Gianluca Stella

    IPC: H05K7/00 ,  B23K31/02 ,  H01B5/00 ,  H01R9/00 ,  H05K7/20

    CPC classification number: H05K1/111 ,  H05K3/3431 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

    Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

    Abstract translation: 电子系统包括绝缘结构元件，其具有被配置为将电子系统与至少一个另外的电子系统耦合的耦合表面。 电子系统还包括至少一个至少部分地暴露在耦合表面上的导电接触元件。 每个导电接触元件具有支撑导电接触元件的回流焊接的焊接表面与另外的电子系统的相应的另外的接触元件。 此外，每个导电接触元件具有从绝缘结构元件突出的至少一个侧表面。 导电接触元件的焊接表面包括在突出侧表面具有开口端的至少一个通道，该通道构造成便于在回流焊接期间产生的废气的分散。

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