Apparatus and method for validating leak survey results

    公开(公告)号:US09726543B2

    公开(公告)日:2017-08-08

    申请号:US14719229

    申请日:2015-05-21

    Inventor: Yousheng Zeng

    Abstract: An apparatus and method for validating a leak survey result obtained from an Optical Gas Imaging (OGI) device is proposed. The validation system is coupled to a gas detection infrared thermography camera that captures the infrared image of a scene which may or may not include a gas plume. The validation system performs operations to validate the leak survey result, which includes acquiring a background temperature of each pixel of the infrared image of the scene, acquiring a temperature of the gas plume or ambient air from a temperature sensor that is coupled to the validation system, calculating a temperature difference of said each pixel between the background temperature of said each pixel and the temperature of the gas plume or ambient air, comparing the temperature difference of said each pixel to a predetermined threshold value, and determining whether the leak survey result of the infrared thermography camera is valid based on the temperature difference of said each pixel.

    Emissivity independent optical pyrometer

    公开(公告)号:US09612160B2

    公开(公告)日:2017-04-04

    申请号:US14072380

    申请日:2013-11-05

    Abstract: Disclosed herein are representative embodiments of methods, apparatus, and systems for determining the temperature of an object using an optical pyrometer. Certain embodiments of the disclosed technology allow for making optical temperature measurements that are independent of the surface emissivity of the object being sensed. In one of the exemplary embodiments disclosed herein, a plurality of spectral radiance measurements at a plurality of wavelengths is received from a surface of an object being measured. The plurality of the spectral radiance measurements is fit to a scaled version of a black body curve, the fitting comprising determining a temperature of the scaled version of the black body curve. The temperature is then output. The present disclosure is not to be construed as limiting and is instead directed toward all novel and nonobvious features and aspects of the various disclosed embodiments, alone or in various combinations and subcombinations with one another.

    Apparatus and methods for continuous temperature measurement of molten metals
    16.
    发明授权
    Apparatus and methods for continuous temperature measurement of molten metals 有权
    用于连续测量熔融金属的装置和方法

    公开(公告)号:US09546909B2

    公开(公告)日:2017-01-17

    申请号:US14766595

    申请日:2014-02-07

    Applicant: Jyoti Goda

    Inventor: Jyoti Goda

    Abstract: Optical probes and methods for continuously measuring the temperature of molten metals in vessels are described. The optical probe may include a fiber surrounded by a protective structure that is mounted in a wall of a vessel. The protective structure may include a porous body for flowing gas through the optical probe assembly. A portion of the optical probe may be sacrificial and erode or break away during temperature measurements. Calibrations may be used to correct temperature measurements based on an amount of erosion or removal of the optical fiber.

    Abstract translation: 描述了用于连续测量容器中熔融金属温度的光学探针和方法。 光学探针可以包括由安装在容器的壁中的保护结构包围的纤维。 保护结构可以包括用于使气体流过光学探针组件的多孔体。 在温度测量期间,光学探针的一部分可能是牺牲性的并被腐蚀或脱落。 可以使用校准来校正基于光纤的侵蚀或去除量的温度测量。

    Process temperature measurement using infrared detector
    18.
    发明授权
    Process temperature measurement using infrared detector 有权
    使用红外探测器进行过程温度测量

    公开(公告)号:US09488527B2

    公开(公告)日:2016-11-08

    申请号:US14224858

    申请日:2014-03-25

    Applicant: Rosemount Inc.

    Inventor: Jason Harold Rud

    Abstract: A process variable transmitter for measuring a temperature in an industrial process includes an infrared detector arranged to receive infrared radiation from a component in the industrial process. A memory contains temperature characterization information which relates the infrared radiation received from the component with an internal temperature of the component. Measurement circuitry is configured to determine the internal temperature of the component based upon the received infrared radiation from the component and the temperature characterization information.

    Abstract translation: 用于测量工业过程中的温度的过程变量发射器包括布置成在工业过程中从部件接收红外辐射的红外检测器。 存储器包含温度表征信息,其将从部件接收的红外辐射与部件的内部温度相关联。 测量电路被配置为基于来自组件的接收到的红外辐射和温度表征信息来确定组件的内部温度。

    Flame detectors and testing methods
    19.
    发明授权
    Flame detectors and testing methods 有权
    火焰探测器和测试方法

    公开(公告)号:US09459142B1

    公开(公告)日:2016-10-04

    申请号:US14850672

    申请日:2015-09-10

    Abstract: Exemplary embodiments of a flame detector and operating method. Optical energy is received at one or more optical sensors, and the detector processes the energy to determine whether the received energy is from a known remote test source. If so, the flame detector is operated in a test mode. If the processing indicates that the received optical energy is not a test signal, the flame detector is operated in a flame detection operating mode. The detector processing uses an artificial neural network in an exemplary embodiment in the flame detection operation mode.

    Abstract translation: 火焰探测器和操作方法的示例性实施例。 在一个或多个光学传感器处接收光能,并且检测器处理能量以确定接收到的能量是否来自已知的远程测试源。 如果是这样,则火焰探测器在测试模式下运行。 如果处理指示接收到的光能不是测试信号,则火焰检测器在火焰检测操作模式下操作。 检测器处理在火焰检测操作模式的示例性实施例中使用人造神经网络。

    Infrared sensor structure and method

    公开(公告)号:US09417133B2

    公开(公告)日:2016-08-16

    申请号:US14073636

    申请日:2013-11-06

    Abstract: A radiation sensor (27) includes a radiation sensor chip (1) including first (7) and second (8) thermopile junctions connected to form a thermopile (7,8). The first thermopile junction is disposed in a floating portion of a dielectric membrane (3) thermally insulated from a silicon substrate (2) of the chip, and the second thermopile junction is disposed in the dielectric membrane directly adjacent to the substrate. Bump conductors (28) are bonded to corresponding bonding pads (28A) coupled to the thermopile (7,8) to physically and electrically connect the chip to conductors on a printed circuit board (23). The silicon substrate transmits infrared radiation to the thermopile while blocking visible light.

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