Abstract:
A chip-on-film package comprises a film substrate comprising upper and lower surfaces, and a side having a bending part. A first output interconnection formed on the upper surface of the film substrate extends from a semiconductor chip disposed on the upper surface toward the bending part. A second output interconnection includes an upper output interconnection formed on the upper surface of the film substrate, and a lower output interconnection formed on the lower surface and extending onto the bending part. An input interconnection includes an upper input interconnection formed on the upper surface of the film substrate and a lower input interconnection formed on the lower surface and extending away from the bending part. Through-vias are formed to pass through the film substrate and electrically connect the upper output interconnection to the lower output interconnection, and the upper input interconnection to the lower input interconnection.
Abstract:
A display device including a display panel including a substrate having one side on which a first conductive pattern is arranged, a flexible printed circuit board having one side on which a second conductive pattern that is connected to the first conductive pattern is arranged, and a dam pad positioned between the substrate and the flexible printed circuit board to be spaced apart from an area to which the second conductive pattern is connected.
Abstract:
A display device, including a display panel; a flexible printed circuit board (FPCB) including a driving integrated circuit (IC) and attached to a rear surface of the display panel; a conductive member at the rear surface of the display panel; an FPCB connection pad connected to the conductive member at the rear surface of the display panel and connected to the FPCB; an FPCB connection terminal connected to the FPCB connection pad and at the FPCB; and a ground at the FPCB.
Abstract:
An illumination device includes: a plurality of LED substrates having a rectangular plate shape, the plurality of LED substrates arranged in a row along a long side direction thereof, and each of the LED substrates having a plurality of LEDs on one surface thereof; and a heat-dissipating member abutting another surface of each of the LED substrates. A cutout portion is provided in each of the short sides, facing each other, of the LED substrates that are adjacent to each other. A fixing screw has a screw shaft that goes through the cutout portion from the mounting surface of the LED substrates and is fixed to the heat-dissipating member and a screw head that abuts the mounting surface of each of the LED substrates that are adjacent to each other.
Abstract:
A display device includes a plurality of signal lines arranged in a display area of a substrate and a pad structure located at a non-active area and connected with the signal lines. The pad structure includes a plurality of metal layers and two or more insulating layers located between the metal layers and having one or more contact hole which makes two metal layers among the metal layers contacted with each other, and the contact holes respectively located in the insulating layers are not overlapped with each other.
Abstract:
Provided is a display panel including a loop-shaped conductive path which is manufactured by performing a conductive ink jetting process and a high-degree vacuum removal process to effectively vaporizing a solvent in a conductive ink line at lower temperature than the boiling point at atmospheric pressure of the solvent. The conductive path manufactured as such does not allow a stain or a trace, such as a pull-back region, to be left around the conductive path. Thus, it is possible to obtain the loop-shaped conductive path having an initially intended design without being damaged during a process.
Abstract:
A static electricity preventing circuit and a display device including the same are disclosed. In one aspect, the static electricity preventing circuit includes a power source voltage supply unit configured to apply a power source voltage to drive a display panel, wherein the display panel comprises a plurality of pixels respectively displaying images through light emission according to data voltages of image data signals. It also includes a signal wire unit configured to transmit lighting test signals for a lighting test of the pixels included in the display panel. It further includes a resistor unit positioned between the power source voltage supply unit and the signal wire unit and configured to discharge static electricity generated in the signal wire unit through the power source voltage supply unit.
Abstract:
A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.
Abstract:
System and Method for a Modular Multi-Panel Display Embodiments of the present invention relate to integrated modular display systems. In one embodiment, a modular multi-panel display system includes a mechanical support structure, and a plurality of display panels detachably mounted to the mechanical support structure so as to form an integrated display panel. Each LED panel includes an LED array and an LED driver coupled to the LED array. Each panel further includes a power supply unit disposed outside the housing and electrically coupled to the receiver circuit. The mechanical structure is configured to provide mechanical support to the plurality of display panels without providing hermetic sealing. Each of the plurality of display panels is hermetically sealed.