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公开(公告)号：US20150093844A1
公开(公告)日：2015-04-02
申请号：US14566782
申请日：2014-12-11
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsing-Kuo Hsia , Chih-Kuang Yu , Gordon Kuo
CPC classification number: H01L33/0079 , H01L21/0272 , H01L21/0331 , H01L33/0066 , H01L33/0095 , H01L33/32 , H01L33/38 , H01L33/60 , H01L51/0016 , H01L2933/0016 , H01L2933/0058
Abstract: Provided is a method of fabricating a light-emitting diode (LED) device. A wafer is provided. The wafer has a sapphire substrate and a semiconductor layer formed on the sapphire substrate. The semiconductor layer contains a plurality of un-separated LED dies. A photo-sensitive layer is formed over the semiconductor layer. A photolithography process is performed to pattern the photo-sensitive layer into a plurality of patterned portions. The patterned portions are separated by a plurality of openings that are each substantially aligned with one of the LED dies. A metal material is formed in each of the openings. The wafer is radiated in a localized manner such that only portions of the wafer that are substantially aligned with the openings are radiated. The sapphire substrate is removed along with un-radiated portions of the semiconductor layer, thereby separating the plurality of LED dies into individual LED dies.
Abstract translation: 提供一种制造发光二极管（LED）装置的方法。 提供晶片。 晶片具有形成在蓝宝石衬底上的蓝宝石衬底和半导体层。 半导体层包含多个未分离的LED管芯。 在半导体层上形成光敏层。 执行光刻工艺以将感光层图案化成多个图案部分。 图案化部分由多个开口分开，每个开口基本上与LED管芯中的一个对准。 在每个开口中形成金属材料。 以局部方式照射晶片，使得只有基本上与开口对准的晶片的部分被辐射。 蓝宝石衬底与半导体层的未辐射部分一起被去除，从而将多个LED管芯分离成单独的LED管芯。
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公开(公告)号：US20150085493A1
公开(公告)日：2015-03-26
申请号：US14558788
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Hsuan Sun , Hsiao-Wen Lee
CPC classification number: F21K9/232 , F21K9/90 , F21V3/00 , F21V29/773 , F21V29/83 , F21Y2115/10 , Y10T29/49117
Abstract: An apparatus includes a light-emitting device. A diffuser is disposed over the light-emitting device. A heat sink is disposed below, and thermally coupled to, the light-emitting device. The heat sink includes a body and a plurality of fins that radially protrude from the body of the heat sink. The fins define a plurality of ducts. A cover plate circumferentially surrounds the heat sink. The cover plate includes a plurality of openings that are disposed over the plurality of ducts, respectively.
Abstract translation: 一种装置包括发光装置。 扩散器设置在发光器件的上方。 散热器设置在发光装置的下方并热耦合到发光装置。 散热器包括主体和从散热体的主体径向突出的多个散热片。 翅片限定多个管道。 盖板周向地围绕散热器。 盖板包括分别设置在多个管道上的多个开口。
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公开(公告)号：US20150083998A1
公开(公告)日：2015-03-26
申请号：US14558798
申请日：2014-12-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Hsien Wu , Chyi Shyuan Chern , Chun-Lin Chang , Ching-Wen Hsiao , Kuang-Huan Hsu
CPC classification number: H01L33/22 , H01L21/2654 , H01L21/26546 , H01L21/26593 , H01L33/0025 , H01L33/06 , H01L33/32
Abstract: A light-emitting diode (LED) element includes a substrate and a GaN layer formed on the substrate. The GaN layer includes a boundary layer including a surface of the GaN opposing the substrate. The surface has a micro-roughening texture and a macro-roughening texture. The boundary layer includes at least one of As, Si, P, Ge, C, B, F, N, Sb, and Xe ions.
Abstract translation: 发光二极管（LED）元件包括衬底和形成在衬底上的GaN层。 GaN层包括边界层，其包括与衬底相对的GaN的表面。 表面具有微粗糙纹理和宏观粗糙纹理。 边界层包括As，Si，P，Ge，C，B，F，N，Sb和Xe离子中的至少一种。
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公开(公告)号：US20150078014A1
公开(公告)日：2015-03-19
申请号：US14549596
申请日：2014-11-21
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
CPC classification number: F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
Abstract: The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.
Abstract translation: 本公开提供了一种照明模块。 照明模块包括散热器，设置在散热器上方的板以及将散热器和板连接在一起的结合部件。 接合部件包含第一金属和第二金属的组合。 照明模块还包括设置在板上的光子照明装置。
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公开(公告)号：US08894249B2
公开(公告)日：2014-11-25
申请号：US14153347
申请日：2014-01-13
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Wei-Yu Yeh
CPC classification number: F21V19/005 , B23K20/002 , B23K20/10 , B23K2101/36 , F21V29/70 , H01L2924/0002 , H05K1/0203 , H05K1/05 , H05K3/0061 , H05K2201/10106 , H05K2203/0285 , H01L2924/00
Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
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Patent Agency Ranking
公开(公告)号：US08889439B2
公开(公告)日：2014-11-18
申请号：US13788536
申请日：2013-03-07
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L2933/0041
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 根据该方法，在胶带上设置多个LED。 粘合带设置在基板上。 在一些实施例中，衬底可以是玻璃衬底，硅衬底，陶瓷衬底和氮化镓衬底。 磷光体层被涂覆在多个LED上。 然后将磷光体层固化。 在荧光体层固化之后去除胶带和基材。 然后将替代胶带附接到多个LED。 然后在去除衬底之后，对多个LED进行切割处理。 然后可以将去除的衬底重新用于将来的LED封装工艺。
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公开(公告)号：US20140319318A1
公开(公告)日：2014-10-30
申请号：US14334709
申请日：2014-07-18
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Hsin-Chieh Huang
CPC classification number: H05B41/36 , G01J1/44 , H05B33/0851 , H05B37/0218 , Y02B20/46
Abstract: A system having a light guide adapted to collect light from a light source, a light detector attached to the light guide, a controller electrically connected to an output of the light detector, and a driver for driving the light source detachably connected to an output of the controller. The driver includes a memory that stores a calibration value for the light source.
Abstract translation: 一种具有适于收集来自光源的光的导光体的系统，安装在光导上的光检测器，与光检测器的输出电连接的控制器，以及用于驱动可拆卸地连接到光检测器的输出的光源的驱动器 控制器。 驱动器包括存储光源的校准值的存储器。
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公开(公告)号：US20140247578A1
公开(公告)日：2014-09-04
申请号：US14284491
申请日：2014-05-22
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Ching-Yi Chen , Yu-Sheng Tang , Hao-Yu Yang , Hsin-Hung Chen , Tzu-Wen Shih
CPC classification number: H01L33/58 , F21K9/64 , F21V13/02 , F21V13/14 , H01L25/0753 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2924/00 , H01L2924/00012
Abstract: A lighting apparatus includes a substrate. One or more light-emitting devices are disposed over the substrate. A lens is molded over the substrate and over the one or more light-emitting devices. A recess is disposed in the lens. The recess circumferentially surrounds the one or more light-emitting devices in a top view. The recess is at least partially filled with phosphor particles.
Abstract translation: 照明装置包括基板。 一个或多个发光器件设置在衬底上。 在基板上并在一个或多个发光器件上模制透镜。 在透镜中设置凹部。 在俯视图中，该凹部周向地包围一个或多个发光器件。 该凹部至少部分地被磷光体颗粒填充。
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公开(公告)号：US20140231836A1
公开(公告)日：2014-08-21
申请号：US14261892
申请日：2014-04-25
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
CPC classification number: H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.
Abstract translation: 本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。 荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。
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公开(公告)号：US20140209930A1
公开(公告)日：2014-07-31
申请号：US13750097
申请日：2013-01-25
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Jui-Ping Weng , Hsiao-Wen Lee , Chun-Chih Chang , Min-Sheng Wu , Hsin-Hsien Lee
CPC classification number: H01L33/50 , H01L25/0753 , H01L27/15 , H01L27/153 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.
Abstract translation: 本公开涉及一种发光二极管（LED）封装结构。 LED封装结构包括具有衬底的基座和在衬底上的多个接合焊盘。 LED封装结构包括通过接合焊盘的第一子集结合到衬底的多个p型LED。 LED封装结构包括通过接合焊盘的第二子集结合到衬底的多个n型LED。 一些接合焊盘属于接合焊盘的第一子集和第二子集。 p型LED和n型LED布置为交替对。 LED封装结构包括多个透明和导电部件，每个透明和导电部件设置在一对p型和n型LED中的一个上并使其互连。 LED封装结构包括设置在n型LED和p型LED上的一个或多个透镜。
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