公开(公告)号：US07425766B2

公开(公告)日：2008-09-16

申请号：US11043946

申请日：2005-01-28

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: H01L23/12 ,  G02F1/1345

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/243 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0574 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract translation: 在薄膜基材（1）和形成在薄膜基材（1）上的导体布线（23）的薄膜基板（FB）中，导体布线（23）布置成使外部的导体布线厚度 连接另一面板或基板的薄膜基板上的连接部分比其他位置的导体布线部分（弯曲部分）（25）的导体布线厚度厚。

公开(公告)号：US07294532B2

公开(公告)日：2007-11-13

申请号：US11146610

申请日：2005-06-07

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani

IPC: H01L21/44

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for manufacturing a semiconductor device that includes mounting a semiconductor chip on a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, in which the bump is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, without a stepped portion formed on a surface of the bump, and a cross sectional shape of the bump taken in a width direction of the wiring layer is such that a central portion is higher than both side portions. The method also includes connecting electrode pads of the semiconductor chip to the bumps, thereby achieving connection between the electrode pads of the semiconductor chip and the wiring layers via the bumps.

Abstract translation: 一种半导体器件的制造方法，其包括将半导体芯片安装在具有绝缘基板的电路板上，布置在所述绝缘基板上的多个布线层以及分别形成在所述布线层上的凸块， 相对应的一个布线层的纵向方向延伸到布线层的两侧的区域上并与绝缘基板的表面接触，而不形成在凸起的表面上的阶梯部分，并且横截面形状 在布线层的宽度方向上取得的隆起部使得中央部高于两侧部。 该方法还包括将半导体芯片的电极焊盘连接到凸块，从而通过凸块实现半导体芯片的电极焊盘与布线层之间的连接。

公开(公告)号：US5219055A

公开(公告)日：1993-06-15

申请号：US900948

申请日：1992-06-17

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: F16H61/14

CPC classification number: F16H61/143 ,  Y10T477/635

Abstract: A spool of a lock-up control valve has a first effective area exposed to a release pressure which is supplied to a release chamber of the lock-up clutch and a second larger effective area which is exposed to the apply pressure which is supplied to an apply chamber. When acceleration is demanded when the lock-up clutch is in one of slip or fully lock-up modes and a sudden demand for acceleration is made, the pressure differential between the apply and release pressures is reduced below the normal level for a predetermined period of time.

Abstract translation: 锁定控制阀的阀芯具有暴露于释放压力的第一有效区域，该有效区域被供应到锁止离合器的释放室，并且暴露于施加压力的第二较大有效区域，该有效区域被供应到 应用室。 当锁止离合器处于滑动或完全锁定模式之一并且急剧加速的需求时需要加速时，施加和释放压力之间的压力差降低到正常水平以下一段预定时间 时间。

公开(公告)号：US07833910B2

公开(公告)日：2010-11-16

申请号：US12230511

申请日：2008-08-29

Applicant: Hiroyuki Imamura

Inventor： Hiroyuki Imamura

IPC: H01L21/311

CPC classification number: H05K1/189 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/19043 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0281 ,  H05K1/111 ,  H05K1/117 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/243 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H05K2203/0574 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/05599

Abstract: In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.

Abstract translation: 在薄膜基材（1）和形成在薄膜基材（1）上的导体布线（23）的薄膜基板（FB）中，导体布线（23）布置成使外部的导体布线厚度 连接另一面板或基板的薄膜基板上的连接部分比其他位置的导体布线部分（弯曲部分）（25）的导体布线厚度厚。

公开(公告)号：US20100265665A1

公开(公告)日：2010-10-21

申请号：US12760219

申请日：2010-04-14

Applicant: Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

Inventor： Yukihiro Kozaka ,  Nobuyuki Koutani ,  Hiroyuki Imamura ,  Masanori Minamio

IPC: H05K7/20

CPC classification number: H05K7/20963 ,  H01L24/01 ,  H01L2924/01322 ,  H01L2924/00

Abstract: The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.

Abstract translation: 电子设备包括：散热器，其包括具有凹部的前表面; 放置在所述凹部中的与所述散热器接触的导热部件; 放置在所述凹部中的与所述导热部件接触的半导体元件; 电连接到半导体元件并放置在散热器的表面上的柔性基板; 以及底板部件，其具有前表面，散热器固定在该前表面上，以便在与前表面相对的后表面与散热器接触。

公开(公告)号：US07758326B2

公开(公告)日：2010-07-20

申请号：US11698865

申请日：2007-01-29

Applicant: Kazuyuki Fujimura ,  Takeshi Tsuchiya ,  Yuichi Yanagase ,  Makoto Aoki ,  Masashi Miyake ,  Mutsunori Matsunaga ,  Satoshi Nakamura ,  Masaru Ohtahara ,  Syuuji Hasegawa ,  Hiroyuki Imamura ,  Yoshinobu Yosuke ,  Kenji Tojo

Inventor： Kazuyuki Fujimura ,  Takeshi Tsuchiya ,  Yuichi Yanagase ,  Makoto Aoki ,  Masashi Miyake ,  Mutsunori Matsunaga ,  Satoshi Nakamura ,  Masaru Ohtahara ,  Syuuji Hasegawa ,  Hiroyuki Imamura ,  Yoshinobu Yosuke ,  Kenji Tojo

IPC: F01C1/02

CPC classification number: F04C27/005 ,  F04C18/0215 ,  F04C23/008

Abstract: A scroll fluid machine comprises compression chambers defined with an orbiting scroll orbiting relative to a fixed scroll, and a back pressure chamber provided on the face opposite from a wrap of the orbiting scroll. A back pressure port is provided, which is formed in an end-plate of the orbiting scroll and connects from a compression chamber side opening opened to a compression chamber side and to a back pressure chamber side opening opened to a back pressure chamber side. The compression chamber side opening is opened and closed by an end-plate of the fixed scroll according as the orbiting motion of the orbiting scroll to perform connection and blockage of the back pressure port. The flow resistance of fluid flowing in and out between the back pressure chamber and the compression chamber is reduced and the compression efficiency and reliability are improved.

Abstract translation: 涡旋流体机器包括压缩室，该压缩室限定有相对于固定涡旋件运动的绕动涡旋件，以及设置在与绕动涡旋件的涡卷相反的面上的背压室。 设置有背压端口，其形成在动涡旋盘的端板中，并且从压缩室侧开口与压缩室侧连接，并且向背压室侧开口侧设置背压室侧开口。 根据绕动涡卷的旋转运动，压缩室侧开口由固定涡旋盘的端板打开和关闭，以执行背压端口的连接和阻塞。 在背压室和压缩室之间流入和流出的流体的流动阻力降低，压缩效率和可靠性得到提高。

公开(公告)号：US20090020318A1

公开(公告)日：2009-01-22

申请号：US12283043

申请日：2008-09-09

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

IPC: H05K1/00

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.

Abstract translation: 提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。 电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起， 导电布线。 辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲 在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。 可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

公开(公告)号：US07439611B2

公开(公告)日：2008-10-21

申请号：US11534288

申请日：2006-09-22

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani ,  Yoshifumi Nakamura ,  Kenshi Tokushima

IPC: H01L23/495

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y02P70/611

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings. One end portion of the auxiliary conductive wiring is terminated at a position in the outside vicinity of the auxiliary bump in an outward direction of the region for mounting the semiconductor chip, and the auxiliary conductive wiring is bent at the other end portion positioned inside the auxiliary bump in an inward direction of the region for mounting the semiconductor chip, and connected to an end of the adjacent outermost conductive wiring. A break in the outermost conductive wiring, which is caused by concentrated stress at the time of joining the bumps of the circuit board and electrode pads of the semiconductor chip, can be suppressed.

Abstract translation: 提供一种电路板，包括柔性绝缘基板，在柔性绝缘基板上成对排列的多个导电布线，以及设置在位于用于安装半导体芯片的区域中的各个导电布线的端部处的凸块。 电路板还包括一个辅助导电布线，其位于用于安装半导体芯片的区域的最外角处，邻近于最外面的导电布线和外部的最外面的导电布线，以及形成在辅助导电布线上的辅助凸起， 导电布线。 辅助导电布线的一个端部在辅助凸块的外侧附近的位置处终止于用于安装半导体芯片的区域的向外方向上，并且辅助导电布线在位于辅助导体的内部的另一端部处弯曲 在用于安装半导体芯片的区域的向内方向上突起，并且连接到相邻的最外面的导电布线的端部。 可以抑制在接合电路板的凸块和半导体芯片的电极焊盘时的集中应力引起的最外面的导电布线的断裂。

公开(公告)号：US07285734B2

公开(公告)日：2007-10-23

申请号：US10833972

申请日：2004-04-27

Applicant: Hiroyuki Imamura ,  Nobuyuki Koutani

Inventor： Hiroyuki Imamura ,  Nobuyuki Koutani

IPC: H01L23/48

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09727 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.

Abstract translation: 电路板包括薄膜基板，在薄膜基板上依次布置的多个布线层和分别形成在布线层上的凸起。 每个凸块跨越相应的一个布线层的纵向方向设置，以便在绝缘基板上方的布线层的两侧的区域上延伸，并且沿宽度方向的凸起的横截面形状 布线层的中心部分高​​于中央部分两侧的部分。 因此，形成在布线层上的突起可以抵抗在横向施加的力而实际使用的强度。

公开(公告)号：US20070057369A1

公开(公告)日：2007-03-15

申请号：US11466843

申请日：2006-08-24

Applicant: Hiroyuki IMAMURA ,  Nozomi SHIMOISHIZAKA

Inventor： Hiroyuki IMAMURA ,  Nozomi SHIMOISHIZAKA

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/005 ,  H05K3/242 ,  H05K2201/09254 ,  H05K2201/09281 ,  H05K2201/09772 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/175 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring board includes: an insulating base; a plurality of conductive wirings; and bumps formed on the conductive wirings, respectively. The conductive wirings can be connected with electrode pads of a semiconductor element via the bumps. The conductive wirings include a connection terminal portion at an end portion opposite to the other end portion where the bumps are formed, and at the connection terminal portion, the conductive wirings can be connected with an external component. The conductive wirings include first conductive wirings and second conductive wirings, on which the bumps are formed respectively at a semiconductor element mounting region. The first conductive wirings extend from the bumps to the connection terminal portion. The second conductive wirings extend beyond the semiconductor element mounting region from the bumps but do not reach the connection terminal portion. End portions of the second conductive wirings extending beyond the semiconductor element mounting region are separated electrically from the first conductive wirings by a cutting portion formed at a boundary region with the first conductive wirings. Irrespective of the state of operating electrode pads of a semiconductor element to be mounted, the bumps can be arranged at constant intervals.

Abstract translation: 布线板包括：绝缘基底; 多个导电布线; 和形成在导电配线上的凸块。 导电布线可以通过凸块与半导体元件的电极焊盘连接。 导电布线包括在与形成凸块的另一端部相对的端部处的连接端子部分，并且在连接端子部分处，导电布线可以与外部部件连接。 导电布线包括第一导电布线和第二导电布线，凸块分别形成在半导体元件安装区域上。 第一导电布线从凸块延伸到连接端子部分。 第二导电布线从凸块延伸超出半导体元件安装区域，但不到达连接端子部分。 延伸超过半导体元件安装区域的第二导电配线的端部通过与第一导电布线形成在边界区域处的切割部分与第一导电布线电隔离。 不管要安装的半导体元件的操作电极焊盘的状态如何，可以以恒定的间隔布置凸点。