公开(公告)号：US20080166490A1

公开(公告)日：2008-07-10

申请号：US11971839

申请日：2008-01-09

Applicant: Patrick Hogan ,  Gareth De Sanctis

Inventor： Patrick Hogan ,  Gareth De Sanctis

IPC: B05D1/02 ,  B05B7/00 ,  B05B7/16

CPC classification number: B05B9/0423 ,  B05B7/24 ,  B05B9/002 ,  B05C11/1039 ,  B05C11/1047 ,  H05K3/0091 ,  H05K2201/09872 ,  H05K2203/0126

Abstract: Systems and methods for applying a conformal coating material to a substrate, such as an electronic component or circuit board. The systems and methods rely on a pressure-regulated fluid circulation loop connecting an outlet of a pump with an inlet of a pump and an applicator that is connected in fluid communication with the fluid circulation loop. Amounts of the conformal coating material dispensed by the applicator, which are diverted from the fluid circulation loop, may be replenished by fresh amounts supplied from a non-pressurized reservoir, which are siphoned by the pump into the fluid circulation loop.

Abstract translation: 将适形涂层材料施加到诸如电子部件或电路板的基底的系统和方法。 系统和方法依赖于压力调节的流体循环回路，其将泵的出口与泵的入口和与流体循环回路流体连通地连接的施用器连接。 通过从流体循环回路转向的施用器分配的保形涂层材料的量可以由从泵被虹吸入流体循环回路的非加压储存器提供的新鲜量补充。

公开(公告)号：US20080099515A1

公开(公告)日：2008-05-01

申请号：US11558022

申请日：2006-11-09

Applicant: Michael Szuch

Inventor： Michael Szuch

IPC: B67D3/00

CPC classification number: H05K3/0091 ,  B05B12/00 ,  B05B12/02 ,  B05B12/06 ,  B05C11/1015 ,  H05K2201/09872 ,  H05K2203/0126

Abstract: A coating system with an applicator that has an air cylinder with a needle valve. A control has a timer that provides a string of electrical pulses to a solenoid. With each pulse, the solenoid applies pressurized air to a cylinder piston, thereby opening the needle valve and permitting coating material to flow past the needle valve. The needle valve is closed for durations of time between pulses, and the coating material is ejected from a dispensing needle in response to closings of the needle valve.

Abstract translation: 具有涂布器的涂布系统，其具有带针阀的气缸。 一个控制器有一个定时器，它向螺线管提供一串电脉冲。 对于每个脉冲，螺线管将加压空气施加到气缸活塞，从而打开针阀并允许涂覆材料流过针阀。 针阀关闭脉冲之间的持续时间，并且响应于针阀的关闭，涂覆材料从分配针喷射。

公开(公告)号：US5720820A

公开(公告)日：1998-02-24

申请号：US388138

申请日：1995-02-13

Applicant: Bentley Boger ,  Jurgen Benecke ,  Arthur Cieplik ,  Thomas Burmester ,  Michael L. Gill

Inventor： Bentley Boger ,  Jurgen Benecke ,  Arthur Cieplik ,  Thomas Burmester ,  Michael L. Gill

IPC: B05B7/08 ,  B05C5/02 ,  B05D1/26 ,  B05D3/04 ,  B05D7/00 ,  H05K3/00 ,  H05K3/28 ,  B05C11/00

CPC classification number: B05C5/0291 ,  B05B7/0861 ,  B05C5/0254 ,  B05D1/265 ,  B05D3/042 ,  H05K3/0091 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/081 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1509 ,  H05K2203/159 ,  H05K3/284

Abstract: Apparatus for producing intermittent, discrete patterns of coating material onto discrete irregular substrate areas, such as electronic circuit boards, where the patterns have sharp, square leading and trailing edges, as well as side edges. A slot nozzle die has elongated air slots along the slot extrusion opening. In the operation of the apparatus, the air flow is initiated from both air slots prior to the initiation of the coating material flow. Also, the air flow is continued beyond that point in time, when the coating material flow ceases. The delays between the operations of the air flow and the hot melt flow are on the order of micro seconds. Alternatively, the lead and lag air start and stop times on each side of the film of coating material are different to control the exact disposition of the square cut-on and square cut-off coating edge on the circuit board. The air flow carries the film coating material to the circuit board for deposition in discrete areas thereon. The sharp cut-on and cut-off accommodate multiple discrete area coating or multiple automated circuit board coating. Methods are disclosed.

Abstract translation: 用于在离散的不规则衬底区域（例如电子电路板）上产生间断的，离散的涂层材料图案的装置，其中图案具有尖锐的，正方形的前缘和后缘以及侧边缘。 狭缝喷嘴模具具有沿着狭槽挤出开口的细长空气槽。 在装置的操作中，在涂层材料流动开始之前，空气流从两个空气槽开始。 此外，当涂料流动停止时，空气流继续超过该时间点。 空气流动和热熔体流动的操作之间的延迟大约为微秒级。 或者，涂层材料膜两侧的引导和滞后空气开始和停止时间是不同的，以控制电路板上正方形切割和方形截止涂层边缘的精确布置。 空气流将膜涂层材料运送到电路板上，用于沉积在其上的离散区域中。 尖锐的切割和切割可适应多个离散区域涂层或多个自动化电路板涂层。 公开了方法。

公开(公告)号：US5426568A

公开(公告)日：1995-06-20

申请号：US171473

申请日：1993-12-23

Applicant: Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

Inventor： Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K7/02 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K3/303 ,  H05K1/0271 ,  H05K3/0058 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2201/10727 ,  H05K2201/2045 ,  H05K3/284 ,  H05K3/305 ,  Y02P70/613

Abstract: A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

Abstract translation: 发射保护的电子组件，其包括具有多个导体路径的印刷电路板。 提供固定到印刷电路板的电子部件。 电子部件具有多个电连接，每个接触相应的导体路径。 组件还包括支撑件和将印刷电路板连接到支撑件的柔性粘合剂层和点状柔性粘合剂位置中的至少一个。

公开(公告)号：US5368899A

公开(公告)日：1994-11-29

申请号：US926114

申请日：1992-08-07

Applicant: Mary O'Connell Litteral

Inventor： Mary O'Connell Litteral

IPC: H05K3/28 ,  B05C3/10 ,  B05D1/18 ,  B05D3/06 ,  H05K3/00 ,  H05K13/00

CPC classification number: H05K13/0061 ,  B05C3/10 ,  B05D1/18 ,  B05D3/067 ,  H05K3/0091 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1518 ,  H05K2203/1572

Abstract: Disclosed is an automatic vertical dip coater with simultaneous UV curing. The invention includes a method of automatically dip-coating and simultaneously UV curing a conformal coating on both sides of a circuit board including the steps of positioning a circuit board, to be coated on both sides with a conformal coating, on a tool; advancing said tool towards a dip-coating tank containing a UV curable conformal coating so that both sides of said circuit board are immersed in said conformal coating to a predetermined position; advancing said tool passed opposed UV lamps so that the conformal coating on both sides of said circuit board is simultaneously cured by ultraviolet light.

Abstract translation: 公开了一种具有同时UV固化的自动立式浸渍涂布机。 本发明包括一种在电路板两侧自动浸涂并同时UV固化保形涂层的方法，包括以下步骤：将要涂覆在两侧的电路板用保形涂层定位在工具上; 将所述工具推向包含UV固化保形涂层的浸涂槽，使得所述电路板的两侧浸入所述保形涂层中至预定位置; 推进所述工具通过相对的紫外灯，使得所述电路板两侧的共形涂层同时被紫外光固化。

公开(公告)号：US5232758A

公开(公告)日：1993-08-03

申请号：US577387

申请日：1990-09-04

Applicant: Frank J. Juskey ,  Anthony B. Suppelsa ,  Kenneth M. Wasko

Inventor： Frank J. Juskey ,  Anthony B. Suppelsa ,  Kenneth M. Wasko

IPC: C09D5/08 ,  H05K3/28

CPC classification number: H05K3/284 ,  C09D5/08 ,  H05K2201/09872 ,  Y10S428/901 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T428/239 ,  Y10T428/24851 ,  Y10T428/24868

Abstract: A non-hardening, solvent removable hydrophobic conformal coating is provided for electronic devices, such as printed circuit boards. The coating material comprises a metal alkyl benzyl sulfonate, together with a carrier and a solvent. The metal alkyl benzyl sulfonate may include compounds such as calcium eicosanylbenzyl sulfonate. The carrier may be any oxidized hydrocarbon, such as lauryl ethanoxylate, for example, and the solvent may be any low boiling aliphatic hydrocarbon. Though the coating is impervious to water, it may be readily and selectively removed using a small quantity of a non-polar organic solvent, such as mineral spirits or terpenes. Thus, although the electronic device is protected from corrosion, electromigration and physical harm by the coating, the coating may be easily, quickly and selectively removed in the event a component needs replacement, repair or adjustment.

Abstract translation: 为电子设备（例如印刷电路板）提供非硬化的，溶剂可移除的疏水性共形涂层。 涂层材料包括金属烷基苄基磺酸盐，以及载体和溶剂。 金属烷基苄基磺酸盐可以包括化合物如二十烷基苄基磺酸钙。 载体可以是任何氧化的烃，例如月桂基乙氧基化物，并且溶剂可以是任何低沸点脂族烃。 虽然涂层是不透水的，但是可以使用少量非极性有机溶剂如矿物油或萜烯容易地和选择性地除去涂层。 因此，尽管电子器件被保护免受涂层的腐蚀，电迁移和物理伤害，但是在组件需要更换，修理或调整的情况下，涂层可以容易地，快速地和选择性地去除。

公开(公告)号：US5166864A

公开(公告)日：1992-11-24

申请号：US701942

申请日：1991-05-17

Applicant: Gary L. Chitwood ,  James E. Balcom

Inventor： Gary L. Chitwood ,  James E. Balcom

IPC: H05K1/02 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09872

Abstract: Printed wiring board with components thereon is enclosed with a dielectric conformal coating over the printed wiring and the components. Enclosure includes a metal layer over the conformal coating and the ground plane of the card to form a protected circuit card assembly.

Abstract translation: 其上具有部件的印刷电路板用印刷线路和部件上的电介质保形涂层包围。 外壳包括在保形涂层上的金属层和卡的接地平面，以形成受保护的电路卡组件。

公开(公告)号：US5141165A

公开(公告)日：1992-08-25

申请号：US510001

申请日：1990-04-17

Applicant: John Sharpless ,  Patrick T. Hogan ,  Duong T. La

Inventor： John Sharpless ,  Patrick T. Hogan ,  Duong T. La

IPC: B05B12/00 ,  B05B13/04 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0091 ,  B05B13/0431 ,  H05K2201/09872 ,  H05K2203/1366 ,  H05K2203/1509

Abstract: An apparatus for manipulating a spray device having a spray nozzle relative to a target substrate, which apparatus includes drive mechanisms for moving the spray device in the X, Y and Z directions, and separate mechanisms for rotating the spray nozzle relative to the spray device and for tilting the spray nozzle relative to the spray device.

Abstract translation: 一种用于操纵具有相对于目标衬底的喷嘴的喷射装置的装置，该装置包括用于在X，Y和Z方向上移动喷射装置的驱动机构，以及用于相对于喷雾装置旋转喷嘴的分离机构， 用于相对于喷雾装置倾斜喷嘴。

公开(公告)号：US5013631A

公开(公告)日：1991-05-07

申请号：US318578

申请日：1989-03-03

Applicant: Wei-Fang A. Su

Inventor： Wei-Fang A. Su

IPC: C08F2/48 ,  C08F290/00 ,  C08F299/00 ,  C08F299/02 ,  C09D175/04 ,  C09D175/16 ,  H05K3/28

CPC classification number: H05K3/287 ,  C08F299/024 ,  C09D175/04 ,  C09D175/16 ,  H05K2201/09872

Abstract: A two package UV curable conformal coating has been developed which possesses low moisture permeability and good electrical properties and provides a cure for shadowing of components on a printed wiring board. The conformal coating is a mixture of Component (A) which is a mixture of (1) from about 40 to 80% by weight, of a urethane having a free isocyanate group; (2) from about 20 to 60%, by weight, of reactive acrylate diluents; (3) from 0 to about 10% by weight of UV photoinitiators; and (4) from 0 to about 10% by weight of additives; and component (B) which is a mixture of (1) about 50 to 80% by weight of an acrylate-epoxy resin; (2) about 1 to 10% by weight of an acrylate-urethane oligomer; (3) about 10 to 94% by weight of reactive acrylate monomers; (4) from 0 to about 10%, by weight, of UV photoinitiators; and (5) from 0 to about 10% by weight of additives; with the proviso that the total weight percentage of said photoinitiators and additives not be less than 1 percent and not exceed about 10 percent. Components A and B may be mixed in equal parts, by weight, or in a 1 to 2 part ratio, by weight.

公开(公告)号：US4824875A

公开(公告)日：1989-04-25

申请号：US118086

申请日：1987-11-06

Applicant: Beth I. Gutek

Inventor： Beth I. Gutek

IPC: C08F299/08 ,  B05D3/06 ,  C08F2/50 ,  C08F290/00 ,  C08L83/08 ,  C09D183/08 ,  H05K3/28

CPC classification number: B05D3/06 ,  C08L83/08 ,  C09D183/08 ,  H05K3/287 ,  H05K2201/09872 ,  Y10S528/901

Abstract: A conformal coating composition is made from a mixture of acrylamide functional polydimethylsiloxane, a methacrylate functional/dialkoxy polydiorganosiloxane, reactive diluent including isobornyl acrylate, cyclohexyl acrylate, and 2-ethylhexyl acrylate; a photoinitiator combination of 2-hydroxy-2-methylphenylpropanone and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholenopropanone, an amine including dimethylethanolamine and diisopropylethylamine, and an organic titanate. The composition has a viscosity of from 0.07 to 0.2 Pa.s at 25.degree. C. and cures by exposure to ultraviolet radiation and to atmospheric moisture, i.e. a dual curing composition. This composition cures too fast by exposure to ultraviolet radiation in the presence of nitrogen resulting in a distorted surface and therefore for coating printed circuit boards it is recommended that it be cured in air so that the rate of cure is reduced and no surface distortions are formed.