公开(公告)号：US20130230991A1

公开(公告)日：2013-09-05

申请号：US13866557

申请日：2013-04-19

Applicant: LEAR CORPORATION

Inventor： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

IPC: H01R12/71

CPC classification number: H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

Abstract translation: 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。

公开(公告)号：US20130141913A1

公开(公告)日：2013-06-06

申请号：US13816421

申请日：2011-08-09

Applicant: Peter Sachsenweger

Inventor： Peter Sachsenweger

IPC: F21V21/002

CPC classification number: F21V21/002 ,  F21K9/23 ,  F21S2/005 ,  F21V19/003 ,  F21V23/02 ,  F21V29/74 ,  F21V29/77 ,  F21Y2103/33 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/325 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10303 ,  Y10T29/49117

Abstract: The printed circuit board (1) has a front face (2) which can be fitted with at least one semiconductor light source (4) and at least one mounting element (6) which is accessible via a rear face (3), wherein the at least one mounting element (6) is in the form of an electrical conduction element for at least one of the semiconductor light sources (4). The support has at least one support area (12) on which the printed circuit board (1) can be placed, wherein at least one mating mounting element (13) for respectively mounting a mounting element (6) of the printed circuit board (1) is arranged on the support area (12), and wherein at least one mating mounting element (13) is an electrically conductive mating mounting element (13) which is connected to at least one electrical power supply. In the system (10) comprising the printed circuit board (1) and the support (11), the printed circuit board (1) is mounted on the support (11) by the at least one mounting element (6) of the printed circuit board (1) engaging in an interlocking and/or force-fitting maimer in a respectively matching mating mounting element (13) of the support (11). The method is used to mount the printed circuit board (1) on the support (11).

Abstract translation: 印刷电路板（1）具有可以装配有至少一个半导体光源（4）的前面（2）和经由后面（3）可接近的至少一个安装元件（6），其中， 至少一个安装元件（6）为用于半导体光源（4）中的至少一个的导电元件的形式。 支撑体具有至少一个支撑区域（12），印刷电路板（1）可以放置在该支撑区域上，其中至少一个配合安装元件（13）用于分别安装印刷电路板（1）的安装元件（6） ）布置在支撑区域（12）上，并且其中至少一个配合安装元件（13）是连接到至少一个电源的导电配合安装元件（13）。 在包括印刷电路板（1）和支撑体（11）的系统（10）中，印刷电路板（1）通过印刷电路的至少一个安装元件（6）安装在支撑件（11）上 板（1）在支撑件（11）的分别匹配的配合安装元件（13）中接合互锁和/或强力配合装置。 该方法用于将印刷电路板（1）安装在支撑件（11）上。

公开(公告)号：US08446733B2

公开(公告)日：2013-05-21

申请号：US13209870

申请日：2011-08-15

Applicant: Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

Inventor： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

IPC: H01R9/00

CPC classification number: H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

Abstract translation: 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。

公开(公告)号：US08400771B2

公开(公告)日：2013-03-19

申请号：US13004327

申请日：2011-01-11

Applicant: Zdenko Grajcar

Inventor： Zdenko Grajcar

IPC: H05K7/20

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K7/205 ,  H05K2201/10106 ,  H05K2201/10303 ,  H01L2924/00014

Abstract: An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core. The metal layer may be disposed on a core first surface. The metal layer may comprise metal or other conductive material suitable to define traces, which may be circuit paths for electronic components affixed to the PCB. In some aspects, the core may be electrically non-conducting, and may be thermally insulating, and, accordingly, inhibit the transfer of heat from the electronics package through the PCB. However, pins may be configured to pass through the PCB including the core from the core first surface to the core second surface to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. A pad may be disposed between the electronic package and the core in some embodiments, the pins passing into the pad.

Abstract translation: 公开了一种可以包括印刷电路板（PCB）的装置，并且可以围绕PCB的第一表面设置电子封装。 PCB可以包括金属层和芯，并且在一些方面，可以包括插入在多个金属层之间的多个芯，并且在一些实施例中，背板可以沿着芯布置。 金属层可以设置在芯部第一表面上。 金属层可以包括适于限定迹线的金属或其它导电材料，其可以是固定到PCB的电子部件的电路路径。 在一些方面，芯可以是非导电的，并且可以是绝热的，并且因此抑制来自电子封装件的热量通过PCB传递。 然而，引脚可以被配置为将包括芯的PCB从芯第一表面通过到芯第二表面，以传导由电子封装件产生的热量用于分散。 在一些实施例中，销可以进入背板。 在一些实施例中，焊盘可以设置在电子封装和芯之间，引脚穿过焊盘。

公开(公告)号：US08390308B2

公开(公告)日：2013-03-05

申请号：US12039854

申请日：2008-02-29

Applicant: Michael Carney ,  Marek Reksnis ,  Ted Toth

Inventor： Michael Carney ,  Marek Reksnis ,  Ted Toth

IPC: G01R31/00

CPC classification number: H05K1/116 ,  G01R1/07314 ,  G01R3/00 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09627 ,  H05K2201/10303 ,  Y10T29/49124

Abstract: There is disclosed an electronic testbed, an electronic testbed board, and a method for positioning receptacles for nails in the electronic testbed board. In an embodiment, the electronic testbed board includes a mounting through-hole for mounting a receptacle for a nail. The mounting through-hole is drilled to a suitably precise diameter for mounting the receptacle substantially perpendicular to the testbed board. One or more via-holes are located adjacent the mounting through-hole, and are adapted to allow an electrical connection between any conductive layers provided at the one or more via-holes. The receptacle may be mounted more accurately and the electronic test bed may be built more accurately by separating the functions of the via-holes and the mounting through-hole.

Abstract translation: 公开了一种电子测试台，电子测试台和用于在电子测试台中定位钉子的插座的方法。 在一个实施例中，电子测试台板包括用于安装用于钉子的插座的安装通孔。 将安装通孔钻入适当精确的直径，以将基座垂直于测试台板安装。 一个或多个通孔位于安装通孔附近，并且适于允许在一个或多个通孔处提供的任何导电层之间的电连接。 可以更准确地安装插座，并且可以通过分离通孔和安装通孔的功能来更准确地构建电子测试台。

公开(公告)号：US08378231B2

公开(公告)日：2013-02-19

申请号：US12510028

申请日：2009-07-27

Applicant: Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

Inventor： Kiyotaka Tsukada ,  Toshihiro Nomura ,  Daisuke Minoura

IPC: H05K1/11

CPC classification number: H05K1/145 ,  H01L24/01 ,  H01L24/25 ,  H01L2224/2518 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/284 ,  H05K3/306 ,  H05K2201/096 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10643 ,  H05K2201/10871 ,  H05K2201/10946 ,  Y10T29/4913 ,  Y10T29/49153 ,  H01L2924/00

Abstract: A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Abstract translation: 半导体器件包括各自具有绝缘板，导体电路和通孔的布线板，所述绝缘板具有顶表面和底表面，所述导体电路形成在顶表面和底表面上，所述通孔穿过绝缘板并电连接 顶表面和底表面的导体电路; 导体柱各自具有凸缘，头部和腿部，凸缘部分具有第一和第二表面，并且具有比通孔大的外径，头部从第一表面突出，腿部从第二表面突出 ; 以及各自具有形成在一个或多个表面上并连接到所述腿部的电极的电子部件。 插入头部直到凸缘部分的第一表面与布线板的底表面接触并且在通孔的内壁处电连接。

公开(公告)号：US08366457B2

公开(公告)日：2013-02-05

申请号：US13233160

申请日：2011-09-15

Applicant: Takeyoshi Yamamoto ,  Keisuke Takahashi ,  Yoshikatsu Hasegawa

Inventor： Takeyoshi Yamamoto ,  Keisuke Takahashi ,  Yoshikatsu Hasegawa

IPC: H01R12/00

CPC classification number: H05K3/4046 ,  H01R12/58 ,  H05K3/202 ,  H05K3/4611 ,  H05K2201/09581 ,  H05K2201/0969 ,  H05K2201/10303 ,  H05K2201/10833

Abstract: A wiring structure includes a board assembly and pin terminals. In each of pin terminal insertion holes formed in the board assembly, a terminal connection portion electrically connected to a metal foil wire and fitted onto the pin terminal so as to hold the pin terminal is provided in a through-hole of at least one of a plurality of circuit boards forming the board assembly, which forms a part of the pin terminal insertion hole, whereas an insulating sleeve blocking contact between the pin terminal and each of the remaining circuit boards is fitted into through-holes of the remaining circuit boards, which form the remaining part of the pin terminal insertion hole.

Abstract translation: 布线结构包括板组件和销端子。 在形成在板组装体中的每一个销端子插入孔中，与金属箔线电连接并安装在销端子上以便固定销端子的端子连接部分设置在至少一个 形成板组件的多个电路板，其形成销端子插入孔的一部分，而将引脚端子和每个剩余电路板之间的绝缘套筒阻塞接触装配到剩余电路板的通孔中， 形成销端子插入孔的剩余部分。

公开(公告)号：US08325461B2

公开(公告)日：2012-12-04

申请号：US12188457

申请日：2008-08-08

Applicant: Eugene W. Dolfi ,  Mark W. Metzler ,  Mark C. Lukan ,  Eric A. Carter

Inventor： Eugene W. Dolfi ,  Mark W. Metzler ,  Mark C. Lukan ,  Eric A. Carter

IPC: H01G4/35 ,  H01G4/30 ,  H01G4/228 ,  H01G4/236 ,  H01G4/08

CPC classification number: H01G4/35 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09672 ,  H05K2201/10303

Abstract: A feed-through capacitor is constructed in a printed wiring board using alternating layers of metal capacitive layers and plastic dielectric layers of the printed wiring board. The large number of layers, the avoidance of ceramic layers and the flexible geometry of this device allow it to be used in many applications, particularly in those involving high power high current. Also, because it utilizes a printed wiring board, the capacitor can be made in numerous sizes and shapes.

Abstract translation: 在印刷电路板中，使用交替的金属电容层和印刷电路板的塑料电介质层构成馈通电容器。 大量的层，避免陶瓷层和该器件的柔性几何形状使其能够用于许多应用中，特别是在涉及高功率大电流的应用中。 而且，由于采用印刷电路板，电容器可以制成多种尺寸和形状。

公开(公告)号：US20120195009A1

公开(公告)日：2012-08-02

申请号：US13392102

申请日：2010-07-29

Applicant: Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

Inventor： Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

IPC: H05K7/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H01F27/06 ,  H01F2027/065 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1418 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10939 ,  Y10T29/49144

Abstract: An electronic product having a double-PCB sandwich structure includes a PCB assembly, and a casing having an open side. The electronic product is configured such that a protuberance is respectively formed on the inner sides of two side walls of the casing in the longitudinal direction, the PCB assembly comprises an electronic component, a base PCB and a main PCB, the length of the base PCB and the length of the main PCB in the longitudinal direction of the casing are substantially equal to each other and slightly smaller than the length of the casing so that the PCB assembly can be installed into the casing by mating with the protuberances.

Abstract translation: 具有双PCB夹层结构的电子产品包括PCB组件和具有开口侧的壳体。 电子产品被构造成使得在纵向方向上分别在壳体的两个侧壁的内侧上形成突起，PCB组件包括电子部件，基底PCB和主PCB，基底PCB的长度 并且主PCB在壳体的纵向方向上的长度基本上彼此相等并且略小于壳体的长度，使得PCB组件可以通过与突起配合而安装到壳体中。

公开(公告)号：US08009438B2

公开(公告)日：2011-08-30

申请号：US11729470

申请日：2007-03-29

Applicant: Kevin B. Leigh ,  Jonathan E. James Ou ,  David W. Sherrod ,  Kurt A. Manweiler ,  Miles B. Reyes ,  Gregory L. Gibson ,  Stephen A. Kay ,  Vincent W. Michna

Inventor： Kevin B. Leigh ,  Jonathan E. James Ou ,  David W. Sherrod ,  Kurt A. Manweiler ,  Miles B. Reyes ,  Gregory L. Gibson ,  Stephen A. Kay ,  Vincent W. Michna

IPC: H05K1/11

CPC classification number: H05K1/144 ,  H05K7/1457 ,  H05K2201/044 ,  H05K2201/09309 ,  H05K2201/10303 ,  H05K2203/167

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract translation: 本技术的实施例涉及背板基础设施。 背板基础设施可以包括配置成分配功率并且包括第一组对准孔的无源功率背板，被配置为布线接口信号并包括第二组对准孔和一组公共对准引脚的信号背板，每个对准引脚具有 轴，其中所述一组公共对准销插入到第一组对准孔和第二组对准孔中，以使无源功率背板和信号背板绕轴线对准。